JP4559490B2 - 光記録媒体 - Google Patents
光記録媒体 Download PDFInfo
- Publication number
- JP4559490B2 JP4559490B2 JP2007551056A JP2007551056A JP4559490B2 JP 4559490 B2 JP4559490 B2 JP 4559490B2 JP 2007551056 A JP2007551056 A JP 2007551056A JP 2007551056 A JP2007551056 A JP 2007551056A JP 4559490 B2 JP4559490 B2 JP 4559490B2
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- thin film
- film
- additive
- optical recording
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title claims description 27
- 229910052782 aluminium Inorganic materials 0.000 claims description 68
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 64
- 239000010408 film Substances 0.000 claims description 55
- 239000010409 thin film Substances 0.000 claims description 46
- 239000013078 crystal Substances 0.000 claims description 44
- 239000000654 additive Substances 0.000 claims description 27
- 230000000996 additive effect Effects 0.000 claims description 26
- 229910000838 Al alloy Inorganic materials 0.000 claims description 19
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052763 palladium Inorganic materials 0.000 claims description 8
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052707 ruthenium Inorganic materials 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 32
- 238000004544 sputter deposition Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 13
- 229910006404 SnO 2 Inorganic materials 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 239000011241 protective layer Substances 0.000 description 9
- 239000010931 gold Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229910018575 Al—Ti Inorganic materials 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229910001361 White metal Inorganic materials 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 239000010969 white metal Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000975 dye Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- 229910052703 rhodium Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- -1 ZnS or SiO 2 Chemical class 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000005324 grain boundary diffusion Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- 229910006107 GeBiTe Inorganic materials 0.000 description 1
- 229910000618 GeSbTe Inorganic materials 0.000 description 1
- 229910018321 SbTe Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000000987 azo dye Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052976 metal sulfide Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 239000001007 phthalocyanine dye Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
- G11B7/242—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers
- G11B7/243—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers comprising inorganic materials only, e.g. ablative layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/027—Graded interfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
- G11B7/242—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers
- G11B7/243—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers comprising inorganic materials only, e.g. ablative layers
- G11B2007/24302—Metals or metalloids
- G11B2007/2431—Metals or metalloids group 13 elements (B, Al, Ga, In)
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/826—Multilayers, e.g. opaque multilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80523—Multilayers, e.g. opaque multilayers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12021—All metal or with adjacent metals having metal particles having composition or density gradient or differential porosity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
Description
波長400nm程度の青色レーザを情報の記録又は再生に使用する光記録装置においては、金やシリコン薄膜は、それらの記録媒体の反射膜として、青色光に対する吸収が大きいため十分な反射率を得ることができない。また、銀合金は十分な反射率を得ることが可能であるがコストが高くなる。
11…基板
12…反射膜
13…第2保護層
14…記録膜
15…第1保護層
16…樹脂カバー層
−−具体例1−−
本発明による光記録媒体は、これに限定されるものではないが、1つの例として、追記型ディスクについて説明する。
−−具体例2−−
本発明による光記録媒体は、これに限定されるものではないが、1つの例として、再生専用型ディスクについて説明する。
有機EL素子は、透明基板上に、透明電極と、有機EL媒体と、金属電極とが順次積層されて構成される。例えば、有機EL媒体は、有機発光層の単一層、あるいは有機正孔輸送層、有機発光層及び有機電子輸送層の3層構造の媒体、又は有機正孔輸送層及び有機発光層2層構造の媒体、さらにこれらの適切な層間に電子或いは正孔の注入層を挿入した積層体の媒体などである。本発明の多結晶アルミニウム薄膜はかかる金属電極として有効に使用できる。
Claims (3)
- アルミ合金の多結晶からなり、各々の結晶粒子の内部及び前記結晶粒子の界面部中に分布する第一添加物と、前記結晶粒子の内部より高い濃度で前記結晶粒子の界面部において分布する第二添加物と、を含む多結晶アルミニウム薄膜の反射膜を有する光記録媒体であって、前記第一添加物がSnもしくはその酸化物であり、前記第二添加物がPd、Pt、Ru、Rhのうちの少なくとも1であることを特徴とする光記録媒体。
- 前記結晶粒子及びその界面部の全体を覆う酸化アルミニウム層を有することを特徴とする請求項1に記載の光記録媒体。
- 前記アルミ合金の多結晶は、47nm以下の平均結晶粒径を有することを特徴とする請求項1又は2に記載の光記録媒体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005369499 | 2005-12-22 | ||
JP2005369499 | 2005-12-22 | ||
PCT/JP2006/324952 WO2007072732A1 (ja) | 2005-12-22 | 2006-12-14 | 多結晶アルミニウム薄膜及び光記録媒体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007072732A1 JPWO2007072732A1 (ja) | 2009-05-28 |
JP4559490B2 true JP4559490B2 (ja) | 2010-10-06 |
Family
ID=38188513
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007551056A Expired - Fee Related JP4559490B2 (ja) | 2005-12-22 | 2006-12-14 | 光記録媒体 |
Country Status (4)
Country | Link |
---|---|
US (2) | US7790064B2 (ja) |
JP (1) | JP4559490B2 (ja) |
TW (1) | TW200731251A (ja) |
WO (1) | WO2007072732A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5012984B2 (ja) * | 2008-09-22 | 2012-08-29 | Tdk株式会社 | 光メディアの反射層用スパッタリングターゲット、及び、その製造方法 |
CN102804457B (zh) * | 2009-06-09 | 2015-11-25 | 3M创新有限公司 | 薄膜合金电极 |
JP5354199B2 (ja) * | 2009-10-19 | 2013-11-27 | 三菱マテリアル株式会社 | 光記録媒体用アルミニウム合金反射膜およびこの反射膜を形成するためのスパッタリングターゲット |
WO2024042571A1 (ja) * | 2022-08-22 | 2024-02-29 | シャープディスプレイテクノロジー株式会社 | 発光素子、表示装置、および発光素子の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06163706A (ja) * | 1992-11-25 | 1994-06-10 | Kawasaki Steel Corp | 金属膜の形成方法 |
JPH08100255A (ja) * | 1994-09-30 | 1996-04-16 | Mitsubishi Materials Corp | 薄膜トランジスタの薄膜形成用スパッタリングターゲット材 |
JP2002050091A (ja) * | 2000-07-28 | 2002-02-15 | Sony Corp | 光磁気記録媒体 |
JP2003030901A (ja) * | 2001-07-16 | 2003-01-31 | Sumitomo Metal Mining Co Ltd | 光記録ディスク反射膜形成用アルミニウム合金 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4040822A (en) * | 1974-01-10 | 1977-08-09 | Alloy Metals, Inc. | Aluminum base fluxless brazing alloy |
JP2880190B2 (ja) | 1989-08-31 | 1999-04-05 | 東芝イーエムアイ株式会社 | 光学反射膜およびその製法 |
JP2898112B2 (ja) | 1991-03-07 | 1999-05-31 | 株式会社神戸製鋼所 | 組成均一性に優れる光学式記録媒体の反射膜用Al合金薄膜形成用溶製Al合金スパッタリングターゲット |
JP3379049B2 (ja) * | 1993-10-27 | 2003-02-17 | 富士通株式会社 | 表面弾性波素子とその製造方法 |
DE19621400C2 (de) * | 1996-05-28 | 2000-07-06 | Siemens Ag | Herstellverfahren für eine Aluminiumschicht oder Aluminiumleiterbahnen |
AT407532B (de) * | 1998-07-29 | 2001-04-25 | Miba Gleitlager Ag | Verbundwerkstoff aus zumindest zwei schichten |
FR2796654B1 (fr) * | 1999-07-19 | 2001-10-05 | Stephanois Rech Mec | Alliage aluminium-titane a reflectivite speculaire elevee, revetements reflecteurs comprenant un tel alliage et miroirs et pieces comportant ce revetement |
US6501728B2 (en) | 2000-04-21 | 2002-12-31 | Sony Corporation | Optical disc having groove and land tracks |
JP3365762B2 (ja) | 2000-04-28 | 2003-01-14 | 株式会社神戸製鋼所 | 光情報記録媒体用の反射層または半透明反射層、光情報記録媒体及び光情報記録媒体用スパッタリングターゲット |
EP1205217A3 (en) * | 2000-11-09 | 2004-01-02 | Radi Medical Technologies AB | Structure of miniature X-ray source |
JP4783525B2 (ja) * | 2001-08-31 | 2011-09-28 | 株式会社アルバック | 薄膜アルミニウム合金及び薄膜アルミニウム合金形成用スパッタリングターゲット |
JP3655907B2 (ja) | 2002-08-20 | 2005-06-02 | 株式会社神戸製鋼所 | 光情報記録媒体用反射膜と半透過反射膜、および光情報記録媒体 |
US6902699B2 (en) * | 2002-10-02 | 2005-06-07 | The Boeing Company | Method for preparing cryomilled aluminum alloys and components extruded and forged therefrom |
US7435306B2 (en) * | 2003-01-22 | 2008-10-14 | The Boeing Company | Method for preparing rivets from cryomilled aluminum alloys and rivets produced thereby |
-
2006
- 2006-12-14 JP JP2007551056A patent/JP4559490B2/ja not_active Expired - Fee Related
- 2006-12-14 WO PCT/JP2006/324952 patent/WO2007072732A1/ja active Application Filing
- 2006-12-14 US US12/158,867 patent/US7790064B2/en not_active Expired - Fee Related
- 2006-12-19 TW TW095147589A patent/TW200731251A/zh unknown
-
2010
- 2010-06-18 US US12/818,562 patent/US7897065B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06163706A (ja) * | 1992-11-25 | 1994-06-10 | Kawasaki Steel Corp | 金属膜の形成方法 |
JPH08100255A (ja) * | 1994-09-30 | 1996-04-16 | Mitsubishi Materials Corp | 薄膜トランジスタの薄膜形成用スパッタリングターゲット材 |
JP2002050091A (ja) * | 2000-07-28 | 2002-02-15 | Sony Corp | 光磁気記録媒体 |
JP2003030901A (ja) * | 2001-07-16 | 2003-01-31 | Sumitomo Metal Mining Co Ltd | 光記録ディスク反射膜形成用アルミニウム合金 |
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US20090272947A1 (en) | 2009-11-05 |
US7897065B2 (en) | 2011-03-01 |
JPWO2007072732A1 (ja) | 2009-05-28 |
US7790064B2 (en) | 2010-09-07 |
TW200731251A (en) | 2007-08-16 |
US20100310895A1 (en) | 2010-12-09 |
WO2007072732A1 (ja) | 2007-06-28 |
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