KR100856152B1 - 피처리체의 반출 방법 및 프로그램 기억 매체 및 탑재기구 - Google Patents

피처리체의 반출 방법 및 프로그램 기억 매체 및 탑재기구 Download PDF

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Publication number
KR100856152B1
KR100856152B1 KR1020060113198A KR20060113198A KR100856152B1 KR 100856152 B1 KR100856152 B1 KR 100856152B1 KR 1020060113198 A KR1020060113198 A KR 1020060113198A KR 20060113198 A KR20060113198 A KR 20060113198A KR 100856152 B1 KR100856152 B1 KR 100856152B1
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South Korea
Prior art keywords
lifting
mounting table
mounting
wafer
vacuum
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Korean (ko)
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KR20070053615A (ko
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마사루 스즈키
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020060113198A 2005-11-21 2006-11-16 피처리체의 반출 방법 및 프로그램 기억 매체 및 탑재기구 Active KR100856152B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00336032 2005-11-21
JP2005336032A JP4580327B2 (ja) 2005-11-21 2005-11-21 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構

Publications (2)

Publication Number Publication Date
KR20070053615A KR20070053615A (ko) 2007-05-25
KR100856152B1 true KR100856152B1 (ko) 2008-09-03

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KR1020060113198A Active KR100856152B1 (ko) 2005-11-21 2006-11-16 피처리체의 반출 방법 및 프로그램 기억 매체 및 탑재기구

Country Status (5)

Country Link
US (1) US7556246B2 (https=)
JP (1) JP4580327B2 (https=)
KR (1) KR100856152B1 (https=)
CN (1) CN1971870B (https=)
TW (1) TWI392051B (https=)

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KR101004434B1 (ko) * 2008-11-26 2010-12-28 세메스 주식회사 기판 지지 유닛과, 이를 이용한 기판 연마 장치 및 방법
JP2010129929A (ja) * 2008-11-28 2010-06-10 Canon Inc 基板保持装置、基板保持方法、露光装置およびデバイス製造方法
DE102009018434B4 (de) * 2009-04-22 2023-11-30 Ev Group Gmbh Aufnahmeeinrichtung zur Aufnahme von Halbleitersubstraten
JP5390266B2 (ja) * 2009-06-01 2014-01-15 東京エレクトロン株式会社 吸着検知解消方法、処理装置、及びコンピュータ読み取り可能な記憶媒体
JP5591562B2 (ja) * 2010-03-10 2014-09-17 日本発條株式会社 位置決め装置
JP5591563B2 (ja) * 2010-03-10 2014-09-17 日本発條株式会社 位置確認装置
TWI402171B (zh) * 2010-11-11 2013-07-21 C Sun Mfg Ltd 壓合裝置及其壓合方法
TWI460075B (zh) * 2010-11-11 2014-11-11 C Sun Mfg Ltd 壓合機
CN102306620B (zh) * 2011-09-01 2013-03-27 清华大学 激光退火片台装置
JP2013145776A (ja) * 2012-01-13 2013-07-25 Disco Abrasive Syst Ltd 搬送方法
CN104718607B (zh) 2012-08-31 2017-10-03 联达科技设备私人有限公司 用于自动校正膜片架上的晶圆的旋转错位的系统和方法
EP3183091B8 (en) * 2014-08-19 2018-09-05 Lumileds Holding B.V. Sapphire collector for reducing mechanical damage during die level laser lift-off
KR102572643B1 (ko) * 2015-05-13 2023-08-31 루미리즈 홀딩 비.브이. 다이 레벨의 레이저 리프트-오프 중에 기계적 손상을 줄이기 위한 사파이어 수집기
JP6659332B2 (ja) * 2015-12-07 2020-03-04 株式会社荏原製作所 基板処理装置、基板処理装置の真空吸着テーブルから基板を脱着する方法、及び、基板処理装置の真空吸着テーブルに基板を載置する方法
JP6875417B2 (ja) * 2016-04-08 2021-05-26 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 真空チャック圧力制御システム
CN112008636B (zh) * 2020-09-15 2024-09-27 河北三厦科技股份有限公司 一种夹具
KR102604456B1 (ko) * 2021-09-24 2023-11-23 주식회사 기가레인 웨이퍼 디척킹 방법
KR20250042075A (ko) * 2023-09-19 2025-03-26 캐논 가부시끼가이샤 기판 유지장치, 기판 처리장치, 분리방법, 및 물품 제조방법

