HK1119459A1 - Drying device - Google Patents

Drying device

Info

Publication number
HK1119459A1
HK1119459A1 HK08110907.3A HK08110907A HK1119459A1 HK 1119459 A1 HK1119459 A1 HK 1119459A1 HK 08110907 A HK08110907 A HK 08110907A HK 1119459 A1 HK1119459 A1 HK 1119459A1
Authority
HK
Hong Kong
Prior art keywords
drying device
drying
Prior art date
Application number
HK08110907.3A
Other languages
English (en)
Inventor
Toshinori Takemori
Original Assignee
Kyowa Kako Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyowa Kako Co Ltd filed Critical Kyowa Kako Co Ltd
Publication of HK1119459A1 publication Critical patent/HK1119459A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B15/00—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form
    • F26B15/10—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions
    • F26B15/12—Machines or apparatus for drying objects with progressive movement; Machines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound, the movement being in alternate horizontal and vertical directions the lines being all horizontal or slightly inclined
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B13/00—Machines and apparatus for drying fabrics, fibres, yarns, or other materials in long lengths, with progressive movement
    • F26B13/10—Arrangements for feeding, heating or supporting materials; Controlling movement, tension or position of materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Textile Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
HK08110907.3A 2005-04-20 2008-09-30 Drying device HK1119459A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005122555A JP4647378B2 (ja) 2005-04-20 2005-04-20 乾燥装置
PCT/JP2006/306672 WO2006114982A1 (ja) 2005-04-20 2006-03-30 乾燥装置

Publications (1)

Publication Number Publication Date
HK1119459A1 true HK1119459A1 (en) 2009-03-06

Family

ID=37214610

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08110907.3A HK1119459A1 (en) 2005-04-20 2008-09-30 Drying device

Country Status (6)

Country Link
US (1) US7788822B2 (ja)
JP (1) JP4647378B2 (ja)
KR (1) KR100938639B1 (ja)
CN (1) CN100549606C (ja)
HK (1) HK1119459A1 (ja)
WO (1) WO2006114982A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013148221A (ja) * 2010-05-11 2013-08-01 Sharp Corp クリーンルーム
TWI522589B (zh) * 2011-07-08 2016-02-21 友達光電股份有限公司 乾燥設備及乾燥方法
CN103808114B (zh) * 2014-02-26 2016-01-13 江苏安博瑞新材料有限公司 一种铝箔的烘干系统及其烘干方法
CN106546088A (zh) * 2015-09-16 2017-03-29 泰科电子(上海)有限公司 风干系统
CN106730946A (zh) * 2017-02-27 2017-05-31 四川德成动物保健品有限公司 具有倾斜干燥板的中药醇提取液干燥回收设备
CN112113405A (zh) * 2019-06-21 2020-12-22 孔书艳 一种电子产品生产用高效烘干装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4292745A (en) * 1978-08-29 1981-10-06 Caratsch Hans Peter Air foil nozzle dryer
JPS6281718A (ja) * 1985-10-07 1987-04-15 Oki Electric Ind Co Ltd 基板乾燥装置
JPS63148967A (ja) * 1986-12-11 1988-06-21 Hisaka Works Ltd 真空ベルト乾燥機
JPH0624673B2 (ja) * 1987-11-06 1994-04-06 富士写真フイルム株式会社 帯状体の塗膜連続乾燥装置
JP2764289B2 (ja) * 1988-12-02 1998-06-11 株式会社大川原製作所 真空乾燥機における被乾燥材料の供給方法
JPH0536660A (ja) * 1991-07-30 1993-02-12 Tokyo Electron Ltd 基板乾燥装置
JPH09113138A (ja) * 1995-10-12 1997-05-02 Konica Corp 乾燥装置
JP3245813B2 (ja) * 1996-11-27 2002-01-15 東京エレクトロン株式会社 塗布膜形成装置
JPH10170901A (ja) * 1996-12-06 1998-06-26 Hitachi Electron Eng Co Ltd 基板のスピン乾燥装置及びスピン乾燥方法
JP3939020B2 (ja) * 1998-05-01 2007-06-27 クリエート産業株式会社 乾燥装置および洗浄を含む乾燥システム
EP1054457B1 (en) * 1999-05-20 2010-08-04 Kaneka Corporation Method and apparatus for manufacturing a semiconductor device
US6421932B2 (en) * 2000-02-14 2002-07-23 Hitachi Electronics Engineering Co., Ltd. Method and apparatus for drying substrate plates
JP2003082573A (ja) * 2001-09-07 2003-03-19 Hirano Tecseed Co Ltd ウエブの熱処理装置
JP3887570B2 (ja) * 2002-02-18 2007-02-28 協和化工株式会社 高速乾燥装置
CN2682352Y (zh) * 2004-03-31 2005-03-02 郑友林 除水机

Also Published As

Publication number Publication date
KR20070120541A (ko) 2007-12-24
WO2006114982A1 (ja) 2006-11-02
CN101163936A (zh) 2008-04-16
CN100549606C (zh) 2009-10-14
JP2006300409A (ja) 2006-11-02
KR100938639B1 (ko) 2010-01-22
US7788822B2 (en) 2010-09-07
JP4647378B2 (ja) 2011-03-09
US20080052949A1 (en) 2008-03-06

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170330