JP4688363B2 - ウエハ加熱装置 - Google Patents

ウエハ加熱装置 Download PDF

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Publication number
JP4688363B2
JP4688363B2 JP2001230874A JP2001230874A JP4688363B2 JP 4688363 B2 JP4688363 B2 JP 4688363B2 JP 2001230874 A JP2001230874 A JP 2001230874A JP 2001230874 A JP2001230874 A JP 2001230874A JP 4688363 B2 JP4688363 B2 JP 4688363B2
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JP
Japan
Prior art keywords
glass
wafer
heating resistor
temperature
soaking plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001230874A
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English (en)
Japanese (ja)
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JP2003045618A (ja
JP2003045618A5 (https=
Inventor
広治 坂元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2001230874A priority Critical patent/JP4688363B2/ja
Publication of JP2003045618A publication Critical patent/JP2003045618A/ja
Publication of JP2003045618A5 publication Critical patent/JP2003045618A5/ja
Application granted granted Critical
Publication of JP4688363B2 publication Critical patent/JP4688363B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2001230874A 2001-07-31 2001-07-31 ウエハ加熱装置 Expired - Fee Related JP4688363B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001230874A JP4688363B2 (ja) 2001-07-31 2001-07-31 ウエハ加熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001230874A JP4688363B2 (ja) 2001-07-31 2001-07-31 ウエハ加熱装置

Publications (3)

Publication Number Publication Date
JP2003045618A JP2003045618A (ja) 2003-02-14
JP2003045618A5 JP2003045618A5 (https=) 2005-06-09
JP4688363B2 true JP4688363B2 (ja) 2011-05-25

Family

ID=19063006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001230874A Expired - Fee Related JP4688363B2 (ja) 2001-07-31 2001-07-31 ウエハ加熱装置

Country Status (1)

Country Link
JP (1) JP4688363B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4535242B2 (ja) * 2004-04-13 2010-09-01 Ｈｏｙａ株式会社 熱処理評価方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02174116A (ja) * 1988-12-26 1990-07-05 Toshiba Ceramics Co Ltd サセプタ
JP3588227B2 (ja) * 1997-05-28 2004-11-10 京セラ株式会社 セラミックヒータ
JP3865973B2 (ja) * 1999-06-29 2007-01-10 京セラ株式会社 ウエハ加熱装置
JP2001203245A (ja) * 1999-08-30 2001-07-27 Ibiden Co Ltd ウエハプローバおよびウエハプーバに使用されるセラミック基板

Also Published As

Publication number Publication date
JP2003045618A (ja) 2003-02-14

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