JP4637475B2 - 取外し可能なサセプタを用いた半導体基板搬送システム、及び半導体基板の搬送方法 - Google Patents

取外し可能なサセプタを用いた半導体基板搬送システム、及び半導体基板の搬送方法 Download PDF

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Publication number
JP4637475B2
JP4637475B2 JP2003406235A JP2003406235A JP4637475B2 JP 4637475 B2 JP4637475 B2 JP 4637475B2 JP 2003406235 A JP2003406235 A JP 2003406235A JP 2003406235 A JP2003406235 A JP 2003406235A JP 4637475 B2 JP4637475 B2 JP 4637475B2
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Japan
Prior art keywords
substrate
susceptor
semiconductor substrate
removable
self
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003406235A
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English (en)
Japanese (ja)
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JP2004200678A5 (enExample
JP2004200678A (ja
Inventor
レイモンド、ジョー
アンソニー、ディップ
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
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Publication of JP2004200678A5 publication Critical patent/JP2004200678A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H10P72/127—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterised by the substrate support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2003406235A 2002-12-05 2003-12-04 取外し可能なサセプタを用いた半導体基板搬送システム、及び半導体基板の搬送方法 Expired - Fee Related JP4637475B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/310,141 US6799940B2 (en) 2002-12-05 2002-12-05 Removable semiconductor wafer susceptor

Publications (3)

Publication Number Publication Date
JP2004200678A JP2004200678A (ja) 2004-07-15
JP2004200678A5 JP2004200678A5 (enExample) 2006-12-07
JP4637475B2 true JP4637475B2 (ja) 2011-02-23

Family

ID=32467973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003406235A Expired - Fee Related JP4637475B2 (ja) 2002-12-05 2003-12-04 取外し可能なサセプタを用いた半導体基板搬送システム、及び半導体基板の搬送方法

Country Status (2)

Country Link
US (1) US6799940B2 (enExample)
JP (1) JP4637475B2 (enExample)

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KR100875464B1 (ko) * 2004-09-30 2008-12-22 가부시키가이샤 히다치 고쿠사이 덴키 열처리 장치 및 기판의 제조방법
TW201115675A (en) * 2005-04-25 2011-05-01 Terasemicon Co Ltd Manufacturing method for the holder of the batch type boat
US7748542B2 (en) * 2005-08-31 2010-07-06 Applied Materials, Inc. Batch deposition tool and compressed boat
JP4813313B2 (ja) * 2006-09-29 2011-11-09 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 シリコン単結晶引上げ装置及び該装置に使用される黒鉛部材並びに黒鉛部材の劣化防止方法
JP5205738B2 (ja) * 2006-10-16 2013-06-05 株式会社Ｓｕｍｃｏ シリコンウェーハの支持方法、熱処理治具および熱処理ウェーハ
US8099190B2 (en) * 2007-06-22 2012-01-17 Asm International N.V. Apparatus and method for transferring two or more wafers whereby the positions of the wafers can be measured
US20090004405A1 (en) * 2007-06-29 2009-01-01 Applied Materials, Inc. Thermal Batch Reactor with Removable Susceptors
JP5071217B2 (ja) * 2008-04-17 2012-11-14 信越半導体株式会社 縦型熱処理用ボートおよびそれを用いたシリコンウエーハの熱処理方法
JP2010157536A (ja) * 2008-12-26 2010-07-15 Nuflare Technology Inc サセプタの製造方法
KR101855217B1 (ko) * 2010-12-30 2018-05-08 비코 인스트루먼츠 인코포레이티드 캐리어 연장부를 이용한 웨이퍼 처리
DE102016111236A1 (de) * 2016-06-20 2017-12-21 Heraeus Noblelight Gmbh Substrat-Trägerelement für eine Trägerhorde, sowie Trägerhorde und Vorrichtung mit dem Substrat-Trägerelement
EP3422396B1 (de) 2017-06-28 2021-08-04 Meyer Burger (Germany) GmbH Vorrichtung zum transport eines substrats, behandlungsvorrichtung mit einer an einen substratträger einer solchen vorrichtung angepassten aufnahmeplatte und verfahren zum prozessieren eines substrates unter nutzung einer solchen vorrichtung zum transport eines substrats sowie behandlungsanlage
US11521876B2 (en) * 2018-03-07 2022-12-06 Tokyo Electron Limited Horizontal substrate boat
EP3626865A1 (en) 2018-09-20 2020-03-25 Heraeus GMSI LLC Susceptor and method for manufacturing the same
US12046495B2 (en) 2020-06-26 2024-07-23 Globalwafers Co., Ltd. Wafer boats for supporting semiconductor wafers in a furnace

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Also Published As

Publication number Publication date
US6799940B2 (en) 2004-10-05
US20040109748A1 (en) 2004-06-10
JP2004200678A (ja) 2004-07-15

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