JP4536100B2 - 発振器 - Google Patents
発振器 Download PDFInfo
- Publication number
- JP4536100B2 JP4536100B2 JP2007269542A JP2007269542A JP4536100B2 JP 4536100 B2 JP4536100 B2 JP 4536100B2 JP 2007269542 A JP2007269542 A JP 2007269542A JP 2007269542 A JP2007269542 A JP 2007269542A JP 4536100 B2 JP4536100 B2 JP 4536100B2
- Authority
- JP
- Japan
- Prior art keywords
- line
- oscillation
- output terminal
- capacitor
- oscillator according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000010355 oscillation Effects 0.000 claims description 128
- 239000003990 capacitor Substances 0.000 claims description 43
- 238000010586 diagram Methods 0.000 description 16
- 230000004048 modification Effects 0.000 description 11
- 238000012986 modification Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 7
- 239000010949 copper Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000004088 simulation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/08—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance
- H03B5/12—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance active element in amplifier being semiconductor device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/18—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance
- H03B5/1841—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance the frequency-determining element being a strip line resonator
- H03B5/1847—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance the frequency-determining element being a strip line resonator the active element in the amplifier being a semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B2200/00—Indexing scheme relating to details of oscillators covered by H03B
- H03B2200/0002—Types of oscillators
- H03B2200/0008—Colpitts oscillator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B2200/00—Indexing scheme relating to details of oscillators covered by H03B
- H03B2200/0014—Structural aspects of oscillators
- H03B2200/0022—Structural aspects of oscillators characterised by the substrate, e.g. material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B2201/00—Aspects of oscillators relating to varying the frequency of the oscillations
- H03B2201/02—Varying the frequency of the oscillations by electronic means
- H03B2201/0208—Varying the frequency of the oscillations by electronic means the means being an element with a variable capacitance, e.g. capacitance diode
Landscapes
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
Description
Claims (12)
- 第1発振周波数の第1発振信号を第1中間ノードを介し出力端子に出力する第1発振部と、
絶縁層を有し、前記第1発振部を実装する実装部と、
前記絶縁層に設けられ、一端が前記第1中間ノードに他端がグランドに接続されたストリップ線である第1線路と、
前記絶縁層に設けられ、一端が前記第1中間ノードに他端が電源端子に接続されたストリップ線である第2線路と、
前記絶縁層に設けられ、一端が前記第1中間ノードに他端が前記出力端子に接続されたストリップ線である第3線路と、を具備する発振器。 - 前記絶縁層は積層された複数の絶縁層であり、
前記第1線路、前記第2線路および前記第3線路は、それぞれ異なる絶縁層に設けられている請求項1記載の発振器。 - 前記第1線路と前記グランドとの間に接続された第1キャパシタを具備し、
前記第1線路の他端は前記第1キャパシタを介し前記グランドに接続されている請求項1記載の発振器。 - 前記第3線路と前記出力端子との間に接続された第2キャパシタを具備し、
前記第3線路の他端は前記第2キャパシタを介し前記出力端子に接続されている請求項1記載の発振器。 - 前記第3線路と前記出力端子との間に接続されたインダクタを具備し、
前記第3線路の他端は前記インダクタを介し前記出力端子に接続されている請求項1記載の発振器。 - 前記第1発振部は、
制御電圧により周波数が制御された共振信号を生成する共振回路と、
前記共振信号の周波数で前記第1発振信号を生成する発振回路と、を有する請求項1記載の発振器。 - 前記第1発振部はバッファ回路を有していない請求項1記載の発振器。
- 前記第3線路の他端と前記出力端子との間に設けられた第2中間ノードを介し、前記出力端子に第2発振周波数の第2発振信号を出力する第2発振部と、
一端が前記第中間2ノードに他端が前記第2発振部に接続された第2インダクタンス素子と、を具備する請求項1記載の発振器。 - 前記第2発振周波数は前記第1発振周波数より低い請求項8記載の発振器。
- 前記第2インダクタンス素子の他端と前記第2発振部との間に設けられた第3中間ノードを介し、前記出力端子に第3発振周波数の第3発振信号を出力する第3発振部と、
一端が前記第3中間ノードに他端が前記第3発振部に接続された第3インダクタ素子と、を具備する請求項8記載の発振器。 - 前記第3発振周波数は前記第2発振周波数より低い請求項10記載の発振器。
- 前記第3線路の他端と前記出力端子との間に接続された第2キャパシタと、
前記第3線路の他端と前記第2キャパシタとの間のノードと、前記グランドと、の間に接続された第3キャパシタと、
を具備し、
前記第3線路の他端は前記第2キャパシタを介し前記出力端子に接続され、
前記ノードは前記第3キャパシタを介し前記グランドに接続されている請求項3記載の発振器。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/699,025 US7696833B2 (en) | 2007-01-29 | 2007-01-29 | Oscillator |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008187703A JP2008187703A (ja) | 2008-08-14 |
JP4536100B2 true JP4536100B2 (ja) | 2010-09-01 |
Family
ID=39667277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007269542A Expired - Fee Related JP4536100B2 (ja) | 2007-01-29 | 2007-10-16 | 発振器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7696833B2 (ja) |
JP (1) | JP4536100B2 (ja) |
KR (1) | KR100938083B1 (ja) |
CN (1) | CN101237219B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5747668B2 (ja) * | 2011-06-09 | 2015-07-15 | 住友電気工業株式会社 | 発振回路 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01276905A (ja) * | 1988-04-28 | 1989-11-07 | Matsushita Electric Ind Co Ltd | 発振回路 |
JPH09252218A (ja) * | 1996-01-08 | 1997-09-22 | Casio Comput Co Ltd | 間欠動作型発振器 |
JP2002135067A (ja) * | 2000-10-26 | 2002-05-10 | Asahi Kasei Microsystems Kk | 増幅器 |
JP2005521275A (ja) * | 2001-08-29 | 2005-07-14 | トロピアン・インコーポレーテッド | 集中および分布インダクタンスを使用して増幅器内でインピーダンス整合するための方法およびシステム |
JP2006157095A (ja) * | 2004-11-25 | 2006-06-15 | Hitachi Metals Ltd | 高周波回路及びこれを用いたマルチバンド通信装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0202652B2 (en) * | 1985-05-21 | 1999-03-17 | Matsushita Electric Industrial Co., Ltd. | Microwave oscillator |
US5999061A (en) * | 1998-05-05 | 1999-12-07 | Vari-L Company, Inc. | First and second oscillator circuits selectively coupled through passive output circuit to a load |
JP2001185951A (ja) * | 1999-12-24 | 2001-07-06 | Murata Mfg Co Ltd | 電圧制御発振器および通信装置 |
US6552620B2 (en) * | 2000-09-12 | 2003-04-22 | Fusion Lighting, Inc. | Power oscillator |
JP3764688B2 (ja) | 2002-02-27 | 2006-04-12 | 京セラ株式会社 | 電圧制御型発振回路 |
JP2004235906A (ja) | 2003-01-29 | 2004-08-19 | Kyocera Corp | デュアルバンド発振器 |
US20050110588A1 (en) | 2003-11-21 | 2005-05-26 | Fujitsu Media Devices Limited | Oscillator |
US7053721B2 (en) | 2003-11-21 | 2006-05-30 | Fujitsu Media Devices Limited | Oscillator having a resonant circuit and a drive circuit |
KR101176615B1 (ko) * | 2005-02-02 | 2012-08-23 | 조지아 테크 리서치 코오포레이션 | 초 광대역의 신호 생성기 |
-
2007
- 2007-01-29 US US11/699,025 patent/US7696833B2/en not_active Expired - Fee Related
- 2007-10-16 JP JP2007269542A patent/JP4536100B2/ja not_active Expired - Fee Related
- 2007-11-21 KR KR1020070119080A patent/KR100938083B1/ko not_active IP Right Cessation
- 2007-12-14 CN CN2007101988526A patent/CN101237219B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01276905A (ja) * | 1988-04-28 | 1989-11-07 | Matsushita Electric Ind Co Ltd | 発振回路 |
JPH09252218A (ja) * | 1996-01-08 | 1997-09-22 | Casio Comput Co Ltd | 間欠動作型発振器 |
JP2002135067A (ja) * | 2000-10-26 | 2002-05-10 | Asahi Kasei Microsystems Kk | 増幅器 |
JP2005521275A (ja) * | 2001-08-29 | 2005-07-14 | トロピアン・インコーポレーテッド | 集中および分布インダクタンスを使用して増幅器内でインピーダンス整合するための方法およびシステム |
JP2006157095A (ja) * | 2004-11-25 | 2006-06-15 | Hitachi Metals Ltd | 高周波回路及びこれを用いたマルチバンド通信装置 |
Also Published As
Publication number | Publication date |
---|---|
US20080180184A1 (en) | 2008-07-31 |
KR100938083B1 (ko) | 2010-01-21 |
CN101237219A (zh) | 2008-08-06 |
JP2008187703A (ja) | 2008-08-14 |
US7696833B2 (en) | 2010-04-13 |
CN101237219B (zh) | 2011-12-21 |
KR20080071062A (ko) | 2008-08-01 |
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