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JPH09295236A (ja) * 1996-05-01 1997-11-18 Nec Corp 基板吸着保持装置
KR19990024865A (ko) * 1997-09-09 1999-04-06 김광교 반도체 제조용 설비의 웨이퍼 슬립 방지방법
JPH11233601A (ja) 1998-02-10 1999-08-27 Hitachi Ltd 静電吸着装置及びそれを用いた試料処理装置
JP2000183130A (ja) 1998-12-21 2000-06-30 Matsushita Electric Ind Co Ltd ウェハ搬送方法とその装置
KR20050120282A (ko) * 2004-06-18 2005-12-22 삼성전자주식회사 정전척으로부터 웨이퍼를 리프팅하는 방법

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KR0164618B1 (ko) * 1992-02-13 1999-02-01 이노우에 쥰이치 플라즈마 처리방법
JP3153372B2 (ja) * 1992-02-26 2001-04-09 東京エレクトロン株式会社 基板処理装置
KR100290748B1 (ko) * 1993-01-29 2001-06-01 히가시 데쓰로 플라즈마 처리장치
US5542559A (en) * 1993-02-16 1996-08-06 Tokyo Electron Kabushiki Kaisha Plasma treatment apparatus
JPH07157117A (ja) * 1993-12-08 1995-06-20 Fuji Photo Film Co Ltd 板状体または箱体の真空チャック装置
TW254030B (en) * 1994-03-18 1995-08-11 Anelva Corp Mechanic escape mechanism for substrate
JPH0927541A (ja) * 1995-07-10 1997-01-28 Nikon Corp 基板ホルダ
US5923408A (en) * 1996-01-31 1999-07-13 Canon Kabushiki Kaisha Substrate holding system and exposure apparatus using the same
US5879128A (en) * 1996-07-24 1999-03-09 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber
US6089763A (en) 1997-09-09 2000-07-18 Dns Korea Co., Ltd. Semiconductor wafer processing system
EP0953409B1 (en) * 1998-04-27 2005-11-16 Tokyo Seimitsu Co.,Ltd. Wafer surface machining method and apparatus
US6305677B1 (en) * 1999-03-30 2001-10-23 Lam Research Corporation Perimeter wafer lifting
JP2001338868A (ja) * 2000-03-24 2001-12-07 Nikon Corp 照度計測装置及び露光装置
EP1204139A4 (en) * 2000-04-27 2010-04-28 Ebara Corp ROTATING BRACKET AND ARRANGEMENT FOR MACHINING SEMICONDUCTOR SUBSTRATES
KR20080095310A (ko) * 2001-11-02 2008-10-28 어플라이드 머티어리얼스, 인코포레이티드 미세 전자 소자의 세정 방법
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US6722642B1 (en) * 2002-11-06 2004-04-20 Tokyo Electron Limited High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism
JP2004193195A (ja) * 2002-12-09 2004-07-08 Shinko Electric Ind Co Ltd 搬送装置
JP2005129837A (ja) * 2003-10-27 2005-05-19 Seiko Epson Corp 基板処理装置及び基板処理方法
US7187188B2 (en) * 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7292428B2 (en) * 2005-04-26 2007-11-06 Applied Materials, Inc. Electrostatic chuck with smart lift-pin mechanism for a plasma reactor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09295236A (ja) * 1996-05-01 1997-11-18 Nec Corp 基板吸着保持装置
KR19990024865A (ko) * 1997-09-09 1999-04-06 김광교 반도체 제조용 설비의 웨이퍼 슬립 방지방법
JPH11233601A (ja) 1998-02-10 1999-08-27 Hitachi Ltd 静電吸着装置及びそれを用いた試料処理装置
JP2000183130A (ja) 1998-12-21 2000-06-30 Matsushita Electric Ind Co Ltd ウェハ搬送方法とその装置
KR20050120282A (ko) * 2004-06-18 2005-12-22 삼성전자주식회사 정전척으로부터 웨이퍼를 리프팅하는 방법

Also Published As

Publication number Publication date
TW200731457A (en) 2007-08-16
TWI392051B (zh) 2013-04-01
CN1971870A (zh) 2007-05-30
KR20070053615A (ko) 2007-05-25
JP2007142267A (ja) 2007-06-07
US7556246B2 (en) 2009-07-07
US20070118246A1 (en) 2007-05-24
JP4580327B2 (ja) 2010-11-10
CN1971870B (zh) 2012-05-23

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