JP4642437B2 - バーンインシステム用の冷却空気流量制御装置 - Google Patents

バーンインシステム用の冷却空気流量制御装置 Download PDF

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Publication number
JP4642437B2
JP4642437B2 JP2004330394A JP2004330394A JP4642437B2 JP 4642437 B2 JP4642437 B2 JP 4642437B2 JP 2004330394 A JP2004330394 A JP 2004330394A JP 2004330394 A JP2004330394 A JP 2004330394A JP 4642437 B2 JP4642437 B2 JP 4642437B2
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Japan
Prior art keywords
valve
tray
burn
opening
cooling air
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Expired - Fee Related
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JP2004330394A
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Japanese (ja)
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JP2005148070A (ja
JP2005148070A5 (https=
Inventor
イー． ハミルトン ハロルド
エム． コンロイ チャド
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マイクロ コントロール カンパニー
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

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  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Furnace Details (AREA)
JP2004330394A 2003-11-14 2004-11-15 バーンインシステム用の冷却空気流量制御装置 Expired - Fee Related JP4642437B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/714,116 US7296430B2 (en) 2003-11-14 2003-11-14 Cooling air flow control valve for burn-in system

Publications (3)

Publication Number Publication Date
JP2005148070A JP2005148070A (ja) 2005-06-09
JP2005148070A5 JP2005148070A5 (https=) 2007-11-29
JP4642437B2 true JP4642437B2 (ja) 2011-03-02

Family

ID=34573897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004330394A Expired - Fee Related JP4642437B2 (ja) 2003-11-14 2004-11-15 バーンインシステム用の冷却空気流量制御装置

Country Status (4)

Country Link
US (2) US7296430B2 (https=)
JP (1) JP4642437B2 (https=)
KR (1) KR100937728B1 (https=)
TW (1) TWI346783B (https=)

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* Cited by examiner, † Cited by third party
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US11353498B2 (en) * 2020-02-06 2022-06-07 Hongbang Automation Co., Ltd. Feedback burn-in device of burn-in oven

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JP4814132B2 (ja) * 2007-03-20 2011-11-16 ダイトロンテクノロジー株式会社 半導体素子の検査装置
JP4886580B2 (ja) * 2007-04-16 2012-02-29 エスペック株式会社 バーンイン試験装置
KR100892937B1 (ko) * 2007-08-07 2009-04-09 주식회사 피에스티 냉각 장치
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
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JP5749240B2 (ja) * 2012-12-04 2015-07-15 株式会社九州日昌 恒温装置
US9459312B2 (en) * 2013-04-10 2016-10-04 Teradyne, Inc. Electronic assembly test system
TW201611143A (zh) * 2014-09-03 2016-03-16 Hsinho Advanced Technology Inc 預燒系統之冷卻氣流控制閘門機構
KR20160059691A (ko) * 2014-11-19 2016-05-27 삼성전자주식회사 전자 디바이스 테스트 장치
TWI729056B (zh) * 2016-01-08 2021-06-01 美商艾爾測試系統 測試器設備及測試微電子裝置的方法
EP4632390A3 (en) 2017-03-03 2026-01-14 AEHR Test Systems Electronics tester
TWI639844B (zh) * 2017-08-25 2018-11-01 鴻勁精密股份有限公司 電子元件預燒測試裝置及其應用之預燒爐
TWI659484B (zh) * 2018-03-15 2019-05-11 鴻勁精密股份有限公司 具導風機構之電子元件預燒設備
WO2020159954A1 (en) * 2019-01-29 2020-08-06 Kes Systems, Inc. Test and burn-in apparatus that provides variable thermal resistance
CN118226177A (zh) * 2019-06-19 2024-06-21 泰克元有限公司 测试腔室
TWI839362B (zh) * 2019-07-09 2024-04-21 智邦科技股份有限公司 燒機測試室
TWI726668B (zh) * 2020-03-31 2021-05-01 矽品精密工業股份有限公司 散熱組件
US11493551B2 (en) 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
TWI885209B (zh) 2020-09-16 2025-06-01 美商微控公司 具有可密封腔室的半導體燒機爐及其操作方法
US11549981B2 (en) 2020-10-01 2023-01-10 Advantest Test Solutions, Inc. Thermal solution for massively parallel testing
CN120254561B (zh) * 2020-10-07 2026-03-03 雅赫测试系统公司 电子测试器
KR102817101B1 (ko) 2020-10-21 2025-06-05 마이크로 콘트롤 컴파니 번인 보드 안착부
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US12320841B2 (en) 2020-11-19 2025-06-03 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11567119B2 (en) 2020-12-04 2023-01-31 Advantest Test Solutions, Inc. Testing system including active thermal interposer device
US11573262B2 (en) 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures
US12235314B2 (en) 2021-09-14 2025-02-25 Advantest Test Solutions, Inc Parallel test cell with self actuated sockets
KR102913963B1 (ko) * 2021-11-03 2026-01-16 에스케이하이닉스 주식회사 반도체 테스트 장치 및 이를 구동하는 방법
US11656273B1 (en) 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems
US12411167B2 (en) 2022-01-26 2025-09-09 Advantest Test Solutions, Inc. Tension-based socket gimbal for engaging device under test with thermal array
US11835549B2 (en) 2022-01-26 2023-12-05 Advantest Test Solutions, Inc. Thermal array with gimbal features and enhanced thermal performance
CN115235282B (zh) * 2022-09-22 2022-12-02 四川恩巨实业有限公司 一种老化系统及其控制方法
JP2026501645A (ja) 2022-12-30 2026-01-16 エイアー テスト システムズ 電子試験器

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11353498B2 (en) * 2020-02-06 2022-06-07 Hongbang Automation Co., Ltd. Feedback burn-in device of burn-in oven

Also Published As

Publication number Publication date
JP2005148070A (ja) 2005-06-09
US7650762B2 (en) 2010-01-26
US20050103034A1 (en) 2005-05-19
KR100937728B1 (ko) 2010-01-20
TW200521443A (en) 2005-07-01
KR20050046613A (ko) 2005-05-18
US7296430B2 (en) 2007-11-20
US20080053123A1 (en) 2008-03-06
TWI346783B (en) 2011-08-11

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