CN1971870B - 被处理体的取出方法及载置机构 - Google Patents

被处理体的取出方法及载置机构 Download PDF

Info

Publication number
CN1971870B
CN1971870B CN200610149470XA CN200610149470A CN1971870B CN 1971870 B CN1971870 B CN 1971870B CN 200610149470X A CN200610149470X A CN 200610149470XA CN 200610149470 A CN200610149470 A CN 200610149470A CN 1971870 B CN1971870 B CN 1971870B
Authority
CN
China
Prior art keywords
processed
mounting table
lifting
vacuum
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200610149470XA
Other languages
English (en)
Chinese (zh)
Other versions
CN1971870A (zh
Inventor
铃木胜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1971870A publication Critical patent/CN1971870A/zh
Application granted granted Critical
Publication of CN1971870B publication Critical patent/CN1971870B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN200610149470XA 2005-11-21 2006-11-21 被处理体的取出方法及载置机构 Active CN1971870B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005-336032 2005-11-21
JP2005336032A JP4580327B2 (ja) 2005-11-21 2005-11-21 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構
JP2005336032 2005-11-21

Publications (2)

Publication Number Publication Date
CN1971870A CN1971870A (zh) 2007-05-30
CN1971870B true CN1971870B (zh) 2012-05-23

Family

ID=38054545

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200610149470XA Active CN1971870B (zh) 2005-11-21 2006-11-21 被处理体的取出方法及载置机构

Country Status (5)

Country Link
US (1) US7556246B2 (https=)
JP (1) JP4580327B2 (https=)
KR (1) KR100856152B1 (https=)
CN (1) CN1971870B (https=)
TW (1) TWI392051B (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101004434B1 (ko) * 2008-11-26 2010-12-28 세메스 주식회사 기판 지지 유닛과, 이를 이용한 기판 연마 장치 및 방법
JP2010129929A (ja) * 2008-11-28 2010-06-10 Canon Inc 基板保持装置、基板保持方法、露光装置およびデバイス製造方法
DE102009018434B4 (de) * 2009-04-22 2023-11-30 Ev Group Gmbh Aufnahmeeinrichtung zur Aufnahme von Halbleitersubstraten
JP5390266B2 (ja) * 2009-06-01 2014-01-15 東京エレクトロン株式会社 吸着検知解消方法、処理装置、及びコンピュータ読み取り可能な記憶媒体
JP5591562B2 (ja) * 2010-03-10 2014-09-17 日本発條株式会社 位置決め装置
JP5591563B2 (ja) * 2010-03-10 2014-09-17 日本発條株式会社 位置確認装置
TWI402171B (zh) * 2010-11-11 2013-07-21 C Sun Mfg Ltd 壓合裝置及其壓合方法
TWI460075B (zh) * 2010-11-11 2014-11-11 C Sun Mfg Ltd 壓合機
CN102306620B (zh) * 2011-09-01 2013-03-27 清华大学 激光退火片台装置
JP2013145776A (ja) * 2012-01-13 2013-07-25 Disco Abrasive Syst Ltd 搬送方法
CN104718607B (zh) 2012-08-31 2017-10-03 联达科技设备私人有限公司 用于自动校正膜片架上的晶圆的旋转错位的系统和方法
EP3183091B8 (en) * 2014-08-19 2018-09-05 Lumileds Holding B.V. Sapphire collector for reducing mechanical damage during die level laser lift-off
KR102572643B1 (ko) * 2015-05-13 2023-08-31 루미리즈 홀딩 비.브이. 다이 레벨의 레이저 리프트-오프 중에 기계적 손상을 줄이기 위한 사파이어 수집기
JP6659332B2 (ja) * 2015-12-07 2020-03-04 株式会社荏原製作所 基板処理装置、基板処理装置の真空吸着テーブルから基板を脱着する方法、及び、基板処理装置の真空吸着テーブルに基板を載置する方法
JP6875417B2 (ja) * 2016-04-08 2021-05-26 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空チャック圧力制御システム
CN112008636B (zh) * 2020-09-15 2024-09-27 河北三厦科技股份有限公司 一种夹具
KR102604456B1 (ko) * 2021-09-24 2023-11-23 주식회사 기가레인 웨이퍼 디척킹 방법
KR20250042075A (ko) * 2023-09-19 2025-03-26 캐논 가부시끼가이샤 기판 유지장치, 기판 처리장치, 분리방법, 및 물품 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812201A (en) * 1986-07-25 1989-03-14 Tokyo Electron Limited Method of ashing layers, and apparatus for ashing layers
US4908095A (en) * 1988-05-02 1990-03-13 Tokyo Electron Limited Etching device, and etching method
KR0164618B1 (ko) * 1992-02-13 1999-02-01 이노우에 쥰이치 플라즈마 처리방법
JP3153372B2 (ja) * 1992-02-26 2001-04-09 東京エレクトロン株式会社 基板処理装置
KR100290748B1 (ko) * 1993-01-29 2001-06-01 히가시 데쓰로 플라즈마 처리장치
US5542559A (en) * 1993-02-16 1996-08-06 Tokyo Electron Kabushiki Kaisha Plasma treatment apparatus
JPH07157117A (ja) * 1993-12-08 1995-06-20 Fuji Photo Film Co Ltd 板状体または箱体の真空チャック装置
TW254030B (en) * 1994-03-18 1995-08-11 Anelva Corp Mechanic escape mechanism for substrate
JPH0927541A (ja) * 1995-07-10 1997-01-28 Nikon Corp 基板ホルダ
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
JP2991110B2 (ja) * 1996-05-01 1999-12-20 日本電気株式会社 基板吸着保持装置
KR100257787B1 (ko) * 1997-09-09 2000-06-01 김광교 반도체 제조용 설비의 웨이퍼 슬립 방지방법
US6089763A (en) 1997-09-09 2000-07-18 Dns Korea Co., Ltd. Semiconductor wafer processing system
JPH11233601A (ja) 1998-02-10 1999-08-27 Hitachi Ltd 静電吸着装置及びそれを用いた試料処理装置
EP0953409B1 (en) * 1998-04-27 2005-11-16 Tokyo Seimitsu Co.,Ltd. Wafer surface machining method and apparatus
JP2000183130A (ja) 1998-12-21 2000-06-30 Matsushita Electric Ind Co Ltd ウェハ搬送方法とその装置
US6305677B1 (en) * 1999-03-30 2001-10-23 Lam Research Corporation Perimeter wafer lifting
JP2001338868A (ja) * 2000-03-24 2001-12-07 Nikon Corp 照度計測装置及び露光装置
EP1204139A4 (en) * 2000-04-27 2010-04-28 Ebara Corp ROTATING BRACKET AND ARRANGEMENT FOR MACHINING SEMICONDUCTOR SUBSTRATES
KR20080095310A (ko) * 2001-11-02 2008-10-28 어플라이드 머티어리얼스, 인코포레이티드 미세 전자 소자의 세정 방법
US7750654B2 (en) * 2002-09-02 2010-07-06 Octec Inc. Probe method, prober, and electrode reducing/plasma-etching processing mechanism
US6722642B1 (en) * 2002-11-06 2004-04-20 Tokyo Electron Limited High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism
JP2004193195A (ja) * 2002-12-09 2004-07-08 Shinko Electric Ind Co Ltd 搬送装置
JP2005129837A (ja) * 2003-10-27 2005-05-19 Seiko Epson Corp 基板処理装置及び基板処理方法
US7187188B2 (en) * 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
KR20050120282A (ko) * 2004-06-18 2005-12-22 삼성전자주식회사 정전척으로부터 웨이퍼를 리프팅하는 방법
US7292428B2 (en) * 2005-04-26 2007-11-06 Applied Materials, Inc. Electrostatic chuck with smart lift-pin mechanism for a plasma reactor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber

