|
JPS6060060A
(ja)
*
|
1983-09-12 |
1985-04-06 |
株式会社日立製作所 |
鉄道車両の扉開閉装置
|
|
JP3129452B2
(ja)
*
|
1990-03-13 |
2001-01-29 |
富士電機株式会社 |
静電チャック
|
|
US5113102A
(en)
*
|
1991-05-09 |
1992-05-12 |
Huntington Mechanical Laboratories, Inc. |
Rotary motion transmitter and heat treatment method for sealed chamber
|
|
US5326725A
(en)
*
|
1993-03-11 |
1994-07-05 |
Applied Materials, Inc. |
Clamping ring and susceptor therefor
|
|
US5463525A
(en)
*
|
1993-12-20 |
1995-10-31 |
International Business Machines Corporation |
Guard ring electrostatic chuck
|
|
US5583736A
(en)
*
|
1994-11-17 |
1996-12-10 |
The United States Of America As Represented By The Department Of Energy |
Micromachined silicon electrostatic chuck
|
|
US5748435A
(en)
*
|
1996-12-30 |
1998-05-05 |
Applied Materials, Inc. |
Apparatus for controlling backside gas pressure beneath a semiconductor wafer
|
|
JPH10284360A
(ja)
*
|
1997-04-02 |
1998-10-23 |
Hitachi Ltd |
基板温度制御装置及び方法
|
|
US6048403A
(en)
*
|
1998-04-01 |
2000-04-11 |
Applied Materials, Inc. |
Multi-ledge substrate support for a thermal processing chamber
|
|
JPH11330219A
(ja)
*
|
1998-05-12 |
1999-11-30 |
Hitachi Ltd |
静電吸着装置
|
|
EP1187186A1
(en)
*
|
1998-11-18 |
2002-03-13 |
Nikon Corporation |
Exposure method and device
|
|
JP3846092B2
(ja)
*
|
1999-02-24 |
2006-11-15 |
松下電器産業株式会社 |
プラズマ処理装置および方法
|
|
JP3805134B2
(ja)
*
|
1999-05-25 |
2006-08-02 |
東陶機器株式会社 |
絶縁性基板吸着用静電チャック
|
|
EP1077393A2
(en)
*
|
1999-08-19 |
2001-02-21 |
Canon Kabushiki Kaisha |
Substrate attracting and holding system for use in exposure apparatus
|
|
US6515288B1
(en)
*
|
2000-03-16 |
2003-02-04 |
Applied Materials, Inc. |
Vacuum bearing structure and a method of supporting a movable member
|
|
US6444027B1
(en)
*
|
2000-05-08 |
2002-09-03 |
Memc Electronic Materials, Inc. |
Modified susceptor for use in chemical vapor deposition process
|
|
JP2002009139A
(ja)
*
|
2000-06-20 |
2002-01-11 |
Nikon Corp |
静電チャック
|
|
US6544340B2
(en)
*
|
2000-12-08 |
2003-04-08 |
Applied Materials, Inc. |
Heater with detachable ceramic top plate
|
|
JP3758979B2
(ja)
*
|
2001-02-27 |
2006-03-22 |
京セラ株式会社 |
静電チャック及び処理装置
|
|
US6628503B2
(en)
*
|
2001-03-13 |
2003-09-30 |
Nikon Corporation |
Gas cooled electrostatic pin chuck for vacuum applications
|
|
US6506291B2
(en)
*
|
2001-06-14 |
2003-01-14 |
Applied Materials, Inc. |
Substrate support with multilevel heat transfer mechanism
|
|
US7070660B2
(en)
*
|
2002-05-03 |
2006-07-04 |
Asm America, Inc. |
Wafer holder with stiffening rib
|
|
JP2004072076A
(ja)
*
|
2002-06-10 |
2004-03-04 |
Nikon Corp |
露光装置及びステージ装置、並びにデバイス製造方法
|
|
US6955725B2
(en)
*
|
2002-08-15 |
2005-10-18 |
Micron Technology, Inc. |
Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
|
|
KR20040070008A
(ko)
*
|
2003-01-29 |
2004-08-06 |
쿄세라 코포레이션 |
정전척
|
|
US6897403B2
(en)
*
|
2003-03-05 |
2005-05-24 |
Hitachi High-Technologies Corporation |
Plasma processing method and plasma processing apparatus
|
|
WO2005013334A2
(en)
*
|
2003-08-01 |
2005-02-10 |
Sgl Carbon Ag |
Holder for supporting wafers during semiconductor manufacture
|
|
EP1510868A1
(en)
*
|
2003-08-29 |
2005-03-02 |
ASML Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
|
KR101112029B1
(ko)
*
|
2004-02-13 |
2012-03-21 |
에이에스엠 아메리카, 인코포레이티드 |
자동 도핑 및 후면 증착의 감소를 위한 기판 지지 시스템
|