CN101625965B - 基板处理装置 - Google Patents

基板处理装置 Download PDF

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Publication number
CN101625965B
CN101625965B CN2009101584856A CN200910158485A CN101625965B CN 101625965 B CN101625965 B CN 101625965B CN 2009101584856 A CN2009101584856 A CN 2009101584856A CN 200910158485 A CN200910158485 A CN 200910158485A CN 101625965 B CN101625965 B CN 101625965B
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CN
China
Prior art keywords
platform
substrate
floats
float
substrate board
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Expired - Fee Related
Application number
CN2009101584856A
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English (en)
Chinese (zh)
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CN101625965A (zh
Inventor
川口义广
元松一骑
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Tokyo Electron Ltd
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Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN101625965A publication Critical patent/CN101625965A/zh
Application granted granted Critical
Publication of CN101625965B publication Critical patent/CN101625965B/zh
Expired - Fee Related legal-status Critical Current
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/168Finishing the coated layer, e.g. drying, baking, soaking
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063Transporting devices for sheet glass
    • B65G49/064Transporting devices for sheet glass in a horizontal position
    • B65G49/065Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70816Bearings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
CN2009101584856A 2008-07-11 2009-07-10 基板处理装置 Expired - Fee Related CN101625965B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-181131 2008-07-11
JP2008181131A JP4592787B2 (ja) 2008-07-11 2008-07-11 基板処理装置
JP2008181131 2008-07-11

Publications (2)

Publication Number Publication Date
CN101625965A CN101625965A (zh) 2010-01-13
CN101625965B true CN101625965B (zh) 2011-09-21

Family

ID=41521750

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009101584856A Expired - Fee Related CN101625965B (zh) 2008-07-11 2009-07-10 基板处理装置

Country Status (4)

Country Link
JP (1) JP4592787B2 (ko)
KR (1) KR20100007725A (ko)
CN (1) CN101625965B (ko)
TW (1) TW201009991A (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107017191B (zh) * 2010-02-17 2020-08-14 株式会社尼康 搬送装置、曝光装置、以及元件制造方法
CN102386091A (zh) * 2010-09-02 2012-03-21 南通康比电子有限公司 一种二极管的制造方法及其自动输出装置
CN102602695A (zh) * 2011-01-25 2012-07-25 佶新科技股份有限公司 基板输送分类装置
JP5369128B2 (ja) * 2011-03-01 2013-12-18 東京エレクトロン株式会社 浮上式塗布装置
JP5502788B2 (ja) * 2011-03-16 2014-05-28 東京エレクトロン株式会社 浮上式塗布装置
JP5869782B2 (ja) * 2011-05-30 2016-02-24 東レエンジニアリング株式会社 浮上搬送加熱装置
JP2014022538A (ja) * 2012-07-18 2014-02-03 Toray Eng Co Ltd 熱処理装置および熱処理方法
JP6053468B2 (ja) * 2012-11-20 2016-12-27 東レエンジニアリング株式会社 浮上搬送熱処理装置
JP6312959B2 (ja) * 2013-07-17 2018-04-18 セーレン株式会社 インクジェット記録装置
KR101480900B1 (ko) * 2013-08-09 2015-01-09 주식회사 포스코 코크가이드의 열팽창 영향 저감장치
KR101503176B1 (ko) * 2013-11-27 2015-03-24 주식회사 휘닉스 디지탈테크 기판 검사 장치 및 방법
KR101603205B1 (ko) 2014-02-18 2016-03-14 오미정 오아시스 지지구조를 포함하는 화환받침대
CN103928371A (zh) * 2014-04-17 2014-07-16 京东方科技集团股份有限公司 一种湿法刻蚀设备
CN110190019A (zh) * 2018-02-22 2019-08-30 圆益Ips股份有限公司 基板运送模块以及包括该模块的基板处理系统
JP6861198B2 (ja) * 2018-12-12 2021-04-21 株式会社Screenホールディングス 基板搬送装置および塗布装置
CN112916559B (zh) * 2021-01-25 2022-09-13 山东圣亚圣世玻璃制品有限公司 一种免夹式玻璃清洗池
CN112850238B (zh) * 2021-02-03 2022-12-23 厦门特仪科技有限公司 一种硅片光刻用防污输送设备
KR20230164168A (ko) * 2021-04-02 2023-12-01 어플라이드 머티어리얼스, 인코포레이티드 필드 가이드 노출 후 베이킹 프로세스를 위한 프로세스 셀

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003188078A (ja) * 2001-12-19 2003-07-04 Shibaura Mechatronics Corp 基板乾燥装置
JP2006003036A (ja) * 2004-06-18 2006-01-05 Shimada Phys & Chem Ind Co Ltd 乾燥装置
JP4672538B2 (ja) * 2005-12-06 2011-04-20 東京エレクトロン株式会社 加熱処理装置
JP4272230B2 (ja) * 2006-12-22 2009-06-03 東京エレクトロン株式会社 減圧乾燥装置
JP4542577B2 (ja) * 2007-09-19 2010-09-15 東京エレクトロン株式会社 常圧乾燥装置及び基板処理装置及び基板処理方法

Also Published As

Publication number Publication date
CN101625965A (zh) 2010-01-13
JP2010021396A (ja) 2010-01-28
TW201009991A (en) 2010-03-01
JP4592787B2 (ja) 2010-12-08
KR20100007725A (ko) 2010-01-22

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