JP4636807B2 - 基板保持装置およびそれを用いた露光装置 - Google Patents

基板保持装置およびそれを用いた露光装置 Download PDF

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Publication number
JP4636807B2
JP4636807B2 JP2004078592A JP2004078592A JP4636807B2 JP 4636807 B2 JP4636807 B2 JP 4636807B2 JP 2004078592 A JP2004078592 A JP 2004078592A JP 2004078592 A JP2004078592 A JP 2004078592A JP 4636807 B2 JP4636807 B2 JP 4636807B2
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JP
Japan
Prior art keywords
substrate
digging
digging portion
holding
substrate holding
Prior art date
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Expired - Fee Related
Application number
JP2004078592A
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English (en)
Japanese (ja)
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JP2005268524A (ja
JP2005268524A5 (enExample
Inventor
敦史 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2004078592A priority Critical patent/JP4636807B2/ja
Priority to US11/074,665 priority patent/US20050207089A1/en
Publication of JP2005268524A publication Critical patent/JP2005268524A/ja
Publication of JP2005268524A5 publication Critical patent/JP2005268524A5/ja
Application granted granted Critical
Publication of JP4636807B2 publication Critical patent/JP4636807B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2004078592A 2004-03-18 2004-03-18 基板保持装置およびそれを用いた露光装置 Expired - Fee Related JP4636807B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004078592A JP4636807B2 (ja) 2004-03-18 2004-03-18 基板保持装置およびそれを用いた露光装置
US11/074,665 US20050207089A1 (en) 2004-03-18 2005-03-09 Substrate holder and exposure apparatus using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004078592A JP4636807B2 (ja) 2004-03-18 2004-03-18 基板保持装置およびそれを用いた露光装置

Publications (3)

Publication Number Publication Date
JP2005268524A JP2005268524A (ja) 2005-09-29
JP2005268524A5 JP2005268524A5 (enExample) 2007-04-26
JP4636807B2 true JP4636807B2 (ja) 2011-02-23

Family

ID=34986017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004078592A Expired - Fee Related JP4636807B2 (ja) 2004-03-18 2004-03-18 基板保持装置およびそれを用いた露光装置

Country Status (2)

Country Link
US (1) US20050207089A1 (enExample)
JP (1) JP4636807B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7198276B2 (en) * 2003-10-24 2007-04-03 International Business Machines Corporation Adaptive electrostatic pin chuck
JP5724657B2 (ja) 2011-06-14 2015-05-27 旭硝子株式会社 ガラス基板保持手段、およびそれを用いたｅｕｖマスクブランクスの製造方法
US11085112B2 (en) 2011-10-28 2021-08-10 Asm Ip Holding B.V. Susceptor with ring to limit backside deposition
JP6244454B2 (ja) * 2013-09-27 2017-12-06 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置のための支持テーブル、リソグラフィ装置、及び、デバイス製造方法
TWI861334B (zh) 2020-01-21 2024-11-11 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 用於均勻沉積之具有側壁隆起的基座及處理結晶基材之方法
KR20240051154A (ko) * 2021-08-20 2024-04-19 도쿄엘렉트론가부시키가이샤 정전 척, 기판 지지기 및 기판 처리 장치

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6060060A (ja) * 1983-09-12 1985-04-06 株式会社日立製作所 鉄道車両の扉開閉装置
JP3129452B2 (ja) * 1990-03-13 2001-01-29 富士電機株式会社 静電チャック
US5113102A (en) * 1991-05-09 1992-05-12 Huntington Mechanical Laboratories, Inc. Rotary motion transmitter and heat treatment method for sealed chamber
US5326725A (en) * 1993-03-11 1994-07-05 Applied Materials, Inc. Clamping ring and susceptor therefor
US5463525A (en) * 1993-12-20 1995-10-31 International Business Machines Corporation Guard ring electrostatic chuck
US5583736A (en) * 1994-11-17 1996-12-10 The United States Of America As Represented By The Department Of Energy Micromachined silicon electrostatic chuck
US5748435A (en) * 1996-12-30 1998-05-05 Applied Materials, Inc. Apparatus for controlling backside gas pressure beneath a semiconductor wafer
JPH10284360A (ja) * 1997-04-02 1998-10-23 Hitachi Ltd 基板温度制御装置及び方法
US6048403A (en) * 1998-04-01 2000-04-11 Applied Materials, Inc. Multi-ledge substrate support for a thermal processing chamber
JPH11330219A (ja) * 1998-05-12 1999-11-30 Hitachi Ltd 静電吸着装置
US6765647B1 (en) * 1998-11-18 2004-07-20 Nikon Corporation Exposure method and device
JP3846092B2 (ja) * 1999-02-24 2006-11-15 松下電器産業株式会社 プラズマ処理装置および方法
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
US6809802B1 (en) * 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
US6515288B1 (en) * 2000-03-16 2003-02-04 Applied Materials, Inc. Vacuum bearing structure and a method of supporting a movable member
US6444027B1 (en) * 2000-05-08 2002-09-03 Memc Electronic Materials, Inc. Modified susceptor for use in chemical vapor deposition process
JP2002009139A (ja) * 2000-06-20 2002-01-11 Nikon Corp 静電チャック
US6544340B2 (en) * 2000-12-08 2003-04-08 Applied Materials, Inc. Heater with detachable ceramic top plate
JP3758979B2 (ja) * 2001-02-27 2006-03-22 京セラ株式会社 静電チャック及び処理装置
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
US6506291B2 (en) * 2001-06-14 2003-01-14 Applied Materials, Inc. Substrate support with multilevel heat transfer mechanism
US7070660B2 (en) * 2002-05-03 2006-07-04 Asm America, Inc. Wafer holder with stiffening rib
JP2004072076A (ja) * 2002-06-10 2004-03-04 Nikon Corp 露光装置及びステージ装置、並びにデバイス製造方法
US6955725B2 (en) * 2002-08-15 2005-10-18 Micron Technology, Inc. Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
KR20040070008A (ko) * 2003-01-29 2004-08-06 쿄세라 코포레이션 정전척
US6897403B2 (en) * 2003-03-05 2005-05-24 Hitachi High-Technologies Corporation Plasma processing method and plasma processing apparatus
EP1654752B1 (en) * 2003-08-01 2011-06-29 SGL Carbon SE Holder for supporting wafers during semiconductor manufacture
EP1510868A1 (en) * 2003-08-29 2005-03-02 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7648579B2 (en) * 2004-02-13 2010-01-19 Asm America, Inc. Substrate support system for reduced autodoping and backside deposition

Also Published As

Publication number Publication date
JP2005268524A (ja) 2005-09-29
US20050207089A1 (en) 2005-09-22

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