WO2008126680A1 - Composition de résine photosensible, procédé de production de motif de réserve, produit disposé en couches et dispositif - Google Patents

Composition de résine photosensible, procédé de production de motif de réserve, produit disposé en couches et dispositif Download PDF

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Publication number
WO2008126680A1
WO2008126680A1 PCT/JP2008/055778 JP2008055778W WO2008126680A1 WO 2008126680 A1 WO2008126680 A1 WO 2008126680A1 JP 2008055778 W JP2008055778 W JP 2008055778W WO 2008126680 A1 WO2008126680 A1 WO 2008126680A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
photosensitive resin
resist pattern
layered product
producing resist
Prior art date
Application number
PCT/JP2008/055778
Other languages
English (en)
Japanese (ja)
Inventor
Takahiro Senzaki
Atsushi Yamanouchi
Junzo Yonekura
Hiroshi Shinbori
Koji Saito
Original Assignee
Tokyo Ohka Kogyo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co., Ltd. filed Critical Tokyo Ohka Kogyo Co., Ltd.
Publication of WO2008126680A1 publication Critical patent/WO2008126680A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)

Abstract

L'invention se rapporte à une composition de résine photosensible extrêmement sûre, très sensible, et qui peut donner un motif de réserve fin ayant une excellente stabilité chimique. Cette composition comprend : (a) une résine époxy polyfonctionnelle, (b) un initiateur de polymérisation cationique incluant un sel d'onium dont les anions ont une structure spécifique, et (d) un sensibilisateur.
PCT/JP2008/055778 2007-04-05 2008-03-26 Composition de résine photosensible, procédé de production de motif de réserve, produit disposé en couches et dispositif WO2008126680A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007099547A JP4564977B2 (ja) 2007-04-05 2007-04-05 感光性樹脂組成物、レジストパターンの製造方法、積層体、及びデバイス
JP2007-099547 2007-04-05

Publications (1)

Publication Number Publication Date
WO2008126680A1 true WO2008126680A1 (fr) 2008-10-23

Family

ID=39863791

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055778 WO2008126680A1 (fr) 2007-04-05 2008-03-26 Composition de résine photosensible, procédé de production de motif de réserve, produit disposé en couches et dispositif

Country Status (2)

Country Link
JP (1) JP4564977B2 (fr)
WO (1) WO2008126680A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104512113A (zh) * 2013-10-08 2015-04-15 佳能株式会社 液体排出头

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5137673B2 (ja) * 2008-04-26 2013-02-06 日本化薬株式会社 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物
JP5247396B2 (ja) * 2008-07-02 2013-07-24 日本化薬株式会社 Ｍｅｍｓ用感光性樹脂組成物及びその硬化物
JP5650386B2 (ja) * 2009-08-11 2015-01-07 太陽ホールディングス株式会社 積層構造物及びその製造方法
JP5473645B2 (ja) 2010-02-05 2014-04-16 キヤノン株式会社 感光性樹脂組成物及び液体吐出ヘッド
CN102741749B (zh) 2010-02-05 2014-10-08 佳能株式会社 负型感光性树脂组合物、图案形成方法和液体排出头
US8980968B2 (en) 2010-02-05 2015-03-17 Canon Kabushiki Kaisha Photosensitive resin composition, method for producing structure, and liquid discharge head
JP5787720B2 (ja) * 2010-12-16 2015-09-30 キヤノン株式会社 感光性ネガ型樹脂組成物
JP6120574B2 (ja) 2012-01-31 2017-04-26 キヤノン株式会社 感光性ネガ型樹脂組成物、微細構造体、微細構造体の製造方法及び液体吐出ヘッド
JP6071718B2 (ja) 2013-04-10 2017-02-01 キヤノン株式会社 感光性ネガ型樹脂組成物
JP2016136200A (ja) 2015-01-23 2016-07-28 株式会社東芝 半導体装置及び半導体装置の製造方法
WO2022190208A1 (fr) * 2021-03-09 2022-09-15 昭和電工マテリアルズ株式会社 Film photosensible, élément photosensible et procédé de production d'un corps multicouche

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000119306A (ja) * 1998-03-20 2000-04-25 Nippon Soda Co Ltd ヨ―ドニウム塩化合物を含有する光硬化性組成物
JP2000239648A (ja) * 1999-02-19 2000-09-05 Jsr Corp 光カチオン重合用光増感剤および光カチオン重合方法
JP2003082318A (ja) * 2001-09-13 2003-03-19 Three M Innovative Properties Co カチオン重合性接着剤組成物及び異方導電性接着剤組成物
US20050113474A1 (en) * 2003-11-26 2005-05-26 3M Innovative Properties Company Cationically curable composition
JP2006084660A (ja) * 2004-09-15 2006-03-30 Fuji Photo Film Co Ltd 感光性組成物及び該感光性組成物を用いたパターン形成方法
JP2007148208A (ja) * 2005-11-30 2007-06-14 Sumitomo Chemical Co Ltd 感放射線性樹脂組成物
JP2008037980A (ja) * 2006-08-04 2008-02-21 Toyo Ink Mfg Co Ltd 感エネルギー線酸発生組成物、酸の発生方法、および感エネルギー線硬化性組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2187046A1 (fr) * 1996-10-03 1998-04-03 Alain Vallee Sulfonylimidures et sulfonylmethylures, leur utilisation comme photoinitiateur

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000119306A (ja) * 1998-03-20 2000-04-25 Nippon Soda Co Ltd ヨ―ドニウム塩化合物を含有する光硬化性組成物
JP2000239648A (ja) * 1999-02-19 2000-09-05 Jsr Corp 光カチオン重合用光増感剤および光カチオン重合方法
JP2003082318A (ja) * 2001-09-13 2003-03-19 Three M Innovative Properties Co カチオン重合性接着剤組成物及び異方導電性接着剤組成物
US20050113474A1 (en) * 2003-11-26 2005-05-26 3M Innovative Properties Company Cationically curable composition
JP2006084660A (ja) * 2004-09-15 2006-03-30 Fuji Photo Film Co Ltd 感光性組成物及び該感光性組成物を用いたパターン形成方法
JP2007148208A (ja) * 2005-11-30 2007-06-14 Sumitomo Chemical Co Ltd 感放射線性樹脂組成物
JP2008037980A (ja) * 2006-08-04 2008-02-21 Toyo Ink Mfg Co Ltd 感エネルギー線酸発生組成物、酸の発生方法、および感エネルギー線硬化性組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104512113A (zh) * 2013-10-08 2015-04-15 佳能株式会社 液体排出头

Also Published As

Publication number Publication date
JP4564977B2 (ja) 2010-10-20
JP2008256980A (ja) 2008-10-23

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