JP4580327B2 - 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構 - Google Patents

被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構 Download PDF

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Publication number
JP4580327B2
JP4580327B2 JP2005336032A JP2005336032A JP4580327B2 JP 4580327 B2 JP4580327 B2 JP 4580327B2 JP 2005336032 A JP2005336032 A JP 2005336032A JP 2005336032 A JP2005336032 A JP 2005336032A JP 4580327 B2 JP4580327 B2 JP 4580327B2
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Japan
Prior art keywords
processed
mounting table
mounting
vacuum
wafer
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Expired - Lifetime
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JP2005336032A
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Japanese (ja)
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JP2007142267A (ja
JP2007142267A5 (https=
Inventor
勝 鈴木
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2005336032A priority Critical patent/JP4580327B2/ja
Priority to KR1020060113198A priority patent/KR100856152B1/ko
Priority to US11/560,904 priority patent/US7556246B2/en
Priority to TW095143079A priority patent/TWI392051B/zh
Priority to CN200610149470XA priority patent/CN1971870B/zh
Publication of JP2007142267A publication Critical patent/JP2007142267A/ja
Publication of JP2007142267A5 publication Critical patent/JP2007142267A5/ja
Application granted granted Critical
Publication of JP4580327B2 publication Critical patent/JP4580327B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2005336032A 2005-11-21 2005-11-21 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構 Expired - Lifetime JP4580327B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005336032A JP4580327B2 (ja) 2005-11-21 2005-11-21 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構
KR1020060113198A KR100856152B1 (ko) 2005-11-21 2006-11-16 피처리체의 반출 방법 및 프로그램 기억 매체 및 탑재기구
US11/560,904 US7556246B2 (en) 2005-11-21 2006-11-17 Unloading method of object, program storage medium, and mounting mechanism
TW095143079A TWI392051B (zh) 2005-11-21 2006-11-21 The method of removing the processed body and the program memory medium and the placing mechanism
CN200610149470XA CN1971870B (zh) 2005-11-21 2006-11-21 被处理体的取出方法及载置机构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005336032A JP4580327B2 (ja) 2005-11-21 2005-11-21 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構

Publications (3)

Publication Number Publication Date
JP2007142267A JP2007142267A (ja) 2007-06-07
JP2007142267A5 JP2007142267A5 (https=) 2008-12-18
JP4580327B2 true JP4580327B2 (ja) 2010-11-10

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JP2005336032A Expired - Lifetime JP4580327B2 (ja) 2005-11-21 2005-11-21 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構

Country Status (5)

Country Link
US (1) US7556246B2 (https=)
JP (1) JP4580327B2 (https=)
KR (1) KR100856152B1 (https=)
CN (1) CN1971870B (https=)
TW (1) TWI392051B (https=)

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JP2010129929A (ja) * 2008-11-28 2010-06-10 Canon Inc 基板保持装置、基板保持方法、露光装置およびデバイス製造方法
DE102009018434B4 (de) * 2009-04-22 2023-11-30 Ev Group Gmbh Aufnahmeeinrichtung zur Aufnahme von Halbleitersubstraten
JP5390266B2 (ja) * 2009-06-01 2014-01-15 東京エレクトロン株式会社 吸着検知解消方法、処理装置、及びコンピュータ読み取り可能な記憶媒体
JP5591562B2 (ja) * 2010-03-10 2014-09-17 日本発條株式会社 位置決め装置
JP5591563B2 (ja) * 2010-03-10 2014-09-17 日本発條株式会社 位置確認装置
TWI402171B (zh) * 2010-11-11 2013-07-21 C Sun Mfg Ltd 壓合裝置及其壓合方法
TWI460075B (zh) * 2010-11-11 2014-11-11 C Sun Mfg Ltd 壓合機
CN102306620B (zh) * 2011-09-01 2013-03-27 清华大学 激光退火片台装置
JP2013145776A (ja) * 2012-01-13 2013-07-25 Disco Abrasive Syst Ltd 搬送方法
CN104718607B (zh) 2012-08-31 2017-10-03 联达科技设备私人有限公司 用于自动校正膜片架上的晶圆的旋转错位的系统和方法
EP3183091B8 (en) * 2014-08-19 2018-09-05 Lumileds Holding B.V. Sapphire collector for reducing mechanical damage during die level laser lift-off
KR102572643B1 (ko) * 2015-05-13 2023-08-31 루미리즈 홀딩 비.브이. 다이 레벨의 레이저 리프트-오프 중에 기계적 손상을 줄이기 위한 사파이어 수집기
JP6659332B2 (ja) * 2015-12-07 2020-03-04 株式会社荏原製作所 基板処理装置、基板処理装置の真空吸着テーブルから基板を脱着する方法、及び、基板処理装置の真空吸着テーブルに基板を載置する方法
JP6875417B2 (ja) * 2016-04-08 2021-05-26 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空チャック圧力制御システム
CN112008636B (zh) * 2020-09-15 2024-09-27 河北三厦科技股份有限公司 一种夹具
KR102604456B1 (ko) * 2021-09-24 2023-11-23 주식회사 기가레인 웨이퍼 디척킹 방법
KR20250042075A (ko) * 2023-09-19 2025-03-26 캐논 가부시끼가이샤 기판 유지장치, 기판 처리장치, 분리방법, 및 물품 제조방법

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Also Published As

Publication number Publication date
TW200731457A (en) 2007-08-16
TWI392051B (zh) 2013-04-01
CN1971870A (zh) 2007-05-30
KR100856152B1 (ko) 2008-09-03
KR20070053615A (ko) 2007-05-25
JP2007142267A (ja) 2007-06-07
US7556246B2 (en) 2009-07-07
US20070118246A1 (en) 2007-05-24
CN1971870B (zh) 2012-05-23

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