JP4531777B2 - プリント配線板のめっき前処理方法 - Google Patents
プリント配線板のめっき前処理方法 Download PDFInfo
- Publication number
- JP4531777B2 JP4531777B2 JP2007009253A JP2007009253A JP4531777B2 JP 4531777 B2 JP4531777 B2 JP 4531777B2 JP 2007009253 A JP2007009253 A JP 2007009253A JP 2007009253 A JP2007009253 A JP 2007009253A JP 4531777 B2 JP4531777 B2 JP 4531777B2
- Authority
- JP
- Japan
- Prior art keywords
- treated
- processed
- electrodes
- plating
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
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- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007009253A JP4531777B2 (ja) | 2007-01-18 | 2007-01-18 | プリント配線板のめっき前処理方法 |
TW96143469A TWI399142B (zh) | 2007-01-18 | 2007-11-16 | Pretreatment method of electroplating of printed wiring board |
CN2008100014494A CN101294294B (zh) | 2007-01-18 | 2008-01-18 | 印刷电路板的镀前处理方法 |
HK09103699.9A HK1125978A1 (en) | 2007-01-18 | 2009-04-22 | Processing method for printed circuit board before plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007009253A JP4531777B2 (ja) | 2007-01-18 | 2007-01-18 | プリント配線板のめっき前処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008174794A JP2008174794A (ja) | 2008-07-31 |
JP4531777B2 true JP4531777B2 (ja) | 2010-08-25 |
Family
ID=39702019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007009253A Expired - Fee Related JP4531777B2 (ja) | 2007-01-18 | 2007-01-18 | プリント配線板のめっき前処理方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4531777B2 (zh) |
CN (1) | CN101294294B (zh) |
HK (1) | HK1125978A1 (zh) |
TW (1) | TWI399142B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5757745B2 (ja) * | 2011-02-09 | 2015-07-29 | 日新製鋼株式会社 | ステンレス鋼帯の脱スケール用電解酸洗法 |
CN103409787A (zh) * | 2012-07-20 | 2013-11-27 | 张家港市胜达钢绳有限公司 | 对钢丝进行脱脂处理的方法和装置 |
JP5817755B2 (ja) * | 2013-02-27 | 2015-11-18 | Jfeスチール株式会社 | 電解酸洗設備における電極寿命の評価方法及び電解酸洗設備 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08120499A (ja) * | 1994-10-20 | 1996-05-14 | Nikko Gould Foil Kk | 液中集電法によるプリント回路用銅箔表面処理方法 |
JPH09316684A (ja) * | 1996-05-28 | 1997-12-09 | Ibiden Co Ltd | 長尺基材のめっき方法及びめっき装置 |
JP2000204499A (ja) * | 1999-01-08 | 2000-07-25 | Nisshin Steel Co Ltd | ステンレス鋼帯の電解脱スケ―ル方法 |
JP2002134858A (ja) * | 2000-10-25 | 2002-05-10 | Hitachi Cable Ltd | プリント基板用銅箔 |
JP2004111893A (ja) * | 2002-07-24 | 2004-04-08 | Kyocera Corp | 多数個取り配線基板の製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT406385B (de) * | 1996-10-25 | 2000-04-25 | Andritz Patentverwaltung | Verfahren und vorrichtung zum elektrolytischen beizen von metallischen bändern |
JPWO2003048416A1 (ja) * | 2001-12-04 | 2005-04-14 | 新日本製鐵株式会社 | 金属酸化物及び/又は金属水酸化物被覆金属材料とその製造方法 |
EP1342818B1 (en) * | 2002-03-04 | 2016-09-07 | Nippon Steel & Sumitomo Metal Corporation | Method and apparatus for indirect-electrification-type continuous electrolytic etching of metal strip |
DE10354860B4 (de) * | 2003-11-19 | 2008-06-26 | Atotech Deutschland Gmbh | Halogenierte oder pseudohalogenierte monomere Phenaziniumverbindungen, Verfahren zu deren Herstellung sowie diese Verbindungen enthaltendes saures Bad und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages |
-
2007
- 2007-01-18 JP JP2007009253A patent/JP4531777B2/ja not_active Expired - Fee Related
- 2007-11-16 TW TW96143469A patent/TWI399142B/zh not_active IP Right Cessation
-
2008
- 2008-01-18 CN CN2008100014494A patent/CN101294294B/zh not_active Expired - Fee Related
-
2009
- 2009-04-22 HK HK09103699.9A patent/HK1125978A1/xx not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08120499A (ja) * | 1994-10-20 | 1996-05-14 | Nikko Gould Foil Kk | 液中集電法によるプリント回路用銅箔表面処理方法 |
JPH09316684A (ja) * | 1996-05-28 | 1997-12-09 | Ibiden Co Ltd | 長尺基材のめっき方法及びめっき装置 |
JP2000204499A (ja) * | 1999-01-08 | 2000-07-25 | Nisshin Steel Co Ltd | ステンレス鋼帯の電解脱スケ―ル方法 |
JP2002134858A (ja) * | 2000-10-25 | 2002-05-10 | Hitachi Cable Ltd | プリント基板用銅箔 |
JP2004111893A (ja) * | 2002-07-24 | 2004-04-08 | Kyocera Corp | 多数個取り配線基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200835412A (en) | 2008-08-16 |
JP2008174794A (ja) | 2008-07-31 |
TWI399142B (zh) | 2013-06-11 |
CN101294294A (zh) | 2008-10-29 |
HK1125978A1 (en) | 2009-08-21 |
CN101294294B (zh) | 2011-03-02 |
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