JP4567073B2 - 回路基板の製造方法 - Google Patents
回路基板の製造方法 Download PDFInfo
- Publication number
- JP4567073B2 JP4567073B2 JP2008131852A JP2008131852A JP4567073B2 JP 4567073 B2 JP4567073 B2 JP 4567073B2 JP 2008131852 A JP2008131852 A JP 2008131852A JP 2008131852 A JP2008131852 A JP 2008131852A JP 4567073 B2 JP4567073 B2 JP 4567073B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- circuit
- resist layer
- hole
- circuit element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 230000007547 defect Effects 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 230000001681 protective effect Effects 0.000 claims description 27
- 230000002950 deficient Effects 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 2
- 239000011888 foil Substances 0.000 description 40
- 239000000758 substrate Substances 0.000 description 39
- 238000007689 inspection Methods 0.000 description 24
- 238000000034 method Methods 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
Description
12×13=156個
の個別回路装置が取れる。また、スルーホール電極16は1つの個別回路装置に対して、縦に7個、横に8個を配列する。これにより、1枚の回路基板1の行方向には
(7個×12)×(13行+1)=1,176個
のスルーホール電極16が配置されており、列方向には
(8個×13)×(12列+1)=1,352個
のスルーホール電極16が配置されており、全部で2,528個ものスルーホール電極が配置されている。尚、図1では実際の個数よりも少なく簡略化して図示している。
2 位置合わせ孔
10 絶縁基板
11 第1の導電箔
12 第2の導電箔
13 導電パターン
13a 配線路
14 ボンディングパッド
15 回路素子載置領域
16 スルーホール電極
16a スルーホール
17 導電性金属層
18 レジスト層
19 回路素子
20 保護樹脂層
21 個別回路装置
22 半田
23 プリント基板
24 導電パターン
30 検査機
31 上側ケース
32 下側ケース
33 気密室
34 ガスケット
35 差圧計
Claims (2)
- 回路基板に多数個の回路素子載置領域を配列し、該回路素子載置領域の周辺に多数のスルーホール電極を形成し、
前記スルーホール電極の少なくとも一端をレジスト層で覆い、
前記回路基板の上面及び下面を挟持して気密室を形成し、前記気密室の上側より加圧した空気を送り一定時間保持し、前記気密室の上側と下側の差圧を測定し、前記レジスト層の前記スルーホール電極に連なる剥がれ、破れ、あるいはピンホールなどの欠陥の有無を検出し、
前記欠陥のない前記回路基板に前記回路素子を組み込み、回路素子を被覆する保護樹脂層を付着し、前記レジスト層から前記スルーホール電極への前記保護樹脂の流入を防止することを特徴とする回路基板の製造方法。 - 前記気密室の上側から前記気密室の下側へのリーク圧が5Pa以下を良品と判定することを特徴とする請求項1に記載の回路基板の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008131852A JP4567073B2 (ja) | 2008-05-20 | 2008-05-20 | 回路基板の製造方法 |
TW098108880A TWI395534B (zh) | 2008-05-20 | 2009-03-19 | 電路基板之製造方法 |
KR1020090028832A KR101060900B1 (ko) | 2008-05-20 | 2009-04-03 | 회로 기판의 제조 방법 |
CN2009101338372A CN101587843B (zh) | 2008-05-20 | 2009-04-03 | 电路基板的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008131852A JP4567073B2 (ja) | 2008-05-20 | 2008-05-20 | 回路基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009283546A JP2009283546A (ja) | 2009-12-03 |
JP4567073B2 true JP4567073B2 (ja) | 2010-10-20 |
Family
ID=41372009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008131852A Active JP4567073B2 (ja) | 2008-05-20 | 2008-05-20 | 回路基板の製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4567073B2 (ja) |
KR (1) | KR101060900B1 (ja) |
CN (1) | CN101587843B (ja) |
TW (1) | TWI395534B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104284513B (zh) * | 2013-07-04 | 2019-02-12 | 大陆汽车电子(长春)有限公司 | 印刷电路板 |
KR101581463B1 (ko) * | 2014-10-28 | 2015-12-31 | 서울과학기술대학교 산학협력단 | 창호의 기밀성 및 단열성 측정장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0918120A (ja) * | 1995-06-29 | 1997-01-17 | Nec Corp | 印刷配線板およびその製造方法 |
JPH09129780A (ja) * | 1995-09-01 | 1997-05-16 | Canon Inc | Icパッケージ、光センサicパッケージおよびこれらの組立方法 |
JPH10135492A (ja) * | 1996-10-29 | 1998-05-22 | Citizen Electron Co Ltd | スルーホール電極付き電子部品およびその製造方法 |
JP2001068799A (ja) * | 1999-08-30 | 2001-03-16 | Kyocera Corp | 多数個取りセラミック配線基板 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100722608B1 (ko) | 2005-06-30 | 2007-05-28 | 삼성전기주식회사 | 인쇄회로기판의 검사방법 |
TWI395520B (zh) * | 2006-06-07 | 2013-05-01 | Nichigo Morton Co Ltd | 疊層裝置及利用此疊層裝置之疊層方法 |
-
2008
- 2008-05-20 JP JP2008131852A patent/JP4567073B2/ja active Active
-
2009
- 2009-03-19 TW TW098108880A patent/TWI395534B/zh not_active IP Right Cessation
- 2009-04-03 CN CN2009101338372A patent/CN101587843B/zh not_active Expired - Fee Related
- 2009-04-03 KR KR1020090028832A patent/KR101060900B1/ko not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0918120A (ja) * | 1995-06-29 | 1997-01-17 | Nec Corp | 印刷配線板およびその製造方法 |
JPH09129780A (ja) * | 1995-09-01 | 1997-05-16 | Canon Inc | Icパッケージ、光センサicパッケージおよびこれらの組立方法 |
JPH10135492A (ja) * | 1996-10-29 | 1998-05-22 | Citizen Electron Co Ltd | スルーホール電極付き電子部品およびその製造方法 |
JP2001068799A (ja) * | 1999-08-30 | 2001-03-16 | Kyocera Corp | 多数個取りセラミック配線基板 |
Also Published As
Publication number | Publication date |
---|---|
TW200950630A (en) | 2009-12-01 |
JP2009283546A (ja) | 2009-12-03 |
KR101060900B1 (ko) | 2011-08-30 |
CN101587843B (zh) | 2011-06-22 |
KR20090121193A (ko) | 2009-11-25 |
CN101587843A (zh) | 2009-11-25 |
TWI395534B (zh) | 2013-05-01 |
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