JP4647378B2 - 乾燥装置 - Google Patents
乾燥装置 Download PDFInfo
- Publication number
- JP4647378B2 JP4647378B2 JP2005122555A JP2005122555A JP4647378B2 JP 4647378 B2 JP4647378 B2 JP 4647378B2 JP 2005122555 A JP2005122555 A JP 2005122555A JP 2005122555 A JP2005122555 A JP 2005122555A JP 4647378 B2 JP4647378 B2 JP 4647378B2
- Authority
- JP
- Japan
- Prior art keywords
- dry air
- cleaned
- drying
- air discharge
- discharge means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001035 drying Methods 0.000 title claims description 90
- 239000007788 liquid Substances 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 2
- 239000007921 spray Substances 0.000 description 19
- 238000009826 distribution Methods 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B13/00—Machines and apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement
- F26B13/10—Arrangements for feeding, heating or supporting materials; Controlling movement, tension or position of materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
- F26B15/10—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions
- F26B15/12—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Textile Engineering (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Liquid Crystal (AREA)
Description
2 架台
3 タンク
4 搬入口
5 排出口
6 搬送ローラ
7 乾燥箱
8 入口
9 出口
10 リニア駆動装置
11 ノズルブラケット
12 スプレーノズル
13 分配チューブ
14 コイルチューブ
15 スリット
16 エアカーテンノズル
17 エアカーテンスリット
18 充填用スプレーノズル
Claims (6)
- 液体洗浄後の被洗浄物を搬送する搬送路に設置され、前記被洗浄物が通過するための入口と出口とを備えた密閉乾燥箱と、前記乾燥箱の中に設置され、前記搬送路を通る被洗浄物に向けてドライエアを吐出するドライエア吐出手段とを備えた乾燥装置において、
前記ドライエア吐出手段を前記被洗浄物の表面に平行で且つ前記被洗浄物の搬送方向に直交する方向に直線的に移動させるリニア駆動装置が設けられ、前記ドライエア吐出手段の吐出口が前記搬送方向に長く延びたスリットで構成されていることを特徴とする乾燥装置。 - 前記ドライエア吐出手段が、前記搬送方向に直交する方向に並んで配置された複数のノズルで構成されていることを特徴とする請求項1に記載の乾燥装置。
- 前記ドライエア吐出手段が、前記搬送方向に直交する方向に並んで配置された複数のノズルを、搬送方向に複数列配置したノズルで構成されていることを特徴とする請求項1に記載の乾燥装置。
- 前記ドライエア吐出手段が、前記被洗浄物を挟んで上下に設けられている、ことを特徴とする請求項1に記載の乾燥装置。
- 前記乾燥箱の入口及び出口に第2のドライエア吐出手段が更に設けられ、前記第2のドライエア吐出手段は、前記搬送方向に直交する方向に少なくとも被洗浄物の幅だけ延びたスリットを有する一対のノズルで構成され、前記ノズルの対向する面は、内縁の間隔が外縁の間隔よりも大きくなるように内縁から外縁にかけて傾斜している、ことを特徴とする請求項1に記載の乾燥装置。
- 前記乾燥箱に乾燥空気を充填するための第3のドライエア吐出手段が更に設けられ、前記第3のドライエア吐出手段の吐出口が、前記リニア駆動装置に向けて設置されていることを特徴とする請求項5に記載の乾燥装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005122555A JP4647378B2 (ja) | 2005-04-20 | 2005-04-20 | 乾燥装置 |
CNB2006800132907A CN100549606C (zh) | 2005-04-20 | 2006-03-30 | 干燥装置 |
PCT/JP2006/306672 WO2006114982A1 (ja) | 2005-04-20 | 2006-03-30 | 乾燥装置 |
KR1020077023865A KR100938639B1 (ko) | 2005-04-20 | 2006-03-30 | 건조 장치 |
US11/975,570 US7788822B2 (en) | 2005-04-20 | 2007-10-19 | Drying apparatus |
HK08110907.3A HK1119459A1 (en) | 2005-04-20 | 2008-09-30 | Drying device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005122555A JP4647378B2 (ja) | 2005-04-20 | 2005-04-20 | 乾燥装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006300409A JP2006300409A (ja) | 2006-11-02 |
JP4647378B2 true JP4647378B2 (ja) | 2011-03-09 |
Family
ID=37214610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005122555A Expired - Fee Related JP4647378B2 (ja) | 2005-04-20 | 2005-04-20 | 乾燥装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7788822B2 (ja) |
JP (1) | JP4647378B2 (ja) |
KR (1) | KR100938639B1 (ja) |
CN (1) | CN100549606C (ja) |
HK (1) | HK1119459A1 (ja) |
WO (1) | WO2006114982A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013148221A (ja) * | 2010-05-11 | 2013-08-01 | Sharp Corp | クリーンルーム |
TWI522589B (zh) * | 2011-07-08 | 2016-02-21 | 友達光電股份有限公司 | 乾燥設備及乾燥方法 |
