WO2008126680A1 - Photosensitive resin composition, process for producing resist pattern, layered product, and device - Google Patents

Photosensitive resin composition, process for producing resist pattern, layered product, and device Download PDF

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Publication number
WO2008126680A1
WO2008126680A1 PCT/JP2008/055778 JP2008055778W WO2008126680A1 WO 2008126680 A1 WO2008126680 A1 WO 2008126680A1 JP 2008055778 W JP2008055778 W JP 2008055778W WO 2008126680 A1 WO2008126680 A1 WO 2008126680A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
photosensitive resin
resist pattern
layered product
producing resist
Prior art date
Application number
PCT/JP2008/055778
Other languages
French (fr)
Japanese (ja)
Inventor
Takahiro Senzaki
Atsushi Yamanouchi
Junzo Yonekura
Hiroshi Shinbori
Koji Saito
Original Assignee
Tokyo Ohka Kogyo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co., Ltd. filed Critical Tokyo Ohka Kogyo Co., Ltd.
Publication of WO2008126680A1 publication Critical patent/WO2008126680A1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)

Abstract

A photosensitive resin composition which is highly safe, has high sensitivity, and can form a fine resist pattern having excellent chemical stability. The photosensitive resin composition comprises (a) a polyfunctional epoxy resin, (b) an initiator for cationic polymerization comprising an onium salt having an anion part of a specific structure, and (d) a sensitizer.
PCT/JP2008/055778 2007-04-05 2008-03-26 Photosensitive resin composition, process for producing resist pattern, layered product, and device WO2008126680A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-099547 2007-04-05
JP2007099547A JP4564977B2 (en) 2007-04-05 2007-04-05 Photosensitive resin composition, method for producing resist pattern, laminate, and device

Publications (1)

Publication Number Publication Date
WO2008126680A1 true WO2008126680A1 (en) 2008-10-23

Family

ID=39863791

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055778 WO2008126680A1 (en) 2007-04-05 2008-03-26 Photosensitive resin composition, process for producing resist pattern, layered product, and device

Country Status (2)

Country Link
JP (1) JP4564977B2 (en)
WO (1) WO2008126680A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104512113A (en) * 2013-10-08 2015-04-15 佳能株式会社 Liquid discharge head

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* Cited by examiner, † Cited by third party
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JP5137673B2 (en) * 2008-04-26 2013-02-06 日本化薬株式会社 Photosensitive resin composition for MEMS and cured product thereof
JP5247396B2 (en) * 2008-07-02 2013-07-24 日本化薬株式会社 Photosensitive resin composition for MEMS and cured product thereof
JP5650386B2 (en) * 2009-08-11 2015-01-07 太陽ホールディングス株式会社 Laminated structure and manufacturing method thereof
JP5473645B2 (en) 2010-02-05 2014-04-16 キヤノン株式会社 Photosensitive resin composition and liquid discharge head
EP2531891B1 (en) 2010-02-05 2020-04-15 Canon Kabushiki Kaisha Negative photosensitive resin composition, pattern formation method, and liquid discharge head
CN102754028B (en) 2010-02-05 2015-06-03 佳能株式会社 Photosensitive resin composition, method for producing structure, and liquid discharge head
JP5787720B2 (en) * 2010-12-16 2015-09-30 キヤノン株式会社 Photosensitive negative resin composition
JP6120574B2 (en) 2012-01-31 2017-04-26 キヤノン株式会社 Photosensitive negative resin composition, fine structure, method for producing fine structure, and liquid discharge head
JP6071718B2 (en) 2013-04-10 2017-02-01 キヤノン株式会社 Photosensitive negative resin composition
JP2016136200A (en) 2015-01-23 2016-07-28 株式会社東芝 Semiconductor device and method for manufacturing semiconductor device
WO2022190208A1 (en) * 2021-03-09 2022-09-15 昭和電工マテリアルズ株式会社 Photosensitive film, photosensitive element and method for producing multilayer body

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000119306A (en) * 1998-03-20 2000-04-25 Nippon Soda Co Ltd Photocurable composition containing iodonium salt compound
JP2000239648A (en) * 1999-02-19 2000-09-05 Jsr Corp Photosensitizer for cationic photopolymerization and cationic photopolymerization method
JP2003082318A (en) * 2001-09-13 2003-03-19 Three M Innovative Properties Co Cationically polymerizable adhesive composition and anisotropically electroconductive adhesive composition
US20050113474A1 (en) * 2003-11-26 2005-05-26 3M Innovative Properties Company Cationically curable composition
JP2006084660A (en) * 2004-09-15 2006-03-30 Fuji Photo Film Co Ltd Photosensitive composition and pattern forming method using the photosensitive composition
JP2007148208A (en) * 2005-11-30 2007-06-14 Sumitomo Chemical Co Ltd Radiation-sensitive resin composition
JP2008037980A (en) * 2006-08-04 2008-02-21 Toyo Ink Mfg Co Ltd Energy ray-sensitive acid generating composition, method for generating acid and energy ray-sensitive curing composition

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2187046A1 (en) * 1996-10-03 1998-04-03 Alain Vallee Sulfonylimides and sulfonylmethylides, use thereof as photoinitiators

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000119306A (en) * 1998-03-20 2000-04-25 Nippon Soda Co Ltd Photocurable composition containing iodonium salt compound
JP2000239648A (en) * 1999-02-19 2000-09-05 Jsr Corp Photosensitizer for cationic photopolymerization and cationic photopolymerization method
JP2003082318A (en) * 2001-09-13 2003-03-19 Three M Innovative Properties Co Cationically polymerizable adhesive composition and anisotropically electroconductive adhesive composition
US20050113474A1 (en) * 2003-11-26 2005-05-26 3M Innovative Properties Company Cationically curable composition
JP2006084660A (en) * 2004-09-15 2006-03-30 Fuji Photo Film Co Ltd Photosensitive composition and pattern forming method using the photosensitive composition
JP2007148208A (en) * 2005-11-30 2007-06-14 Sumitomo Chemical Co Ltd Radiation-sensitive resin composition
JP2008037980A (en) * 2006-08-04 2008-02-21 Toyo Ink Mfg Co Ltd Energy ray-sensitive acid generating composition, method for generating acid and energy ray-sensitive curing composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104512113A (en) * 2013-10-08 2015-04-15 佳能株式会社 Liquid discharge head

Also Published As

Publication number Publication date
JP4564977B2 (en) 2010-10-20
JP2008256980A (en) 2008-10-23

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