TWI392051B - The method of removing the processed body and the program memory medium and the placing mechanism - Google Patents

The method of removing the processed body and the program memory medium and the placing mechanism Download PDF

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Publication number
TWI392051B
TWI392051B TW095143079A TW95143079A TWI392051B TW I392051 B TWI392051 B TW I392051B TW 095143079 A TW095143079 A TW 095143079A TW 95143079 A TW95143079 A TW 95143079A TW I392051 B TWI392051 B TW I392051B
Authority
TW
Taiwan
Prior art keywords
processed
mounting table
lifting
wafer
mounting
Prior art date
Application number
TW095143079A
Other languages
English (en)
Chinese (zh)
Other versions
TW200731457A (en
Inventor
鈴木勝
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW200731457A publication Critical patent/TW200731457A/zh
Application granted granted Critical
Publication of TWI392051B publication Critical patent/TWI392051B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095143079A 2005-11-21 2006-11-21 The method of removing the processed body and the program memory medium and the placing mechanism TWI392051B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005336032A JP4580327B2 (ja) 2005-11-21 2005-11-21 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構

Publications (2)

Publication Number Publication Date
TW200731457A TW200731457A (en) 2007-08-16
TWI392051B true TWI392051B (zh) 2013-04-01

Family

ID=38054545

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095143079A TWI392051B (zh) 2005-11-21 2006-11-21 The method of removing the processed body and the program memory medium and the placing mechanism

Country Status (5)

Country Link
US (1) US7556246B2 (https=)
JP (1) JP4580327B2 (https=)
KR (1) KR100856152B1 (https=)
CN (1) CN1971870B (https=)
TW (1) TWI392051B (https=)

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KR101004434B1 (ko) * 2008-11-26 2010-12-28 세메스 주식회사 기판 지지 유닛과, 이를 이용한 기판 연마 장치 및 방법
JP2010129929A (ja) * 2008-11-28 2010-06-10 Canon Inc 基板保持装置、基板保持方法、露光装置およびデバイス製造方法
DE102009018434B4 (de) * 2009-04-22 2023-11-30 Ev Group Gmbh Aufnahmeeinrichtung zur Aufnahme von Halbleitersubstraten
JP5390266B2 (ja) * 2009-06-01 2014-01-15 東京エレクトロン株式会社 吸着検知解消方法、処理装置、及びコンピュータ読み取り可能な記憶媒体
JP5591562B2 (ja) * 2010-03-10 2014-09-17 日本発條株式会社 位置決め装置
JP5591563B2 (ja) * 2010-03-10 2014-09-17 日本発條株式会社 位置確認装置
TWI402171B (zh) * 2010-11-11 2013-07-21 C Sun Mfg Ltd 壓合裝置及其壓合方法
TWI460075B (zh) * 2010-11-11 2014-11-11 C Sun Mfg Ltd 壓合機
CN102306620B (zh) * 2011-09-01 2013-03-27 清华大学 激光退火片台装置
JP2013145776A (ja) * 2012-01-13 2013-07-25 Disco Abrasive Syst Ltd 搬送方法
CN104718607B (zh) 2012-08-31 2017-10-03 联达科技设备私人有限公司 用于自动校正膜片架上的晶圆的旋转错位的系统和方法
EP3183091B8 (en) * 2014-08-19 2018-09-05 Lumileds Holding B.V. Sapphire collector for reducing mechanical damage during die level laser lift-off
KR102572643B1 (ko) * 2015-05-13 2023-08-31 루미리즈 홀딩 비.브이. 다이 레벨의 레이저 리프트-오프 중에 기계적 손상을 줄이기 위한 사파이어 수집기
JP6659332B2 (ja) * 2015-12-07 2020-03-04 株式会社荏原製作所 基板処理装置、基板処理装置の真空吸着テーブルから基板を脱着する方法、及び、基板処理装置の真空吸着テーブルに基板を載置する方法
JP6875417B2 (ja) * 2016-04-08 2021-05-26 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空チャック圧力制御システム
CN112008636B (zh) * 2020-09-15 2024-09-27 河北三厦科技股份有限公司 一种夹具
KR102604456B1 (ko) * 2021-09-24 2023-11-23 주식회사 기가레인 웨이퍼 디척킹 방법
KR20250042075A (ko) * 2023-09-19 2025-03-26 캐논 가부시끼가이샤 기판 유지장치, 기판 처리장치, 분리방법, 및 물품 제조방법