Also Published As

Publication number Publication date
TW200731457A (en) 2007-08-16
TWI392051B (zh) 2013-04-01
CN1971870A (zh) 2007-05-30
KR100856152B1 (ko) 2008-09-03
KR20070053615A (ko) 2007-05-25
JP2007142267A (ja) 2007-06-07
US7556246B2 (en) 2009-07-07
US20070118246A1 (en) 2007-05-24
JP4580327B2 (ja) 2010-11-10

Similar Documents

Publication Publication Date Title
CN1971870B (zh) 被处理体的取出方法及载置机构
KR102407489B1 (ko) 접합 장치, 접합 시스템, 접합 방법 및 컴퓨터 기억 매체
CN108630569B (zh) 基板处理装置
TWI567863B (zh) Plasma processing device, substrate unloading device and method
JP2008147591A (ja) 半導体製造装置及び半導体製造方法
CN111293058B (zh) 静电卡盘的控制系统及其控制方法
KR102434123B1 (ko) 접합 방법, 프로그램, 컴퓨터 기억 매체, 접합 장치 및 접합 시스템
KR20160018411A (ko) 접합 장치, 접합 시스템, 접합 방법 및 컴퓨터 기억 매체
KR20180007315A (ko) 접합 시스템
CN106898566B (zh) 一种半导体加工设备
CN106816402B (zh) 消除静电荷的方法及基片卸载方法
TW200914348A (en) Floating transfer apparatus, and treating system having the floating transfer apparatus
TW201430940A (zh) 減壓處理裝置
JP6120749B2 (ja) 接合方法、プログラム、コンピュータ記憶媒体、接合装置及び接合システム
JPH11340208A (ja) プラズマ処理方法
KR102649714B1 (ko) 기판 처리 장치 및 기판 반송 방법
KR100833315B1 (ko) 리프트 핀 홀더
TWI822220B (zh) 晶圓釋放方法
JP2003266266A (ja) 半導体ウエーハの搬送装置
KR20090048202A (ko) 기판 안착 장치 및 기판 안착 방법
JP2007258636A (ja) ドライエッチング方法およびその装置
JP2008041761A (ja) 被処理物の処理後剥離方法及び設置装置
KR102284472B1 (ko) 기판 처리 장치 및 기판 처리 방법
JP2002043292A (ja) プラズマ処理装置および処理方法
US20250364300A1 (en) Substrate holding device and bonding system

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant