JPS5475985A - Heat treatment method of semiconductor substrate and its unit - Google Patents
Heat treatment method of semiconductor substrate and its unitInfo
- Publication number
- JPS5475985A JPS5475985A JP14345577A JP14345577A JPS5475985A JP S5475985 A JPS5475985 A JP S5475985A JP 14345577 A JP14345577 A JP 14345577A JP 14345577 A JP14345577 A JP 14345577A JP S5475985 A JPS5475985 A JP S5475985A
- Authority
- JP
- Japan
- Prior art keywords
- boats
- heat treatment
- boat
- support materials
- convexes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To shorten the total required time of experiments different in heat treatment time, by providing a fitting part consisting of a concave and a convex at the front and the back of a boat for heat treatment and joining plural boats to enclose them in a diffusion furnace simultaneously and separating them from one another to pull out them from the furnace.
CONSTITUTION: Boat 10 is formed with quartz glass, etc. That is, upper wafer support materials 12 are connected onto lower support materials 11 through short pole brace 13, and support materials 12 is beforehand provided with groove 17 to stand wafer 18. Next, cylindrical concaves 14 and 14' and convexes 15 and 15' are provided at the front tip and the back tip of support materials 11 respectively, and concaves and convexes provided in same boats positioned in front and back of this boat are fitted to concaves 14 and 14' and convexes 15 and 15', thereby connecting boats. Further, boat 10 is provided with pulling-out handle 16. When these boats are constituted in this manner and are inserted into a diffusion furnace so that boats with a longer heat treatment time and boats with a shorter heat treatment time may be in the back and the front of the furnace respectively, only boats which has been subjected to heat treatment can be pull out first.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14345577A JPS5475985A (en) | 1977-11-29 | 1977-11-29 | Heat treatment method of semiconductor substrate and its unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14345577A JPS5475985A (en) | 1977-11-29 | 1977-11-29 | Heat treatment method of semiconductor substrate and its unit |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15902685A Division JPS6144425A (en) | 1985-07-18 | 1985-07-18 | Boat for heat treatment of semiconductor substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5475985A true JPS5475985A (en) | 1979-06-18 |
| JPS6122856B2 JPS6122856B2 (en) | 1986-06-03 |
Family
ID=15339093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14345577A Granted JPS5475985A (en) | 1977-11-29 | 1977-11-29 | Heat treatment method of semiconductor substrate and its unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5475985A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961534U (en) * | 1982-10-15 | 1984-04-23 | 日本電気株式会社 | transport boat |
| JPS61110444A (en) * | 1984-11-02 | 1986-05-28 | ヘレウス・クアルツシユメルツエ・ゲゼルシヤフト・ミツト・ベシユレンクタ−・ハフツング | Hold lattice package |
| US6799940B2 (en) | 2002-12-05 | 2004-10-05 | Tokyo Electron Limited | Removable semiconductor wafer susceptor |
-
1977
- 1977-11-29 JP JP14345577A patent/JPS5475985A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961534U (en) * | 1982-10-15 | 1984-04-23 | 日本電気株式会社 | transport boat |
| JPS61110444A (en) * | 1984-11-02 | 1986-05-28 | ヘレウス・クアルツシユメルツエ・ゲゼルシヤフト・ミツト・ベシユレンクタ−・ハフツング | Hold lattice package |
| US6799940B2 (en) | 2002-12-05 | 2004-10-05 | Tokyo Electron Limited | Removable semiconductor wafer susceptor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6122856B2 (en) | 1986-06-03 |
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