JP4545393B2 - 薄膜蒸着装置用基板固定装置及び基板固定方法 - Google Patents

薄膜蒸着装置用基板固定装置及び基板固定方法 Download PDF

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Publication number
JP4545393B2
JP4545393B2 JP2003156776A JP2003156776A JP4545393B2 JP 4545393 B2 JP4545393 B2 JP 4545393B2 JP 2003156776 A JP2003156776 A JP 2003156776A JP 2003156776 A JP2003156776 A JP 2003156776A JP 4545393 B2 JP4545393 B2 JP 4545393B2
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substrate
mask
pressure plate
thin film
mask pressure
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Expired - Lifetime
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Japanese (ja)
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JP2004003030A5 (enExample
JP2004003030A (ja
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姜敞皓
張容源
金兌承
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Samsung Display Co Ltd
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Samsung Mobile Display Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2003156776A 2002-05-31 2003-06-02 薄膜蒸着装置用基板固定装置及び基板固定方法 Expired - Lifetime JP4545393B2 (ja)

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KR1020020030613A KR100838065B1 (ko) 2002-05-31 2002-05-31 박막증착기용 고정장치와 이를 이용한 고정방법

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JP2004003030A JP2004003030A (ja) 2004-01-08
JP2004003030A5 JP2004003030A5 (enExample) 2006-07-27
JP4545393B2 true JP4545393B2 (ja) 2010-09-15

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JP2003156776A Expired - Lifetime JP4545393B2 (ja) 2002-05-31 2003-06-02 薄膜蒸着装置用基板固定装置及び基板固定方法

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US (2) US7097750B2 (enExample)
JP (1) JP4545393B2 (enExample)
KR (1) KR100838065B1 (enExample)
CN (1) CN100587996C (enExample)

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KR102218644B1 (ko) * 2013-12-19 2021-02-23 삼성디스플레이 주식회사 증착 장치
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CN104993070A (zh) * 2015-07-02 2015-10-21 深圳市华星光电技术有限公司 一种制作柔性oled显示器件的方法
CN106337164A (zh) * 2015-07-08 2017-01-18 上海和辉光电有限公司 一种蒸镀装置
KR102396758B1 (ko) * 2015-08-07 2022-05-13 (주)선익시스템 마스크를 이용하는 공정챔버용 처킹시스템
KR102339616B1 (ko) * 2015-08-17 2021-12-17 (주)선익시스템 마스크를 이용하는 공정챔버용 처킹시스템
CN105154830B (zh) * 2015-09-06 2017-04-19 京东方科技集团股份有限公司 一种固定方法和蒸镀方法
JP6298138B2 (ja) * 2015-11-25 2018-03-20 キヤノントッキ株式会社 成膜システム、磁性体部及び膜の製造方法
KR101702785B1 (ko) * 2015-12-02 2017-02-07 에스엔유 프리시젼 주식회사 박막 증착장치
JP6309048B2 (ja) * 2016-07-01 2018-04-11 キヤノントッキ株式会社 マスク吸着装置
CN106756779B (zh) * 2017-01-03 2019-09-06 京东方科技集团股份有限公司 一种磁控溅射台以及磁控溅射装置
JP6785171B2 (ja) * 2017-03-08 2020-11-18 株式会社日本製鋼所 成膜方法および電子装置の製造方法並びにプラズマ原子層成長装置
JP6857522B2 (ja) * 2017-03-17 2021-04-14 株式会社日本製鋼所 成膜方法および電子装置の製造方法並びにマスク保持体
KR102411538B1 (ko) * 2017-09-04 2022-06-22 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
CN108060388A (zh) * 2017-12-18 2018-05-22 信利（惠州）智能显示有限公司 一种基板和掩膜板的对位方法
KR102489336B1 (ko) * 2017-12-26 2023-01-19 삼성디스플레이 주식회사 증착 장치 및 이를 이용한 표시 장치의 제조 방법
KR101963982B1 (ko) * 2017-12-27 2019-03-29 캐논 톡키 가부시키가이샤 성막 장치, 성막 방법, 및 전자 디바이스의 제조 방법
KR102036523B1 (ko) * 2017-12-29 2019-10-25 주식회사 에스에프에이 기판 증착장치
KR102020766B1 (ko) * 2017-12-29 2019-09-11 주식회사 에스에프에이 기판 증착장치
CN108110092A (zh) * 2018-02-28 2018-06-01 北京创昱科技有限公司 一种基片装夹装置
KR102591646B1 (ko) * 2018-06-29 2023-10-20 삼성디스플레이 주식회사 증착 장치 및 증착 장치의 마그넷 플레이트 얼라인 방법
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Also Published As

Publication number Publication date
KR100838065B1 (ko) 2008-06-16
US7695596B2 (en) 2010-04-13
US7097750B2 (en) 2006-08-29
KR20030092789A (ko) 2003-12-06
CN1462160A (zh) 2003-12-17
US20030224109A1 (en) 2003-12-04
US20060201618A1 (en) 2006-09-14
CN100587996C (zh) 2010-02-03
JP2004003030A (ja) 2004-01-08

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