JP2005268524A5 - - Google Patents

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Publication number
JP2005268524A5
JP2005268524A5 JP2004078592A JP2004078592A JP2005268524A5 JP 2005268524 A5 JP2005268524 A5 JP 2005268524A5 JP 2004078592 A JP2004078592 A JP 2004078592A JP 2004078592 A JP2004078592 A JP 2004078592A JP 2005268524 A5 JP2005268524 A5 JP 2005268524A5
Authority
JP
Japan
Prior art keywords
substrate
digging portion
digging
holding apparatus
substrate holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004078592A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005268524A (ja
JP4636807B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004078592A priority Critical patent/JP4636807B2/ja
Priority claimed from JP2004078592A external-priority patent/JP4636807B2/ja
Priority to US11/074,665 priority patent/US20050207089A1/en
Publication of JP2005268524A publication Critical patent/JP2005268524A/ja
Publication of JP2005268524A5 publication Critical patent/JP2005268524A5/ja
Application granted granted Critical
Publication of JP4636807B2 publication Critical patent/JP4636807B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004078592A 2004-03-18 2004-03-18 基板保持装置およびそれを用いた露光装置 Expired - Fee Related JP4636807B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004078592A JP4636807B2 (ja) 2004-03-18 2004-03-18 基板保持装置およびそれを用いた露光装置
US11/074,665 US20050207089A1 (en) 2004-03-18 2005-03-09 Substrate holder and exposure apparatus using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004078592A JP4636807B2 (ja) 2004-03-18 2004-03-18 基板保持装置およびそれを用いた露光装置

Publications (3)

Publication Number Publication Date
JP2005268524A JP2005268524A (ja) 2005-09-29
JP2005268524A5 true JP2005268524A5 (enExample) 2007-04-26
JP4636807B2 JP4636807B2 (ja) 2011-02-23

Family

ID=34986017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004078592A Expired - Fee Related JP4636807B2 (ja) 2004-03-18 2004-03-18 基板保持装置およびそれを用いた露光装置

Country Status (2)

Country Link
US (1) US20050207089A1 (enExample)
JP (1) JP4636807B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7198276B2 (en) * 2003-10-24 2007-04-03 International Business Machines Corporation Adaptive electrostatic pin chuck
JP5724657B2 (ja) 2011-06-14 2015-05-27 旭硝子株式会社 ガラス基板保持手段、およびそれを用いたｅｕｖマスクブランクスの製造方法
US11085112B2 (en) 2011-10-28 2021-08-10 Asm Ip Holding B.V. Susceptor with ring to limit backside deposition
EP3049869B1 (en) * 2013-09-27 2017-11-08 ASML Netherlands B.V. Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method
TWI861334B (zh) 2020-01-21 2024-11-11 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 用於均勻沉積之具有側壁隆起的基座及處理結晶基材之方法
KR20240051154A (ko) * 2021-08-20 2024-04-19 도쿄엘렉트론가부시키가이샤 정전 척, 기판 지지기 및 기판 처리 장치

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6060060A (ja) * 1983-09-12 1985-04-06 株式会社日立製作所 鉄道車両の扉開閉装置
JP3129452B2 (ja) * 1990-03-13 2001-01-29 富士電機株式会社 静電チャック
US5113102A (en) * 1991-05-09 1992-05-12 Huntington Mechanical Laboratories, Inc. Rotary motion transmitter and heat treatment method for sealed chamber
US5326725A (en) * 1993-03-11 1994-07-05 Applied Materials, Inc. Clamping ring and susceptor therefor
US5463525A (en) * 1993-12-20 1995-10-31 International Business Machines Corporation Guard ring electrostatic chuck
US5583736A (en) * 1994-11-17 1996-12-10 The United States Of America As Represented By The Department Of Energy Micromachined silicon electrostatic chuck
US5748435A (en) * 1996-12-30 1998-05-05 Applied Materials, Inc. Apparatus for controlling backside gas pressure beneath a semiconductor wafer
JPH10284360A (ja) * 1997-04-02 1998-10-23 Hitachi Ltd 基板温度制御装置及び方法
US6048403A (en) * 1998-04-01 2000-04-11 Applied Materials, Inc. Multi-ledge substrate support for a thermal processing chamber
JPH11330219A (ja) * 1998-05-12 1999-11-30 Hitachi Ltd 静電吸着装置
KR20010089453A (ko) * 1998-11-18 2001-10-06 시마무라 테루오 노광방법 및 장치
JP3846092B2 (ja) * 1999-02-24 2006-11-15 松下電器産業株式会社 プラズマ処理装置および方法
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
US6809802B1 (en) * 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
US6515288B1 (en) * 2000-03-16 2003-02-04 Applied Materials, Inc. Vacuum bearing structure and a method of supporting a movable member
US6444027B1 (en) * 2000-05-08 2002-09-03 Memc Electronic Materials, Inc. Modified susceptor for use in chemical vapor deposition process
JP2002009139A (ja) * 2000-06-20 2002-01-11 Nikon Corp 静電チャック
US6544340B2 (en) * 2000-12-08 2003-04-08 Applied Materials, Inc. Heater with detachable ceramic top plate
JP3758979B2 (ja) * 2001-02-27 2006-03-22 京セラ株式会社 静電チャック及び処理装置
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
US6506291B2 (en) * 2001-06-14 2003-01-14 Applied Materials, Inc. Substrate support with multilevel heat transfer mechanism
US7070660B2 (en) * 2002-05-03 2006-07-04 Asm America, Inc. Wafer holder with stiffening rib
JP2004072076A (ja) * 2002-06-10 2004-03-04 Nikon Corp 露光装置及びステージ装置、並びにデバイス製造方法
US6955725B2 (en) * 2002-08-15 2005-10-18 Micron Technology, Inc. Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
KR20040070008A (ko) * 2003-01-29 2004-08-06 쿄세라 코포레이션 정전척
US6897403B2 (en) * 2003-03-05 2005-05-24 Hitachi High-Technologies Corporation Plasma processing method and plasma processing apparatus
US7582166B2 (en) * 2003-08-01 2009-09-01 Sgl Carbon, Llc Holder for supporting wafers during semiconductor manufacture
EP1510868A1 (en) * 2003-08-29 2005-03-02 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1719167B1 (en) * 2004-02-13 2011-10-26 ASM America, Inc. Substrate support system for reduced autodoping and backside deposition

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