JP4570868B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP4570868B2 JP4570868B2 JP2003433851A JP2003433851A JP4570868B2 JP 4570868 B2 JP4570868 B2 JP 4570868B2 JP 2003433851 A JP2003433851 A JP 2003433851A JP 2003433851 A JP2003433851 A JP 2003433851A JP 4570868 B2 JP4570868 B2 JP 4570868B2
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- Prior art keywords
- bonding
- electrodes
- power supply
- semiconductor device
- electrode
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- 239000004065 semiconductor Substances 0.000 title claims description 97
- 229910000679 solder Inorganic materials 0.000 claims description 8
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- 239000010931 gold Substances 0.000 description 2
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- 238000007789 sealing Methods 0.000 description 2
- 208000033978 Device electrical impedance issue Diseases 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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Description
第1主面および第1裏面を有し、前記第1主面において中央部にチップ搭載領域が設けられ、前記チップ搭載領域を囲む第1領域にリング状の複数の第1ボンディング電極が形成され、前記第1領域を囲む第2領域に複数の第2ボンディング電極が形成され、内部に前記第1ボンディング電極および前記第2ボンディング電極と電気的に接続する配線が形成された配線基板と、
第2主面および第2裏面を有し、前記第2裏面が前記チップ搭載領域と接するように前記配線基板に搭載され、前記第2主面において複数の電極が配置された半導体チップと、
前記複数の電極とこれに対応する前記第1ボンディング電極または前記第2ボンディング電極とを電気的に接続する複数のワイヤとを有し、
前記複数の第1ボンディング電極は電源電位もしくは基準電位と電気的に接続し、
前記複数の第2ボンディング電極は信号の入力もしくは出力に用いられ、
前記複数の電極は、前記第2主面の外周に沿って複数列で配列され、第1列に含まれる前記電極と、前記第2主面内において前記第1列の内側に位置する第2列に含まれる前記電極とは、前記第2主面の前記外周に沿った方向で互い違いに配置され、
前記複数の電極は、前記第1ボンディング電極と電気的に接続される複数の第1電極と、前記複数の第2ボンディング電極と電気的に接続される複数の第2電極とを含み、
(a)前記複数のワイヤのうち、前記第1ボンディング電極と前記複数の第1電極とを電気的に接続する複数の第1ワイヤは、前記複数の第2ボンディング電極と前記複数の第2電極とを電気的に接続する複数の第2ワイヤ以上の径を有する、
もしくは、
(b)1個の前記第1電極と前記第1ボンディング電極との間には、複数の前記ワイヤが接続されている、
を満たすものである。
(a)第1主面および第1裏面を有し、前記第1主面において中央部にチップ搭載領域が設けられ、前記チップ搭載領域を囲む第1領域に電源電位もしくは基準電位と電気的に接続されるリング状の複数の第1ボンディング電極が形成され、前記第1領域を囲む第2領域に信号の入力もしくは出力に用いられる複数の第2ボンディング電極が形成され、内部に前記第1ボンディング電極および前記第2ボンディング電極と電気的に接続する配線が形成された配線基板を用意する工程、
(b)第2主面および第2裏面を有し、前記第2主面において複数の電極が外周に沿って複数列で配置された半導体チップを用意する工程、
(c)前記第2裏面が前記チップ搭載領域と接するように前記半導体チップを前記配線基板に搭載する工程、
(d)前記複数の電極とこれに対応する前記第1ボンディング電極とを第1ワイヤによって電気的に接続する工程、
(e)前記複数の電極とこれに対応する前記第2ボンディング電極とを第2ワイヤによって電気的に接続する工程、
を含み、
前記(b)工程は、
(b1)第1列に含まれる前記電極と、前記第2主面内において前記第1列の内側に位置する第2列に含まれる前記電極とを、前記第2主面の前記外周に沿った方向で互い違いに配置する工程、
を含み、
前記複数の電極は、前記第1ボンディング電極と電気的に接続される複数の第1電極と、前記複数の第2ボンディング電極と電気的に接続される複数の第2電極とを含み、
前記第1ワイヤの径は、前記第2ワイヤの径以上とするものである。
(a)第1主面および第1裏面を有し、前記第1主面において中央部にチップ搭載領域が設けられ、前記チップ搭載領域を囲む第1領域に電源電位もしくは基準電位と電気的に接続されるリング状の複数の第1ボンディング電極が形成され、前記第1領域を囲む第2領域に信号の入力もしくは出力に用いられる複数の第2ボンディング電極が形成され、内部に前記第1ボンディング電極および前記第2ボンディング電極と電気的に接続する配線が形成された配線基板を用意する工程、
(b)第2主面および第2裏面を有し、前記第2主面において複数の電極が外周に沿って複数列で配置された半導体チップを用意する工程、
(c)前記第2裏面が前記チップ搭載領域と接するように前記半導体チップを前記配線基板に搭載する工程、
(d)前記複数の電極とこれに対応する前記第1ボンディング電極または前記第2ボンディング電極とを複数のワイヤによって電気的に接続する工程、
を含み、
前記(b)工程は、
(b1)第1列に含まれる前記電極と、前記第2主面内において前記第1列の内側に位置する第2列に含まれる前記電極とを、前記第2主面の前記外周に沿った方向で互い違いに配置する工程、
を含み、
前記複数の電極は、前記第1ボンディング電極と電気的に接続される複数の第1電極と、前記複数の第2ボンディング電極と電気的に接続される複数の第2電極とを含み、
1個の前記第1電極と前記第1ボンディング電極との間には、前記複数のワイヤを接続するものである。
図1は本実施の形態1の半導体装置の構造の一例を示す断面図であり、図2は図1に示した半導体装置の要部平面図であり、図3は図1に示した半導体装置の要部断面図である。
本実施の形態2の半導体装置も前記実施の形態1の半導体装置と同様に、配線基板上にチップが搭載された樹脂封止型の半導体パッケージである。
図13は本実施の形態3の半導体装置の要部平面図である。
2 チップ
2A チップ端部
3、5 ボンディング電極(第1ボンディング電極)
3A 電極(第3ボンディング電極)
4A ボンディング電極
4B、4C ボンディング電極(第4ボンディング電極)
6、7 ボンディング電極(第2ボンディング電極)
8 はんだボール
9 ボンディングパッド(電極、第1電極)
10 ボンディングパッド(電極、第2電極)
11、12 ワイヤ(第1ワイヤ)
11A、12A ワイヤ(第1ワイヤ)
13 ワイヤ(第2ワイヤ)
14 ワイヤ(第2ワイヤ)
15 封止体
16 配線
17 配線
18 電源回路セル
19 電源回路セル
20 入出力回路セル
21 入出力回路セル
22、22A、23、23A 配線
25 絶縁層
26 配線(配線層)
27 配線
31 半導体基板
32 p型ウエル
33 n型ウエル
34N、34P ゲート電極
35N、36N n型半導体領域
35P、36P p型半導体領域
37 層間絶縁膜
38A、38B、38C、38D プラグ
39A、39B、39C、39D 配線
41A ボンディングパッド
41B ボンディングパッド
41C ボンディングパッド
42、43 ワイヤ
44 配線
45 内部電源回路セル
46 配線
BUF バッファ回路
D1、D2 ダイオード
ESD 静電破壊保護回路
LEV レベルシフト回路
LOG 論理回路
PBF プリバッファ回路
Qn nチャネル型MISFET
Qp pチャネル型MISFET
Claims (11)
- 第1主面と、前記第1主面と対向する第1裏面と、前記第1主面に設けられたチップ搭載領域と、前記チップ搭載領域の周囲に設けられ、かつ電源電位または接地電位が供給される複数の第1ボンディング電極と、前記第1ボンディング電極よりも前記チップ搭載領域から遠い位置に設けられ、かつ信号が入力または出力される複数の第2ボンディング電極とを含む配線基板と、
第2主面と、前記第2主面と対向する第2裏面と、前記第2主面に設けられ、かつ前記第2主面の外周に沿って設けられた複数の第1電極と、前記第2主面に設けられ、かつ前記複数の第1電極よりも内側に設けられた複数の第2電極と、前記第2主面に設けられ、かつ前記複数の第2電極よりも内側の領域に設けられた複数の電源回路セルと、前記第2主面に設けられ、かつ前記複数の第2電極よりも内側の領域に設けられた複数の入出力回路セルとを含み、前記第2裏面が前記チップ搭載領域と対向するように前記配線基板に搭載された半導体チップと、
前記複数の第1ボンディング電極と前記複数の第1電極をそれぞれ電気的に接続する複数の第1ワイヤと、前記複数の第2ボンディング電極と前記複数の第2電極をそれぞれ電気的に接続する複数の第2ワイヤとを有し、
前記第1電極と前記第2電極は、前記半導体チップの外周に沿った方向で互い違いに配置され、
前記第1電極の外形サイズは、前記第2電極の外形サイズよりも大きく、
前記複数の電源回路セルと前記複数の第1電極を電気的に接続する複数の第1配線の幅は、前記複数の入出力回路セルと前記複数の第2電極を電気的に接続する複数の第2配線の幅よりも太く、
前記複数の電源回路セルは、前記接地電位が供給される第1電源回路セルと、前記電源電位のうちの外部電源電位が供給される第2電源回路セルと、前記電源電位のうちの内部電源電位が供給される第3電源回路セルとを有することを特徴とする半導体装置。 - 請求項1記載の半導体装置において、
前記第1ワイヤの径は、前記第2ワイヤの径よりも太いことを特徴とする半導体装置。 - 請求項1記載の半導体装置において、
前記第1電極に電気的に接続される第1ワイヤの数は、前記第2電極に電気的に接続される第2ワイヤの数よりも多いことを特徴とする半導体装置。 - 請求項1記載の半導体装置において、
前記電源回路セルおよび前記入出力回路セルのそれぞれは、バッファ回路、静電破壊保護回路、プリバッファ回路、レベルシフト回路、および論理回路から形成されていることを特徴とする半導体装置。 - 請求項1記載の半導体装置において、
前記第3電源回路セル上には、第3電極が形成されていることを特徴とする半導体装置。 - 請求項5記載の半導体装置において、
前記複数の第1ボンディング電極は、前記接地電位が供給され、かつ前記チップ搭載領域の周囲にリング状に形成された第3ボンディング電極と、外部電源電位が供給され、かつ前記第3ボンディング電極よりも前記チップ搭載領域から遠い位置にリング状に形成された第4ボンディング電極を有することを特徴とする半導体装置。 - 請求項6記載の半導体装置において、
前記複数の第1ボンディング電極は、更に、前記内部電源電位が供給され、かつ前記第3ボンディング電極と前記第4ボンディング電極との間にリング状に形成された第5ボンディング電極を有することを特徴とする半導体装置。 - 請求項7記載の半導体装置において、
前記第3電極は、前記第5ボンディング電極とそれぞれ電気的に接続されていることを特徴とする半導体装置。 - 請求項1記載の半導体装置において、
前記配線基板は、さらに、前記複数の第1ボンディング電極よりも前記チップ搭載領域から遠い位置に設けられた複数の第6ボンディング電極と、前記複数の第6ボンディング電極よりも前記チップ搭載領域から遠い位置に設けられた複数の第7ボンディング電極を有することを特徴とする半導体装置。 - 請求項9記載の半導体装置において、
前記半導体チップは、さらに、前記半導体チップの前記第2主面の外周に沿って、クロック信号を入力または出力する複数の第4電極を有し、
前記複数の第4電極は、前記複数の第6ボンディング電極と複数の第3ワイヤを介してそれぞれ電気的に接続されていることを特徴とする半導体装置。 - 請求項1記載の半導体装置において、
前記配線基板の前記第1裏面には、複数のはんだボールが設けられ、
前記複数のはんだボールは、前記複数の第1ボンディング電極および前記複数の第2ボンディング電極と複数の配線層を介してそれぞれ電気的に接続されていることを特徴とする半導体装置。
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US20050162880A1 (en) | 2005-07-28 |
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