JP2745628B2 - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

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Publication number
JP2745628B2
JP2745628B2 JP1016724A JP1672489A JP2745628B2 JP 2745628 B2 JP2745628 B2 JP 2745628B2 JP 1016724 A JP1016724 A JP 1016724A JP 1672489 A JP1672489 A JP 1672489A JP 2745628 B2 JP2745628 B2 JP 2745628B2
Authority
JP
Japan
Prior art keywords
connection
semiconductor device
resin
lead
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1016724A
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English (en)
Other versions
JPH02196450A (ja
Inventor
好明 福井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
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Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1016724A priority Critical patent/JP2745628B2/ja
Publication of JPH02196450A publication Critical patent/JPH02196450A/ja
Application granted granted Critical
Publication of JP2745628B2 publication Critical patent/JP2745628B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は樹脂封止型半導体装置に関し、特に多ピン型
の樹脂封止型半導体装置に関する。
〔従来の技術〕
従来、この種の樹脂封止型半導体装置は、半導体チッ
プをリードフレームのアイランドにマウントし、前記半
導体チップの主面に形成された電極パッドとリードフレ
ームの内部リードとを金属細線にてワイヤーボンディン
グし内部接続を行っていた。この内部接続を完了した
後、モールド成形用金型内にリードフレームを装着し、
熱硬化性樹脂を圧入し、前記アイランド及び前記内部リ
ードを含んで樹脂封止し、リードフレームより半導体装
置のリードを切離して半導体装置を形成していた。
半導体装置の微細加工技術は日増に増加し、多機能、
多ピン化が促進されており、半導体チップ主面に形成さ
れる電極パッドの数は100〜500個前後のものが既に実現
し、700個前後のものも回路設計の検討に入ってきてお
り、電極パッドを半導体チップの周縁部に120μｍピッ
チで１列ないし２列に並べることも容易になっている。
〔発明が解決しようとする課題〕
上述した従来の樹脂封止型半導体装置は、電極パッド
とリードフレームの内部リードとを直接線径20〜50μｍ
の金属細線にて接続している。ここで、金属細線の長さ
は、ワイヤボンディング技術上からの制約と、樹脂封止
技術上からの制約を受け現状では最長でも4mm前後が限
界である。ちなみに、ボンディング技術上からの制約
は、ボンディングループ形成過程で発生する金属細線の
曲りであり、樹脂封止技術上からの制約は樹脂注入時の
樹脂粘性による金属細線の変形（以下ワイヤ流れと記
す）である。一方、内部リード側の微細加工は、プレス
加工ないしはエッチング加工で行なわれており、板厚0.
15〜0.25mmのリードフレームの場合には、内部リード側
のボンディング領域（最小90μｍ幅）を確保するために
は0.22mmピッチが限界である。
以上の条件下で10mm平方の半導体チップをワイヤボン
ディングにて内部接続しようとすると、アイランドの周
囲全体に内部リードを設けたと計算して、280本程度が
限界本数となってしまう。上述した様に、従来の樹脂封
止型半導体装置は、ボンディング線長及び内部リード部
微細加工ピッチの制約により300ピンを越える内部リー
ド接続が出来ないという欠点があった。
本発明の目的は、半導体チップと内部リードとの間に
接続基板を介在させることにより、300ピンを越える多
ピン化を実現する樹脂封止型半導体装置を提供すること
にある。
〔課題を解決するための手段〕
本発明の樹脂封止型半導体装置は、絶縁基板の中央部
に素子載置部を設け、前記素子載置部の周囲に配置しか
つスルーホールを介して接続することにより多層配線構
造になっている接続リードを設けた接続基板と、前記接
続基板を搭載したアイランドと、前記素子載置部に搭載
した半導体チップと、前記半導体チップに設けられた電
極パッドと前記接続リードの接続箇所を電気的に接続す
る金属細線と、前記接続基板の周囲に配置し前記接続リ
ードと電気的に接続した内部リードとを有する樹脂封止
型半導体装置であって、前記接続箇所の配列と前記電極
パッドの配列との間の前記接続基板の領域に複数の接続
電極をマトリックス状に配置し、前記金属細線が前記電
極パッドに一端を接続し、その中間を切断することなく
それぞれ選ばれた前記接続電極に接続し、前記接続リー
ドの接続箇所に他端を接続している。
〔実施例〕
次に、本発明の実施例について図面を参照して説明す
る。
第１図（ａ）〜（ｃ）は本発明に関係のある半導体装
置の途中工程における中間製品の平面図とＡ部拡大図及
びＢ−Ｂ′線断面図、第１図（ｄ）はその半導体装置の
断面図である。
第１図（ａ）〜（ｃ）に示すように、絶縁基板１の中
央部に素子載置部を設け前記素子載置部の周囲に配置し
た接続リード２を設けた接続基板をリードフレームのア
イランド３の上に以後の工程の温度170〜180℃に耐えら
れる接着剤４を介して搭載し固着する。ここで、絶縁基
板１は板厚0.1〜1.0mm程度のガラス繊維入りエポキシ樹
脂板又は耐熱性樹脂板もしくはセラミック基板からな
り、前記素子載置部は絶縁基板１に設けた凹部の底面に
設けても良い。また、絶縁基板１の代りに表面に絶縁膜
を形成した金属板を用いても良い。接続リード２は金、
銀、銅、アルミニウム等からなり絶縁基板１の中に積層
して設け、スルーホールを介して接続することにより多
層化され集積度を向上させることができる。次に、前記
素子載置部に半導体チップ５を接着剤６を介して搭載し
固着する。次に、半導体チップ５の上に設けた電極パッ
ド７と接続リード２との間を金属細線８でワイヤボンデ
ィング法により接続し、同様に、接着リード２とリード
フレームの内部リード９との間を金属細線10により接続
する。このとき、金属細線8,10の長さは１〜4mmの範囲
でできるだけ短くなるように接続される。また、電極パ
ッドのピッチを120μｍにして２列の千鳥配置にしたと
きには約600個の電極パッドが形成できる。
次に、第１図（ｄ）に示すように、アイランド３及び
内部リード９を含んで樹脂体11で封止し内部リード９に
接続した外部リード12を前記リードフレームより切り離
して樹脂封止型半導体装置を構成する。
第２図（ａ），（ｂ）は本発明の実施例を説明するた
めの半導体装置の途中工程における中間製品の平面図及
び断面図である。
第２図（ａ），（ｂ）に示すように絶縁基板１の接続
リード２の内側に接続電極13をマトリックス状に配置し
て設け、ワイヤボンディングの際に電極パッド７に金属
細線８の一端を接続した後に金属細線８の中間を切断せ
ずに接続電極13に接続し更に金属細線８の他端を接続リ
ード２に接続した以外は第１図と同じ構成を有してい
る。
このようにして、半導体チップ５の寸法が変更になっ
ても絶縁基板１の寸法を変更せずに対応でき、金属細線
の長さを4mm以下に押えて金属細線の曲りやワイヤ流れ
の発生を防止できる。
また、電極パッド７と接続リード２との接続の組合せ
を一部入れ替えることも可能で、リード側信号のレイア
ウト変更に対し半導体チップ５の拡散工程でのマスクを
変更することなく容易に回路接続の変更が出来る効果が
ある。
なお、第１図及び第２図では、前記接続基板が２層配
線されたものについて説明したが、そのスルーホールの
位置、及び接続リード２のパターンの工夫、あるいは３
層以上の多層基板を考えれば、更に複雑な配線レイアウ
トに対しても対応可能となる。
〔発明の効果〕
以上説明したように本発明は、アイランド上に接続基
板を設け、接続基板上に設けた接続リードを介して半導
体チップと内部リードを接続することによって、従来の
方式では不可能であった600ピン以上、800ピン程度迄の
外部リード数を有する樹脂封止型半導体装置を実現でき
るという効果を有する。
【図面の簡単な説明】
第１図（ａ）〜（ｃ）は本発明に関係のある半導体装置
の途中工程における中間製品の平面図とＡ部拡大図及び
Ｂ−Ｂ′線断面図、第１図（ｄ）はその半導体装置の断
面図、第２図（ａ），（ｂ）は本発明の実施例の半導体
装置の途中工程における中間製品の平面図及び断面図で
ある。 １……絶縁基板、２……接続リード、３……アイラン
ド、４……接着剤、５……半導体チップ、６……接着
剤、７……電極パッド、８……金属細線、９……内部リ
ード、10……金属配線、11……樹脂体、12……外部リー
ド、13……接続電極。

Claims (1)

    (57)【特許請求の範囲】
  1. 【請求項１】絶縁基板の中央部に素子載置部を設け、前
    記素子載置部の周囲に配置しかつスルーホールを介して
    接続することにより多層配線構造になっている接続リー
    ドを設けた接続基板と、前記接続基板を搭載したアイラ
    ンドと、前記素子載置部に搭載した半導体チップと、前
    記半導体チップに設けられた電極パッドと前記接続リー
    ドの接続箇所を電気的に接続する金属細線と、前記接続
    基板の周囲に配置し前記接続リードと電気的に接続した
    内部リードとを有する樹脂封止型半導体装置であって、
    前記接続箇所の配列と前記電極パッドの配列との間の前
    記接続基板の領域に複数の接続電極をマトリックス状に
    配置し、前記金属細線が前記電極パッドに一端を接続
    し、その中間を切断することなくそれぞれ選ばれた前記
    接続電極に接続し、前記接続リードの接続箇所に他端を
    接続していることを特徴とする樹脂封止型半導体装置。
JP1016724A 1989-01-25 1989-01-25 樹脂封止型半導体装置 Expired - Lifetime JP2745628B2 (ja)

Priority Applications (1)

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JP2745628B2 true JP2745628B2 (ja) 1998-04-28

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065647A (ja) * 1992-06-24 1994-01-14 Nec Kyushu Ltd 半導体装置
JP4570868B2 (ja) * 2003-12-26 2010-10-27 ルネサスエレクトロニクス株式会社 半導体装置
JP2007103423A (ja) * 2005-09-30 2007-04-19 Renesas Technology Corp 半導体装置及びその製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62101064A (ja) * 1985-10-26 1987-05-11 Sumitomo Electric Ind Ltd 高密度集積回路装置
JPS62173749A (ja) * 1986-01-27 1987-07-30 Mitsubishi Electric Corp 半導体装置
JPS6316455U (ja) * 1986-07-17 1988-02-03

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