JP4734508B2 - Elディスプレイおよびその製造方法 - Google Patents
Elディスプレイおよびその製造方法 Download PDFInfo
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- JP4734508B2 JP4734508B2 JP2004182107A JP2004182107A JP4734508B2 JP 4734508 B2 JP4734508 B2 JP 4734508B2 JP 2004182107 A JP2004182107 A JP 2004182107A JP 2004182107 A JP2004182107 A JP 2004182107A JP 4734508 B2 JP4734508 B2 JP 4734508B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000010410 layer Substances 0.000 claims description 63
- 239000000758 substrate Substances 0.000 claims description 59
- 238000005192 partition Methods 0.000 claims description 54
- 230000001050 lubricating effect Effects 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 16
- 239000012044 organic layer Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 10
- 238000001704 evaporation Methods 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 3
- 239000000314 lubricant Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 125000001153 fluoro group Chemical group F* 0.000 claims 2
- 238000005401 electroluminescence Methods 0.000 description 28
- 238000007740 vapor deposition Methods 0.000 description 7
- 238000000576 coating method Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 238000005461 lubrication Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 229910017709 Ni Co Inorganic materials 0.000 description 2
- 229910003267 Ni-Co Inorganic materials 0.000 description 2
- 229910003262 Ni‐Co Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- HXWWMGJBPGRWRS-CMDGGOBGSA-N 4- -2-tert-butyl-6- -4h-pyran Chemical compound O1C(C(C)(C)C)=CC(=C(C#N)C#N)C=C1\C=C\C1=CC(C(CCN2CCC3(C)C)(C)C)=C2C3=C1 HXWWMGJBPGRWRS-CMDGGOBGSA-N 0.000 description 1
- 229910017073 AlLi Inorganic materials 0.000 description 1
- MSDMPJCOOXURQD-UHFFFAOYSA-N C545T Chemical compound C1=CC=C2SC(C3=CC=4C=C5C6=C(C=4OC3=O)C(C)(C)CCN6CCC5(C)C)=NC2=C1 MSDMPJCOOXURQD-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical class N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- CUJRVFIICFDLGR-UHFFFAOYSA-N acetylacetonate Chemical compound CC(=O)[CH-]C(C)=O CUJRVFIICFDLGR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- AHLBNYSZXLDEJQ-FWEHEUNISA-N orlistat Chemical compound CCCCCCCCCCC[C@H](OC(=O)[C@H](CC(C)C)NC=O)C[C@@H]1OC(=O)[C@H]1CCCCCC AHLBNYSZXLDEJQ-FWEHEUNISA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- PYWVYCXTNDRMGF-UHFFFAOYSA-N rhodamine B Chemical compound [Cl-].C=12C=CC(=[N+](CC)CC)C=C2OC2=CC(N(CC)CC)=CC=C2C=1C1=CC=CC=C1C(O)=O PYWVYCXTNDRMGF-UHFFFAOYSA-N 0.000 description 1
- YYMBJDOZVAITBP-UHFFFAOYSA-N rubrene Chemical compound C1=CC=CC=C1C(C1=C(C=2C=CC=CC=2)C2=CC=CC=C2C(C=2C=CC=CC=2)=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 YYMBJDOZVAITBP-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
luminescence)ディスプレイおよびその製造方法に関するものである。
emitting device)が注目されている(非特許文献1)。携帯電話やディジタルカメラのディスプレイをはじめ種々の製品のディスプレイとして利用されている。
11:ディスプレイ基板
12:基板
14:隔壁
16:画素パターン
18:潤滑層
20:マスク
22:穴部
24:アノード電極
26:有機層
28:カソード電極
Claims (9)
- 複数の画素が縦横に配列されたELディスプレイであって、
基板と、
該基板上に配置され、画素領域に対応した複数の開口部を形成する隔壁と、
該開口部内に形成される一対の電極層と、当該一対の電極層間に形成される有機層及び正孔注入特性を有する潤滑層とを有する画素パターンと、
前記隔壁上に形成され、前記潤滑層と同一材料からなる潤滑層と、
を備えたELディスプレイ。 - 前記潤滑層は前記隔壁よりも摩擦係数が小さいことを特徴とする請求項1に記載のELディスプレイ。
- 前記潤滑層を構成する材料は水に対する接触角が80°〜120°であることを特徴とする請求項1に記載のELディスプレイ。
- 前記潤滑層は、フッ素系樹脂、シリコーン樹脂、塩化ビニルにより形成されていることを特徴とする請求項1乃至請求項3のいずれかに記載のELディスプレイ。
- 基板と、該基板上に配置され、画素領域に対応した複数の開口部を形成する隔壁とを備えたディスプレイ基板を準備する工程と、
プラズマ法を用いて、前記開口部内に正孔注入特性を有する潤滑層を形成するとともに、前記隔壁上に前記潤滑層と同一材料からなる潤滑層を同時に形成する工程と、
前記開口部に対応する穴部を備えたマスクを前記隔壁上に形成された潤滑層に接触させるようにディスプレイ基板上に配置させる工程と、
前記マスクの外側に配置される蒸発源を蒸発させるとともに、該蒸発物を前記マスクの穴部を介して前記開口部内のディスプレイ基板上に堆積させ、画素パターンを形成する工程と、
を備えたELディスプレイの製造方法。 - 前記潤滑層は前記隔壁よりも摩擦係数が小さいことを特徴とする請求項5に記載のELディスプレイの製造方法。
- 前記潤滑層を構成する材料の水に対する接触角が80°〜120°になるように形成する工程を含むことを特徴とする請求項5又は請求項6に記載のELディスプレイの製造方法。
- 前記潤滑層は、フッ素系樹脂、シリコーン樹脂、塩化ビニルにより形成されていることを特徴とする請求項5乃至請求項7のいずれかに記載のELディスプレイの製造方法。
- 前記マスクは金属材料により形成されており、且つ、前記マスク及び前記ディスプレイ基板は磁気的な吸着力によって互いに接触していることを特徴とする請求項5乃至請求項8のいずれかに記載のELディスプレイの製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004182107A JP4734508B2 (ja) | 2004-06-21 | 2004-06-21 | Elディスプレイおよびその製造方法 |
TW094114990A TWI256856B (en) | 2004-06-21 | 2005-05-10 | EL display device and methods for manufacturing the same |
US11/154,409 US7432650B2 (en) | 2004-06-21 | 2005-06-16 | EL display and production method thereof |
CNB2005100789808A CN100401552C (zh) | 2004-06-21 | 2005-06-21 | El显示器及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004182107A JP4734508B2 (ja) | 2004-06-21 | 2004-06-21 | Elディスプレイおよびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006004850A JP2006004850A (ja) | 2006-01-05 |
JP4734508B2 true JP4734508B2 (ja) | 2011-07-27 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004182107A Expired - Fee Related JP4734508B2 (ja) | 2004-06-21 | 2004-06-21 | Elディスプレイおよびその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7432650B2 (ja) |
JP (1) | JP4734508B2 (ja) |
CN (1) | CN100401552C (ja) |
TW (1) | TWI256856B (ja) |
Families Citing this family (18)
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JP4917833B2 (ja) * | 2005-06-29 | 2012-04-18 | エルジー ディスプレイ カンパニー リミテッド | 有機elディスプレイ及びその製造方法 |
CN100444715C (zh) * | 2006-02-09 | 2008-12-17 | 友达光电股份有限公司 | 用于显示元件的全彩工艺的屏蔽 |
CN101290905B (zh) * | 2007-04-19 | 2013-02-27 | 奇美电子股份有限公司 | 显示面板及其导线制作方法 |
WO2009057689A1 (ja) * | 2007-10-30 | 2009-05-07 | Kyocera Corporation | 画像表示装置の製造方法および画像表示装置 |
JP5677785B2 (ja) | 2009-08-27 | 2015-02-25 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法 |
KR101084184B1 (ko) | 2010-01-11 | 2011-11-17 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
KR101156441B1 (ko) * | 2010-03-11 | 2012-06-18 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
KR101223723B1 (ko) | 2010-07-07 | 2013-01-18 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
KR101723506B1 (ko) | 2010-10-22 | 2017-04-19 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
KR101760897B1 (ko) | 2011-01-12 | 2017-07-25 | 삼성디스플레이 주식회사 | 증착원 및 이를 구비하는 유기막 증착 장치 |
KR101852517B1 (ko) | 2011-05-25 | 2018-04-27 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
KR20130004830A (ko) | 2011-07-04 | 2013-01-14 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법 |
TWI470849B (zh) * | 2012-01-20 | 2015-01-21 | Ind Tech Res Inst | 發光元件 |
KR102081284B1 (ko) | 2013-04-18 | 2020-02-26 | 삼성디스플레이 주식회사 | 증착장치, 이를 이용한 유기발광 디스플레이 장치 제조 방법 및 유기발광 디스플레이 장치 |
CN105118846B (zh) * | 2015-07-28 | 2020-06-23 | 广东聚华印刷显示技术有限公司 | 一种印刷型发光二极管显示器件及其制作方法 |
CN106119779A (zh) * | 2016-07-15 | 2016-11-16 | 信利(惠州)智能显示有限公司 | 一种oled有机薄膜成膜方法 |
CN106206990B (zh) * | 2016-08-29 | 2018-05-08 | 昆山国显光电有限公司 | Oled器件及制作方法、蒸镀基板制作方法 |
CN110335893B (zh) * | 2019-07-22 | 2022-11-11 | 京东方科技集团股份有限公司 | 显示面板、封装盖板及其制造方法 |
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-
2004
- 2004-06-21 JP JP2004182107A patent/JP4734508B2/ja not_active Expired - Fee Related
-
2005
- 2005-05-10 TW TW094114990A patent/TWI256856B/zh not_active IP Right Cessation
- 2005-06-16 US US11/154,409 patent/US7432650B2/en not_active Expired - Fee Related
- 2005-06-21 CN CNB2005100789808A patent/CN100401552C/zh active Active
Patent Citations (9)
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JPH02245767A (ja) * | 1989-03-18 | 1990-10-01 | Hitachi Ltd | 電子写真感光体とその製法並びにそれを用いた電子写真法及び電子写真装置 |
JP2004014532A (ja) * | 1995-03-13 | 2004-01-15 | Pioneer Electronic Corp | 有機エレクトロルミネッセンスディスプレイパネルとその製造方法 |
JP2000215513A (ja) * | 1999-01-21 | 2000-08-04 | Mitsubishi Chemicals Corp | 光記録媒体及び光記録装置 |
JP2001185352A (ja) * | 1999-12-27 | 2001-07-06 | Sharp Corp | 有機el表示装置の発光層の形成方法 |
JP2001185361A (ja) * | 1999-12-27 | 2001-07-06 | Toppan Printing Co Ltd | 有機エレクトロルミネセンス表示素子用基板およびそれを用いた有機エレクトロルミネセンス表示素子 |
JP2002075638A (ja) * | 2000-08-29 | 2002-03-15 | Nec Corp | マスク蒸着方法及び蒸着装置 |
JP2002192850A (ja) * | 2000-12-25 | 2002-07-10 | Bonmaaku:Kk | 印刷用メタルマスク |
JP2003082042A (ja) * | 2001-09-07 | 2003-03-19 | Jsr Corp | 隔壁形成用感放射線性樹脂組成物、隔壁、および表示素子。 |
JP2003257636A (ja) * | 2002-03-01 | 2003-09-12 | Seiko Epson Corp | マスクおよびパターン形成方法、デバイスの製造装置およびデバイスの製造方法並びにデバイス |
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US20050280356A1 (en) | 2005-12-22 |
US7432650B2 (en) | 2008-10-07 |
JP2006004850A (ja) | 2006-01-05 |
TWI256856B (en) | 2006-06-11 |
CN100401552C (zh) | 2008-07-09 |
TW200601871A (en) | 2006-01-01 |
CN1713790A (zh) | 2005-12-28 |
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