JP4557136B2 - 熱伝導性シリコーンゴム組成物及び成型品 - Google Patents

熱伝導性シリコーンゴム組成物及び成型品 Download PDF

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Publication number
JP4557136B2
JP4557136B2 JP2004143977A JP2004143977A JP4557136B2 JP 4557136 B2 JP4557136 B2 JP 4557136B2 JP 2004143977 A JP2004143977 A JP 2004143977A JP 2004143977 A JP2004143977 A JP 2004143977A JP 4557136 B2 JP4557136 B2 JP 4557136B2
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component
integer
group
silicone rubber
parts
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Expired - Lifetime
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JP2004143977A
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English (en)
Japanese (ja)
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JP2005325211A (ja
Inventor
智幸 後藤
敬 三好
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority to JP2004143977A priority Critical patent/JP4557136B2/ja
Priority to TW094115406A priority patent/TW200609282A/zh
Priority to KR1020050039678A priority patent/KR101237558B1/ko
Priority to US11/127,282 priority patent/US7547743B2/en
Publication of JP2005325211A publication Critical patent/JP2005325211A/ja
Application granted granted Critical
Publication of JP4557136B2 publication Critical patent/JP4557136B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
JP2004143977A 2004-05-13 2004-05-13 熱伝導性シリコーンゴム組成物及び成型品 Expired - Lifetime JP4557136B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004143977A JP4557136B2 (ja) 2004-05-13 2004-05-13 熱伝導性シリコーンゴム組成物及び成型品
TW094115406A TW200609282A (en) 2004-05-13 2005-05-12 Heat-conductive silicone rubber composition and molded article
KR1020050039678A KR101237558B1 (ko) 2004-05-13 2005-05-12 열전도성 실리콘 고무 조성물 및 성형품
US11/127,282 US7547743B2 (en) 2004-05-13 2005-05-12 Heat conductive silicone rubber composition and molded article

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004143977A JP4557136B2 (ja) 2004-05-13 2004-05-13 熱伝導性シリコーンゴム組成物及び成型品

Publications (2)

Publication Number Publication Date
JP2005325211A JP2005325211A (ja) 2005-11-24
JP4557136B2 true JP4557136B2 (ja) 2010-10-06

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US (1) US7547743B2 (OSRAM)
JP (1) JP4557136B2 (OSRAM)
KR (1) KR101237558B1 (OSRAM)
TW (1) TW200609282A (OSRAM)

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US20030168731A1 (en) * 2002-03-11 2003-09-11 Matayabas James Christopher Thermal interface material and method of fabricating the same
JP4557137B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
US20070219312A1 (en) * 2006-03-17 2007-09-20 Jennifer Lynn David Silicone adhesive composition and method for preparing the same
JP5410762B2 (ja) * 2006-12-28 2014-02-05 東レ・ダウコーニング株式会社 加熱硬化性シリコーンゴム組成物
JP2008239719A (ja) * 2007-03-26 2008-10-09 Dow Corning Toray Co Ltd シリコーンエラストマー組成物およびシリコーンエラストマー
KR100982161B1 (ko) 2008-05-26 2010-09-14 장암엘에스 주식회사 전자 소자 절연 봉지용 실리콘 조성물
KR20110133608A (ko) * 2009-03-12 2011-12-13 다우 코닝 코포레이션 열계면 물질 및 이의 제조 및 사용을 위한 방법
JP5606104B2 (ja) * 2009-03-23 2014-10-15 株式会社アドマテックス 紫外線反射組成物及び紫外線反射成形品
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JP5365572B2 (ja) * 2010-04-13 2013-12-11 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP5553006B2 (ja) * 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
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JP5912600B2 (ja) * 2011-09-16 2016-04-27 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP2013159671A (ja) * 2012-02-02 2013-08-19 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、その硬化物、および光半導体装置
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JP6149831B2 (ja) * 2014-09-04 2017-06-21 信越化学工業株式会社 シリコーン組成物
JP6217588B2 (ja) * 2014-10-23 2017-10-25 信越化学工業株式会社 熱伝導性シリコーンポッティング組成物
JP6260519B2 (ja) 2014-11-25 2018-01-17 信越化学工業株式会社 一液付加硬化型シリコーン組成物の保存方法及び硬化方法
JP6388072B2 (ja) * 2015-03-02 2018-09-12 信越化学工業株式会社 熱伝導性シリコーン組成物
JP6524879B2 (ja) * 2015-10-13 2019-06-05 信越化学工業株式会社 付加一液硬化型熱伝導性シリコーングリース組成物
PL3458509T3 (pl) * 2016-05-16 2022-11-28 Martinswerk Gmbh Produkt w postaci tlenku glinu i jego zastosowanie w kompozycjach polimerowych o wysokiej przewodności cieplnej
US10501671B2 (en) * 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
JP6874366B2 (ja) * 2016-12-28 2021-05-19 信越化学工業株式会社 シリコーン組成物およびその硬化物
PL3580790T3 (pl) 2017-02-08 2024-10-28 Elkem Silicones USA Corp. Pakiet baterii wtórnych o ulepszonym zarządzaniu termicznym
KR101864534B1 (ko) * 2017-03-31 2018-06-04 주식회사 케이씨씨 방열 겔형 실리콘 고무 조성물
CN111094458B (zh) 2017-07-24 2022-03-29 陶氏东丽株式会社 导热性硅酮凝胶组合物、导热性部件及散热构造体
US10344194B2 (en) 2017-09-27 2019-07-09 Momentive Performance Materials Inc. Thermal interface composition comprising ionically modified siloxane
EP3688097B1 (en) * 2017-09-29 2024-05-15 Dow Silicones Corporation Silicone composition comprising filler
EP3688111A4 (en) * 2017-09-29 2021-07-28 Dow Silicones Corporation THERMAL CONDUCTIVE COMPOSITION
JP2019077843A (ja) * 2017-10-27 2019-05-23 信越化学工業株式会社 熱伝導性シリコーンポッティング組成物およびその硬化物
IT201800003535A1 (it) * 2018-03-14 2019-09-14 Getters Spa Composizione chimica distribuibile con elevata quantità di materiale di carica e bassi livelli di indice tixotropico
CN112839999B (zh) * 2018-10-16 2022-07-05 信越化学工业株式会社 Led前照灯用加成固化型液体硅橡胶组合物和led前照灯
EP3898813B1 (de) 2018-12-20 2024-10-30 Envalior Deutschland GmbH Polyesterzusammensetzungen
EP3670589A1 (de) 2018-12-20 2020-06-24 LANXESS Deutschland GmbH Polyamidzusammensetzungen
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CN111635636A (zh) * 2020-06-29 2020-09-08 佛山(华南)新材料研究院 一种耐老化的高导热垫片的制备方法
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Also Published As

Publication number Publication date
US7547743B2 (en) 2009-06-16
KR101237558B1 (ko) 2013-02-26
KR20060047809A (ko) 2006-05-18
US20050256259A1 (en) 2005-11-17
JP2005325211A (ja) 2005-11-24
TW200609282A (en) 2006-03-16
TWI377225B (OSRAM) 2012-11-21

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