JP4564977B2 - 感光性樹脂組成物、レジストパターンの製造方法、積層体、及びデバイス - Google Patents

感光性樹脂組成物、レジストパターンの製造方法、積層体、及びデバイス Download PDF

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Publication number
JP4564977B2
JP4564977B2 JP2007099547A JP2007099547A JP4564977B2 JP 4564977 B2 JP4564977 B2 JP 4564977B2 JP 2007099547 A JP2007099547 A JP 2007099547A JP 2007099547 A JP2007099547 A JP 2007099547A JP 4564977 B2 JP4564977 B2 JP 4564977B2
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Japan
Prior art keywords
resin composition
resist layer
photosensitive resin
thick
pattern
Prior art date
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JP2007099547A
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English (en)
Japanese (ja)
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JP2008256980A (ja
Inventor
尊博 先崎
篤史 山之内
潤造 米倉
博 新堀
宏二 斎藤
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Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
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Priority to JP2007099547A priority Critical patent/JP4564977B2/ja
Priority to PCT/JP2008/055778 priority patent/WO2008126680A1/fr
Publication of JP2008256980A publication Critical patent/JP2008256980A/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2007099547A 2007-04-05 2007-04-05 感光性樹脂組成物、レジストパターンの製造方法、積層体、及びデバイス Active JP4564977B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007099547A JP4564977B2 (ja) 2007-04-05 2007-04-05 感光性樹脂組成物、レジストパターンの製造方法、積層体、及びデバイス
PCT/JP2008/055778 WO2008126680A1 (fr) 2007-04-05 2008-03-26 Composition de résine photosensible, procédé de production de motif de réserve, produit disposé en couches et dispositif

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007099547A JP4564977B2 (ja) 2007-04-05 2007-04-05 感光性樹脂組成物、レジストパターンの製造方法、積層体、及びデバイス

Publications (2)

Publication Number Publication Date
JP2008256980A JP2008256980A (ja) 2008-10-23
JP4564977B2 true JP4564977B2 (ja) 2010-10-20

Family

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JP2007099547A Active JP4564977B2 (ja) 2007-04-05 2007-04-05 感光性樹脂組成物、レジストパターンの製造方法、積層体、及びデバイス

Country Status (2)

Country Link
JP (1) JP4564977B2 (fr)
WO (1) WO2008126680A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9891524B2 (en) 2015-01-23 2018-02-13 Kabushiki Kaisha Toshiba Semiconductor device and method of manufacturing the same

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5137673B2 (ja) * 2008-04-26 2013-02-06 日本化薬株式会社 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物
JP5247396B2 (ja) * 2008-07-02 2013-07-24 日本化薬株式会社 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物
JP5650386B2 (ja) * 2009-08-11 2015-01-07 太陽ホールディングス株式会社 積層構造物及びその製造方法
EP2531891B1 (fr) 2010-02-05 2020-04-15 Canon Kabushiki Kaisha Composition de résine photosensible négative, procédé de formation de motif et tête d'évacuation de liquide
US8980968B2 (en) 2010-02-05 2015-03-17 Canon Kabushiki Kaisha Photosensitive resin composition, method for producing structure, and liquid discharge head
JP5473645B2 (ja) 2010-02-05 2014-04-16 キヤノン株式会社 感光性樹脂組成物及び液体吐出ヘッド
JP5787720B2 (ja) * 2010-12-16 2015-09-30 キヤノン株式会社 感光性ネガ型樹脂組成物
JP6120574B2 (ja) 2012-01-31 2017-04-26 キヤノン株式会社 感光性ネガ型樹脂組成物、微細構造体、微細構造体の製造方法及び液体吐出ヘッド
JP6071718B2 (ja) 2013-04-10 2017-02-01 キヤノン株式会社 感光性ネガ型樹脂組成物
JP6193715B2 (ja) * 2013-10-08 2017-09-06 キヤノン株式会社 液体吐出ヘッド
WO2022190208A1 (fr) * 2021-03-09 2022-09-15 昭和電工マテリアルズ株式会社 Film photosensible, élément photosensible et procédé de production d'un corps multicouche

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10226707A (ja) * 1996-10-03 1998-08-25 Alain Vallee ポリイオン性ポリマー化合物、その製造方法及び光開始剤としての使用
JP2000119306A (ja) * 1998-03-20 2000-04-25 Nippon Soda Co Ltd ヨ―ドニウム塩化合物を含有する光硬化性組成物
JP2000239648A (ja) * 1999-02-19 2000-09-05 Jsr Corp 光カチオン重合用光増感剤および光カチオン重合方法
JP2003082318A (ja) * 2001-09-13 2003-03-19 Three M Innovative Properties Co カチオン重合性接着剤組成物及び異方導電性接着剤組成物
US20050113474A1 (en) * 2003-11-26 2005-05-26 3M Innovative Properties Company Cationically curable composition
JP2007148208A (ja) * 2005-11-30 2007-06-14 Sumitomo Chemical Co Ltd 感放射線性樹脂組成物
JP2008037980A (ja) * 2006-08-04 2008-02-21 Toyo Ink Mfg Co Ltd 感エネルギー線酸発生組成物、酸の発生方法、および感エネルギー線硬化性組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4474248B2 (ja) * 2004-09-15 2010-06-02 富士フイルム株式会社 感光性組成物及び該感光性組成物を用いたパターン形成方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10226707A (ja) * 1996-10-03 1998-08-25 Alain Vallee ポリイオン性ポリマー化合物、その製造方法及び光開始剤としての使用
JP2000119306A (ja) * 1998-03-20 2000-04-25 Nippon Soda Co Ltd ヨ―ドニウム塩化合物を含有する光硬化性組成物
JP2000239648A (ja) * 1999-02-19 2000-09-05 Jsr Corp 光カチオン重合用光増感剤および光カチオン重合方法
JP2003082318A (ja) * 2001-09-13 2003-03-19 Three M Innovative Properties Co カチオン重合性接着剤組成物及び異方導電性接着剤組成物
US20050113474A1 (en) * 2003-11-26 2005-05-26 3M Innovative Properties Company Cationically curable composition
JP2007512414A (ja) * 2003-11-26 2007-05-17 スリーエム イノベイティブ プロパティズ カンパニー カチオン硬化性組成物
JP2007148208A (ja) * 2005-11-30 2007-06-14 Sumitomo Chemical Co Ltd 感放射線性樹脂組成物
JP2008037980A (ja) * 2006-08-04 2008-02-21 Toyo Ink Mfg Co Ltd 感エネルギー線酸発生組成物、酸の発生方法、および感エネルギー線硬化性組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9891524B2 (en) 2015-01-23 2018-02-13 Kabushiki Kaisha Toshiba Semiconductor device and method of manufacturing the same

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Publication number Publication date
WO2008126680A1 (fr) 2008-10-23
JP2008256980A (ja) 2008-10-23

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