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US5310453A (en) * 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
US5542559A (en) * 1993-02-16 1996-08-06 Tokyo Electron Kabushiki Kaisha Plasma treatment apparatus
US5665166A (en) * 1993-01-29 1997-09-09 Tokyo Electron Limited Plasma processing apparatus
US6305677B1 (en) * 1999-03-30 2001-10-23 Lam Research Corporation Perimeter wafer lifting

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US4812201A (en) * 1986-07-25 1989-03-14 Tokyo Electron Limited Method of ashing layers, and apparatus for ashing layers
US4908095A (en) * 1988-05-02 1990-03-13 Tokyo Electron Limited Etching device, and etching method
JP3153372B2 (ja) * 1992-02-26 2001-04-09 東京エレクトロン株式会社 基板処理装置
JPH07157117A (ja) * 1993-12-08 1995-06-20 Fuji Photo Film Co Ltd 板状体または箱体の真空チャック装置
TW254030B (en) * 1994-03-18 1995-08-11 Anelva Corp Mechanic escape mechanism for substrate
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US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
JP2991110B2 (ja) * 1996-05-01 1999-12-20 日本電気株式会社 基板吸着保持装置
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber
KR100257787B1 (ko) * 1997-09-09 2000-06-01 김광교 반도체 제조용 설비의 웨이퍼 슬립 방지방법
US6089763A (en) 1997-09-09 2000-07-18 Dns Korea Co., Ltd. Semiconductor wafer processing system
JPH11233601A (ja) 1998-02-10 1999-08-27 Hitachi Ltd 静電吸着装置及びそれを用いた試料処理装置
EP0953409B1 (en) * 1998-04-27 2005-11-16 Tokyo Seimitsu Co.,Ltd. Wafer surface machining method and apparatus
JP2000183130A (ja) 1998-12-21 2000-06-30 Matsushita Electric Ind Co Ltd ウェハ搬送方法とその装置
JP2001338868A (ja) * 2000-03-24 2001-12-07 Nikon Corp 照度計測装置及び露光装置
EP1204139A4 (en) * 2000-04-27 2010-04-28 Ebara Corp ROTATING BRACKET AND ARRANGEMENT FOR MACHINING SEMICONDUCTOR SUBSTRATES
KR20080095310A (ko) * 2001-11-02 2008-10-28 어플라이드 머티어리얼스, 인코포레이티드 미세 전자 소자의 세정 방법
US7750654B2 (en) * 2002-09-02 2010-07-06 Octec Inc. Probe method, prober, and electrode reducing/plasma-etching processing mechanism
US6722642B1 (en) * 2002-11-06 2004-04-20 Tokyo Electron Limited High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism
JP2004193195A (ja) * 2002-12-09 2004-07-08 Shinko Electric Ind Co Ltd 搬送装置
JP2005129837A (ja) * 2003-10-27 2005-05-19 Seiko Epson Corp 基板処理装置及び基板処理方法
US7187188B2 (en) * 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
KR20050120282A (ko) * 2004-06-18 2005-12-22 삼성전자주식회사 정전척으로부터 웨이퍼를 리프팅하는 방법
US7292428B2 (en) * 2005-04-26 2007-11-06 Applied Materials, Inc. Electrostatic chuck with smart lift-pin mechanism for a plasma reactor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5310453A (en) * 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
US5665166A (en) * 1993-01-29 1997-09-09 Tokyo Electron Limited Plasma processing apparatus
US5542559A (en) * 1993-02-16 1996-08-06 Tokyo Electron Kabushiki Kaisha Plasma treatment apparatus
US6305677B1 (en) * 1999-03-30 2001-10-23 Lam Research Corporation Perimeter wafer lifting

Also Published As

Publication number Publication date
TW200731457A (en) 2007-08-16
CN1971870A (zh) 2007-05-30
KR100856152B1 (ko) 2008-09-03
KR20070053615A (ko) 2007-05-25
JP2007142267A (ja) 2007-06-07
US7556246B2 (en) 2009-07-07
US20070118246A1 (en) 2007-05-24
JP4580327B2 (ja) 2010-11-10
CN1971870B (zh) 2012-05-23

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