JP4592787B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP4592787B2
JP4592787B2 JP2008181131A JP2008181131A JP4592787B2 JP 4592787 B2 JP4592787 B2 JP 4592787B2 JP 2008181131 A JP2008181131 A JP 2008181131A JP 2008181131 A JP2008181131 A JP 2008181131A JP 4592787 B2 JP4592787 B2 JP 4592787B2
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JP
Japan
Prior art keywords
substrate
stage
processing apparatus
substrate processing
levitation stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008181131A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010021396A (ja
Inventor
義広 川口
一騎 元松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2008181131A priority Critical patent/JP4592787B2/ja
Priority to TW098121832A priority patent/TW201009991A/zh
Priority to KR1020090059707A priority patent/KR20100007725A/ko
Priority to CN2009101584856A priority patent/CN101625965B/zh
Publication of JP2010021396A publication Critical patent/JP2010021396A/ja
Application granted granted Critical
Publication of JP4592787B2 publication Critical patent/JP4592787B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70816—Bearings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
JP2008181131A 2008-07-11 2008-07-11 基板処理装置 Expired - Fee Related JP4592787B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008181131A JP4592787B2 (ja) 2008-07-11 2008-07-11 基板処理装置
TW098121832A TW201009991A (en) 2008-07-11 2009-06-29 Substrate processing apparatus
KR1020090059707A KR20100007725A (ko) 2008-07-11 2009-07-01 기판 처리 장치
CN2009101584856A CN101625965B (zh) 2008-07-11 2009-07-10 基板处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008181131A JP4592787B2 (ja) 2008-07-11 2008-07-11 基板処理装置

Publications (2)

Publication Number Publication Date
JP2010021396A JP2010021396A (ja) 2010-01-28
JP4592787B2 true JP4592787B2 (ja) 2010-12-08

Family

ID=41521750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008181131A Expired - Fee Related JP4592787B2 (ja) 2008-07-11 2008-07-11 基板処理装置

Country Status (4)

Country Link
JP (1) JP4592787B2 (ko)
KR (1) KR20100007725A (ko)
CN (1) CN101625965B (ko)
TW (1) TW201009991A (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107017191B (zh) * 2010-02-17 2020-08-14 株式会社尼康 搬送装置、曝光装置、以及元件制造方法
CN102386091A (zh) * 2010-09-02 2012-03-21 南通康比电子有限公司 一种二极管的制造方法及其自动输出装置
CN102602695A (zh) * 2011-01-25 2012-07-25 佶新科技股份有限公司 基板输送分类装置
JP5369128B2 (ja) * 2011-03-01 2013-12-18 東京エレクトロン株式会社 浮上式塗布装置
JP5502788B2 (ja) * 2011-03-16 2014-05-28 東京エレクトロン株式会社 浮上式塗布装置
JP5869782B2 (ja) * 2011-05-30 2016-02-24 東レエンジニアリング株式会社 浮上搬送加熱装置
JP2014022538A (ja) * 2012-07-18 2014-02-03 Toray Eng Co Ltd 熱処理装置および熱処理方法
JP6053468B2 (ja) * 2012-11-20 2016-12-27 東レエンジニアリング株式会社 浮上搬送熱処理装置
JP6312959B2 (ja) * 2013-07-17 2018-04-18 セーレン株式会社 インクジェット記録装置
KR101480900B1 (ko) * 2013-08-09 2015-01-09 주식회사 포스코 코크가이드의 열팽창 영향 저감장치
KR101503176B1 (ko) * 2013-11-27 2015-03-24 주식회사 휘닉스 디지탈테크 기판 검사 장치 및 방법
KR101603205B1 (ko) 2014-02-18 2016-03-14 오미정 오아시스 지지구조를 포함하는 화환받침대
CN103928371A (zh) * 2014-04-17 2014-07-16 京东方科技集团股份有限公司 一种湿法刻蚀设备
CN110190019A (zh) * 2018-02-22 2019-08-30 圆益Ips股份有限公司 基板运送模块以及包括该模块的基板处理系统
JP6861198B2 (ja) * 2018-12-12 2021-04-21 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および塗布装置
CN112916559B (zh) * 2021-01-25 2022-09-13 山东圣亚圣世玻璃制品有限公司 一种免夹式玻璃清洗池
CN112850238B (zh) * 2021-02-03 2022-12-23 厦门特仪科技有限公司 一种硅片光刻用防污输送设备
KR20230164168A (ko) * 2021-04-02 2023-12-01 어플라이드 머티어리얼스, 인코포레이티드 필드 가이드 노출 후 베이킹 프로세스를 위한 프로세스 셀

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003188078A (ja) * 2001-12-19 2003-07-04 Shibaura Mechatronics Corp 基板乾燥装置
JP2006003036A (ja) * 2004-06-18 2006-01-05 Shimada Phys & Chem Ind Co Ltd 乾燥装置
JP2007158088A (ja) * 2005-12-06 2007-06-21 Tokyo Electron Ltd 加熱処理装置、加熱処理方法、制御プログラム、コンピュータ読取可能な記憶媒体
JP2008159782A (ja) * 2006-12-22 2008-07-10 Tokyo Electron Ltd 減圧乾燥装置
JP2009076547A (ja) * 2007-09-19 2009-04-09 Tokyo Electron Ltd 常圧乾燥装置及び基板処理装置及び基板処理方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003188078A (ja) * 2001-12-19 2003-07-04 Shibaura Mechatronics Corp 基板乾燥装置
JP2006003036A (ja) * 2004-06-18 2006-01-05 Shimada Phys & Chem Ind Co Ltd 乾燥装置
JP2007158088A (ja) * 2005-12-06 2007-06-21 Tokyo Electron Ltd 加熱処理装置、加熱処理方法、制御プログラム、コンピュータ読取可能な記憶媒体
JP2008159782A (ja) * 2006-12-22 2008-07-10 Tokyo Electron Ltd 減圧乾燥装置
JP2009076547A (ja) * 2007-09-19 2009-04-09 Tokyo Electron Ltd 常圧乾燥装置及び基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
CN101625965A (zh) 2010-01-13
JP2010021396A (ja) 2010-01-28
TW201009991A (en) 2010-03-01
KR20100007725A (ko) 2010-01-22
CN101625965B (zh) 2011-09-21

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