TWI346783B - Cooling air flow control for burn-in system - Google Patents

Cooling air flow control for burn-in system

Info

Publication number
TWI346783B
TWI346783B TW093129848A TW93129848A TWI346783B TW I346783 B TWI346783 B TW I346783B TW 093129848 A TW093129848 A TW 093129848A TW 93129848 A TW93129848 A TW 93129848A TW I346783 B TWI346783 B TW I346783B
Authority
TW
Taiwan
Prior art keywords
burn
air flow
flow control
cooling air
cooling
Prior art date
Application number
TW093129848A
Other languages
English (en)
Chinese (zh)
Other versions
TW200521443A (en
Inventor
Harold E Hamilton
Chad M Conroy
Original Assignee
Micro Control Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micro Control Company filed Critical Micro Control Company
Publication of TW200521443A publication Critical patent/TW200521443A/zh
Application granted granted Critical
Publication of TWI346783B publication Critical patent/TWI346783B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2862—Chambers or ovens; Tanks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Furnace Details (AREA)
TW093129848A 2003-11-14 2004-10-01 Cooling air flow control for burn-in system TWI346783B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/714,116 US7296430B2 (en) 2003-11-14 2003-11-14 Cooling air flow control valve for burn-in system

Publications (2)

Publication Number Publication Date
TW200521443A TW200521443A (en) 2005-07-01
TWI346783B true TWI346783B (en) 2011-08-11

Family

ID=34573897

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093129848A TWI346783B (en) 2003-11-14 2004-10-01 Cooling air flow control for burn-in system

Country Status (4)

Country Link
US (2) US7296430B2 (https=)
JP (1) JP4642437B2 (https=)
KR (1) KR100937728B1 (https=)
TW (1) TWI346783B (https=)

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JP4814132B2 (ja) * 2007-03-20 2011-11-16 ダイトロンテクノロジー株式会社 半導体素子の検査装置
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KR100892937B1 (ko) * 2007-08-07 2009-04-09 주식회사 피에스티 냉각 장치
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
US8272780B1 (en) * 2009-08-21 2012-09-25 Rantec Power Systems, Inc. Multiple-unit thermal test apparatus for electrical devices
TWM410331U (en) * 2011-02-10 2011-08-21 King Yuan Electronics Co Ltd Improved structure of a burn-in oven
JP5805615B2 (ja) * 2012-12-04 2015-11-04 株式会社九州日昌 恒温器具
JP5749240B2 (ja) * 2012-12-04 2015-07-15 株式会社九州日昌 恒温装置
US9459312B2 (en) * 2013-04-10 2016-10-04 Teradyne, Inc. Electronic assembly test system
TW201611143A (zh) * 2014-09-03 2016-03-16 Hsinho Advanced Technology Inc 預燒系統之冷卻氣流控制閘門機構
KR20160059691A (ko) * 2014-11-19 2016-05-27 삼성전자주식회사 전자 디바이스 테스트 장치
TWI729056B (zh) * 2016-01-08 2021-06-01 美商艾爾測試系統 測試器設備及測試微電子裝置的方法
EP4632390A3 (en) 2017-03-03 2026-01-14 AEHR Test Systems Electronics tester
TWI639844B (zh) * 2017-08-25 2018-11-01 鴻勁精密股份有限公司 電子元件預燒測試裝置及其應用之預燒爐
TWI659484B (zh) * 2018-03-15 2019-05-11 鴻勁精密股份有限公司 具導風機構之電子元件預燒設備
WO2020159954A1 (en) * 2019-01-29 2020-08-06 Kes Systems, Inc. Test and burn-in apparatus that provides variable thermal resistance
CN118226177A (zh) * 2019-06-19 2024-06-21 泰克元有限公司 测试腔室
TWI839362B (zh) * 2019-07-09 2024-04-21 智邦科技股份有限公司 燒機測試室
TWM594691U (zh) * 2020-02-06 2020-05-01 鴻邦自動化有限公司 奔應爐的反饋式預燒裝置
TWI726668B (zh) * 2020-03-31 2021-05-01 矽品精密工業股份有限公司 散熱組件
US11493551B2 (en) 2020-06-22 2022-11-08 Advantest Test Solutions, Inc. Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
TWI885209B (zh) 2020-09-16 2025-06-01 美商微控公司 具有可密封腔室的半導體燒機爐及其操作方法
US11549981B2 (en) 2020-10-01 2023-01-10 Advantest Test Solutions, Inc. Thermal solution for massively parallel testing
CN120254561B (zh) * 2020-10-07 2026-03-03 雅赫测试系统公司 电子测试器
KR102817101B1 (ko) 2020-10-21 2025-06-05 마이크로 콘트롤 컴파니 번인 보드 안착부
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US12320841B2 (en) 2020-11-19 2025-06-03 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11567119B2 (en) 2020-12-04 2023-01-31 Advantest Test Solutions, Inc. Testing system including active thermal interposer device
US11573262B2 (en) 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US11587640B2 (en) 2021-03-08 2023-02-21 Advantest Test Solutions, Inc. Carrier based high volume system level testing of devices with pop structures
US12235314B2 (en) 2021-09-14 2025-02-25 Advantest Test Solutions, Inc Parallel test cell with self actuated sockets
KR102913963B1 (ko) * 2021-11-03 2026-01-16 에스케이하이닉스 주식회사 반도체 테스트 장치 및 이를 구동하는 방법
US11656273B1 (en) 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems
US12411167B2 (en) 2022-01-26 2025-09-09 Advantest Test Solutions, Inc. Tension-based socket gimbal for engaging device under test with thermal array
US11835549B2 (en) 2022-01-26 2023-12-05 Advantest Test Solutions, Inc. Thermal array with gimbal features and enhanced thermal performance
CN115235282B (zh) * 2022-09-22 2022-12-02 四川恩巨实业有限公司 一种老化系统及其控制方法
JP2026501645A (ja) 2022-12-30 2026-01-16 エイアー テスト システムズ 電子試験器

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US4912600A (en) * 1988-09-07 1990-03-27 Auburn Univ. Of The State Of Alabama Integrated circuit packaging and cooling
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Also Published As

Publication number Publication date
JP2005148070A (ja) 2005-06-09
US7650762B2 (en) 2010-01-26
US20050103034A1 (en) 2005-05-19
KR100937728B1 (ko) 2010-01-20
TW200521443A (en) 2005-07-01
JP4642437B2 (ja) 2011-03-02
KR20050046613A (ko) 2005-05-18
US7296430B2 (en) 2007-11-20
US20080053123A1 (en) 2008-03-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees