JP4531777B2 - プリント配線板のめっき前処理方法 - Google Patents

プリント配線板のめっき前処理方法 Download PDF

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Publication number
JP4531777B2
JP4531777B2 JP2007009253A JP2007009253A JP4531777B2 JP 4531777 B2 JP4531777 B2 JP 4531777B2 JP 2007009253 A JP2007009253 A JP 2007009253A JP 2007009253 A JP2007009253 A JP 2007009253A JP 4531777 B2 JP4531777 B2 JP 4531777B2
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Japan
Prior art keywords
treated
processed
electrodes
plating
electrode
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Expired - Fee Related
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JP2007009253A
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English (en)
Japanese (ja)
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JP2008174794A (ja
Inventor
橋 秀 次 大
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Nippon Mektron KK
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Nippon Mektron KK
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Priority to JP2007009253A priority Critical patent/JP4531777B2/ja
Priority to TW96143469A priority patent/TWI399142B/zh
Priority to CN2008100014494A priority patent/CN101294294B/zh
Publication of JP2008174794A publication Critical patent/JP2008174794A/ja
Priority to HK09103699.9A priority patent/HK1125978A1/xx
Application granted granted Critical
Publication of JP4531777B2 publication Critical patent/JP4531777B2/ja
Expired - Fee Related legal-status Critical Current
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  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2007009253A 2007-01-18 2007-01-18 プリント配線板のめっき前処理方法 Expired - Fee Related JP4531777B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007009253A JP4531777B2 (ja) 2007-01-18 2007-01-18 プリント配線板のめっき前処理方法
TW96143469A TWI399142B (zh) 2007-01-18 2007-11-16 Pretreatment method of electroplating of printed wiring board
CN2008100014494A CN101294294B (zh) 2007-01-18 2008-01-18 印刷电路板的镀前处理方法
HK09103699.9A HK1125978A1 (en) 2007-01-18 2009-04-22 Processing method for printed circuit board before plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007009253A JP4531777B2 (ja) 2007-01-18 2007-01-18 プリント配線板のめっき前処理方法

Publications (2)

Publication Number Publication Date
JP2008174794A JP2008174794A (ja) 2008-07-31
JP4531777B2 true JP4531777B2 (ja) 2010-08-25

Family

ID=39702019

Family Applications (1)

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JP2007009253A Expired - Fee Related JP4531777B2 (ja) 2007-01-18 2007-01-18 プリント配線板のめっき前処理方法

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JP (1) JP4531777B2 (zh)
CN (1) CN101294294B (zh)
HK (1) HK1125978A1 (zh)
TW (1) TWI399142B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5757745B2 (ja) * 2011-02-09 2015-07-29 日新製鋼株式会社 ステンレス鋼帯の脱スケール用電解酸洗法
CN103409787A (zh) * 2012-07-20 2013-11-27 张家港市胜达钢绳有限公司 对钢丝进行脱脂处理的方法和装置
JP5817755B2 (ja) * 2013-02-27 2015-11-18 Ｊｆｅスチール株式会社 電解酸洗設備における電極寿命の評価方法及び電解酸洗設備

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08120499A (ja) * 1994-10-20 1996-05-14 Nikko Gould Foil Kk 液中集電法によるプリント回路用銅箔表面処理方法
JPH09316684A (ja) * 1996-05-28 1997-12-09 Ibiden Co Ltd 長尺基材のめっき方法及びめっき装置
JP2000204499A (ja) * 1999-01-08 2000-07-25 Nisshin Steel Co Ltd ステンレス鋼帯の電解脱スケ―ル方法
JP2002134858A (ja) * 2000-10-25 2002-05-10 Hitachi Cable Ltd プリント基板用銅箔
JP2004111893A (ja) * 2002-07-24 2004-04-08 Kyocera Corp 多数個取り配線基板の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT406385B (de) * 1996-10-25 2000-04-25 Andritz Patentverwaltung Verfahren und vorrichtung zum elektrolytischen beizen von metallischen bändern
JPWO2003048416A1 (ja) * 2001-12-04 2005-04-14 新日本製鐵株式会社 金属酸化物及び／又は金属水酸化物被覆金属材料とその製造方法
EP1342818B1 (en) * 2002-03-04 2016-09-07 Nippon Steel & Sumitomo Metal Corporation Method and apparatus for indirect-electrification-type continuous electrolytic etching of metal strip
DE10354860B4 (de) * 2003-11-19 2008-06-26 Atotech Deutschland Gmbh Halogenierte oder pseudohalogenierte monomere Phenaziniumverbindungen, Verfahren zu deren Herstellung sowie diese Verbindungen enthaltendes saures Bad und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08120499A (ja) * 1994-10-20 1996-05-14 Nikko Gould Foil Kk 液中集電法によるプリント回路用銅箔表面処理方法
JPH09316684A (ja) * 1996-05-28 1997-12-09 Ibiden Co Ltd 長尺基材のめっき方法及びめっき装置
JP2000204499A (ja) * 1999-01-08 2000-07-25 Nisshin Steel Co Ltd ステンレス鋼帯の電解脱スケ―ル方法
JP2002134858A (ja) * 2000-10-25 2002-05-10 Hitachi Cable Ltd プリント基板用銅箔
JP2004111893A (ja) * 2002-07-24 2004-04-08 Kyocera Corp 多数個取り配線基板の製造方法

Also Published As

Publication number Publication date
TW200835412A (en) 2008-08-16
JP2008174794A (ja) 2008-07-31
TWI399142B (zh) 2013-06-11
CN101294294A (zh) 2008-10-29
HK1125978A1 (en) 2009-08-21
CN101294294B (zh) 2011-03-02

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