TWI377225B - - Google Patents

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Publication number
TWI377225B
TWI377225B TW094115406A TW94115406A TWI377225B TW I377225 B TWI377225 B TW I377225B TW 094115406 A TW094115406 A TW 094115406A TW 94115406 A TW94115406 A TW 94115406A TW I377225 B TWI377225 B TW I377225B
Authority
TW
Taiwan
Application number
TW094115406A
Other languages
Chinese (zh)
Other versions
TW200609282A (en
Inventor
Tomoyuki Goto
Kei Miyoshi
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200609282A publication Critical patent/TW200609282A/zh
Application granted granted Critical
Publication of TWI377225B publication Critical patent/TWI377225B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
TW094115406A 2004-05-13 2005-05-12 Heat-conductive silicone rubber composition and molded article TW200609282A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004143977A JP4557136B2 (ja) 2004-05-13 2004-05-13 熱伝導性シリコーンゴム組成物及び成型品

Publications (2)

Publication Number Publication Date
TW200609282A TW200609282A (en) 2006-03-16
TWI377225B true TWI377225B (OSRAM) 2012-11-21

Family

ID=35310268

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094115406A TW200609282A (en) 2004-05-13 2005-05-12 Heat-conductive silicone rubber composition and molded article

Country Status (4)

Country Link
US (1) US7547743B2 (OSRAM)
JP (1) JP4557136B2 (OSRAM)
KR (1) KR101237558B1 (OSRAM)
TW (1) TW200609282A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI667291B (zh) * 2015-03-02 2019-08-01 日商信越化學工業股份有限公司 Thermally conductive fluorenone composition

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US20030168731A1 (en) * 2002-03-11 2003-09-11 Matayabas James Christopher Thermal interface material and method of fabricating the same
JP4557137B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
US20070219312A1 (en) * 2006-03-17 2007-09-20 Jennifer Lynn David Silicone adhesive composition and method for preparing the same
JP5410762B2 (ja) * 2006-12-28 2014-02-05 東レ・ダウコーニング株式会社 加熱硬化性シリコーンゴム組成物
JP2008239719A (ja) * 2007-03-26 2008-10-09 Dow Corning Toray Co Ltd シリコーンエラストマー組成物およびシリコーンエラストマー
KR100982161B1 (ko) 2008-05-26 2010-09-14 장암엘에스 주식회사 전자 소자 절연 봉지용 실리콘 조성물
KR20110133608A (ko) * 2009-03-12 2011-12-13 다우 코닝 코포레이션 열계면 물질 및 이의 제조 및 사용을 위한 방법
JP5606104B2 (ja) * 2009-03-23 2014-10-15 株式会社アドマテックス 紫外線反射組成物及び紫外線反射成形品
JP2013513233A (ja) 2009-12-04 2013-04-18 エー ビー ビー リサーチ リミテッド 高電圧サージアレスタ
KR101128735B1 (ko) 2010-01-07 2012-03-23 장암칼스 주식회사 Ｌｃｄ 및 반도체 소자 보호용 실리콘 코팅제 조성물
JP5365572B2 (ja) * 2010-04-13 2013-12-11 信越化学工業株式会社 室温湿気増粘型熱伝導性シリコーングリース組成物
JP5553006B2 (ja) * 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
WO2012109724A1 (en) * 2011-02-15 2012-08-23 National Research Council Of Canada 3d microfluidic devices based on open-through thermoplastic elastomer membranes
US20120276362A1 (en) * 2011-04-28 2012-11-01 Sikorsky Aircraft Corporation Fay surface sealant application
JP5912600B2 (ja) * 2011-09-16 2016-04-27 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP2013159671A (ja) * 2012-02-02 2013-08-19 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6214094B2 (ja) * 2014-06-10 2017-10-18 信越化学工業株式会社 熱伝導性シート
JP6149831B2 (ja) * 2014-09-04 2017-06-21 信越化学工業株式会社 シリコーン組成物
JP6217588B2 (ja) * 2014-10-23 2017-10-25 信越化学工業株式会社 熱伝導性シリコーンポッティング組成物
JP6260519B2 (ja) 2014-11-25 2018-01-17 信越化学工業株式会社 一液付加硬化型シリコーン組成物の保存方法及び硬化方法
JP6524879B2 (ja) * 2015-10-13 2019-06-05 信越化学工業株式会社 付加一液硬化型熱伝導性シリコーングリース組成物
PL3458509T3 (pl) * 2016-05-16 2022-11-28 Martinswerk Gmbh Produkt w postaci tlenku glinu i jego zastosowanie w kompozycjach polimerowych o wysokiej przewodności cieplnej
US10501671B2 (en) * 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
JP6874366B2 (ja) * 2016-12-28 2021-05-19 信越化学工業株式会社 シリコーン組成物およびその硬化物
PL3580790T3 (pl) 2017-02-08 2024-10-28 Elkem Silicones USA Corp. Pakiet baterii wtórnych o ulepszonym zarządzaniu termicznym
KR101864534B1 (ko) * 2017-03-31 2018-06-04 주식회사 케이씨씨 방열 겔형 실리콘 고무 조성물
CN111094458B (zh) 2017-07-24 2022-03-29 陶氏东丽株式会社 导热性硅酮凝胶组合物、导热性部件及散热构造体
US10344194B2 (en) 2017-09-27 2019-07-09 Momentive Performance Materials Inc. Thermal interface composition comprising ionically modified siloxane
EP3688097B1 (en) * 2017-09-29 2024-05-15 Dow Silicones Corporation Silicone composition comprising filler
EP3688111A4 (en) * 2017-09-29 2021-07-28 Dow Silicones Corporation THERMAL CONDUCTIVE COMPOSITION
JP2019077843A (ja) * 2017-10-27 2019-05-23 信越化学工業株式会社 熱伝導性シリコーンポッティング組成物およびその硬化物
IT201800003535A1 (it) * 2018-03-14 2019-09-14 Getters Spa Composizione chimica distribuibile con elevata quantità di materiale di carica e bassi livelli di indice tixotropico
CN112839999B (zh) * 2018-10-16 2022-07-05 信越化学工业株式会社 Led前照灯用加成固化型液体硅橡胶组合物和led前照灯
EP3898813B1 (de) 2018-12-20 2024-10-30 Envalior Deutschland GmbH Polyesterzusammensetzungen
EP3670589A1 (de) 2018-12-20 2020-06-24 LANXESS Deutschland GmbH Polyamidzusammensetzungen
EP4146739A4 (en) * 2020-05-06 2024-02-14 Dow Silicones Corporation CURABLE THERMALLY CONDUCTIVE POLYSILOXANE COMPOSITION WITH INCREASED THIXOTROPY INDEX
CN111635636A (zh) * 2020-06-29 2020-09-08 佛山(华南)新材料研究院 一种耐老化的高导热垫片的制备方法
JP7700440B2 (ja) * 2020-11-06 2025-07-01 Jnc株式会社 シリコーン系分散剤およびフィラー分散液
EP4105270A1 (de) 2021-06-15 2022-12-21 LANXESS Deutschland GmbH Polyamidzusammensetzungen
WO2023008538A1 (ja) * 2021-07-29 2023-02-02 積水ポリマテック株式会社 熱伝導性組成物及び硬化物
JP2023062628A (ja) 2021-10-21 2023-05-08 デュポン・東レ・スペシャルティ・マテリアル株式会社 熱伝導性シリコーン組成物
JP7656559B2 (ja) * 2022-02-04 2025-04-03 信越化学工業株式会社 熱伝導性シリコーン樹脂シートおよびその製造方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI667291B (zh) * 2015-03-02 2019-08-01 日商信越化學工業股份有限公司 Thermally conductive fluorenone composition

Also Published As

Publication number Publication date
JP4557136B2 (ja) 2010-10-06
US7547743B2 (en) 2009-06-16
KR101237558B1 (ko) 2013-02-26
KR20060047809A (ko) 2006-05-18
US20050256259A1 (en) 2005-11-17
JP2005325211A (ja) 2005-11-24
TW200609282A (en) 2006-03-16

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MM4A Annulment or lapse of patent due to non-payment of fees