CN103808114B (zh) * | 2014-02-26 | 2016-01-13 | 江苏安博瑞新材料有限公司 | 一种铝箔的烘干系统及其烘干方法 |
CN106546088A (zh) * | 2015-09-16 | 2017-03-29 | 泰科电子(上海)有限公司 | 风干系统 |
CN106730946A (zh) * | 2017-02-27 | 2017-05-31 | 四川德成动物保健品有限公司 | 具有倾斜干燥板的中药醇提取液干燥回收设备 |
CN112113405A (zh) * | 2019-06-21 | 2020-12-22 | 孔书艳 | 一种电子产品生产用高效烘干装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6281718A (ja) * | 1985-10-07 | 1987-04-15 | Oki Electric Ind Co Ltd | 基板乾燥装置 |
JPH02152501A (ja) * | 1988-12-02 | 1990-06-12 | Okawara Mfg Co Ltd | 真空乾燥機における被乾燥材料の供給方法 |
JPH0334917B2 (ja) * | 1986-12-11 | 1991-05-24 | Hisaka Works Ltd | |
JPH0536660A (ja) * | 1991-07-30 | 1993-02-12 | Tokyo Electron Ltd | 基板乾燥装置 |
JPH09113138A (ja) * | 1995-10-12 | 1997-05-02 | Konica Corp | 乾燥装置 |
JPH10156255A (ja) * | 1996-11-27 | 1998-06-16 | Tokyo Electron Ltd | 塗布膜形成装置 |
JPH10170901A (ja) * | 1996-12-06 | 1998-06-26 | Hitachi Electron Eng Co Ltd | 基板のスピン乾燥装置及びスピン乾燥方法 |
JPH11316084A (ja) * | 1998-05-01 | 1999-11-16 | Create Sangyo Kk | 乾燥装置および洗浄を含む乾燥システム |
JP2003240435A (ja) * | 2002-02-18 | 2003-08-27 | Kyowa Kako Kk | 高速乾燥装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4292745A (en) * | 1978-08-29 | 1981-10-06 | Caratsch Hans Peter | Air foil nozzle dryer |
JPH0624673B2 (ja) * | 1987-11-06 | 1994-04-06 | 富士写真フイルム株式会社 | 帯状体の塗膜連続乾燥装置 |
EP1054457B1 (en) * | 1999-05-20 | 2010-08-04 | Kaneka Corporation | Method and apparatus for manufacturing a semiconductor device |
US6421932B2 (en) * | 2000-02-14 | 2002-07-23 | Hitachi Electronics Engineering Co., Ltd. | Method and apparatus for drying substrate plates |
JP2003082573A (ja) * | 2001-09-07 | 2003-03-19 | Hirano Tecseed Co Ltd | ウエブの熱処理装置 |
CN2682352Y (zh) * | 2004-03-31 | 2005-03-02 | 郑友林 | 除水机 |
-
2005
- 2005-04-20 JP JP2005122555A patent/JP4647378B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-30 WO PCT/JP2006/306672 patent/WO2006114982A1/ja active Application Filing
- 2006-03-30 CN CNB2006800132907A patent/CN100549606C/zh not_active Expired - Fee Related
- 2006-03-30 KR KR1020077023865A patent/KR100938639B1/ko not_active IP Right Cessation
-
2007
- 2007-10-19 US US11/975,570 patent/US7788822B2/en not_active Expired - Fee Related
-
2008
- 2008-09-30 HK HK08110907.3A patent/HK1119459A1/xx not_active IP Right Cessation
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6281718A (ja) * | 1985-10-07 | 1987-04-15 | Oki Electric Ind Co Ltd | 基板乾燥装置 |
JPH0334917B2 (ja) * | 1986-12-11 | 1991-05-24 | Hisaka Works Ltd | |
JPH02152501A (ja) * | 1988-12-02 | 1990-06-12 | Okawara Mfg Co Ltd | 真空乾燥機における被乾燥材料の供給方法 |
JP2764289B2 (ja) * | 1988-12-02 | 1998-06-11 | 株式会社大川原製作所 | 真空乾燥機における被乾燥材料の供給方法 |
JPH0536660A (ja) * | 1991-07-30 | 1993-02-12 | Tokyo Electron Ltd | 基板乾燥装置 |
JPH09113138A (ja) * | 1995-10-12 | 1997-05-02 | Konica Corp | 乾燥装置 |
JPH10156255A (ja) * | 1996-11-27 | 1998-06-16 | Tokyo Electron Ltd | 塗布膜形成装置 |
JPH10170901A (ja) * | 1996-12-06 | 1998-06-26 | Hitachi Electron Eng Co Ltd | 基板のスピン乾燥装置及びスピン乾燥方法 |
JPH11316084A (ja) * | 1998-05-01 | 1999-11-16 | Create Sangyo Kk | 乾燥装置および洗浄を含む乾燥システム |
JP2003240435A (ja) * | 2002-02-18 | 2003-08-27 | Kyowa Kako Kk | 高速乾燥装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2006114982A1 (ja) | 2006-11-02 |
US7788822B2 (en) | 2010-09-07 |
CN101163936A (zh) | 2008-04-16 |
US20080052949A1 (en) | 2008-03-06 |
JP2006300409A (ja) | 2006-11-02 |
CN100549606C (zh) | 2009-10-14 |
HK1119459A1 (en) | 2009-03-06 |
KR100938639B1 (ko) | 2010-01-22 |
KR20070120541A (ko) | 2007-12-24 |
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