HK1125978A1 - Processing method for printed circuit board before plating - Google Patents

Processing method for printed circuit board before plating

Info

Publication number
HK1125978A1
HK1125978A1 HK09103699.9A HK09103699A HK1125978A1 HK 1125978 A1 HK1125978 A1 HK 1125978A1 HK 09103699 A HK09103699 A HK 09103699A HK 1125978 A1 HK1125978 A1 HK 1125978A1
Authority
HK
Hong Kong
Prior art keywords
circuit board
printed circuit
processing method
before plating
board before
Prior art date
Application number
HK09103699.9A
Other languages
English (en)
Inventor
Hidetsugu Ohashi
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of HK1125978A1 publication Critical patent/HK1125978A1/xx

Links

HK09103699.9A 2007-01-18 2009-04-22 Processing method for printed circuit board before plating HK1125978A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007009253A JP4531777B2 (ja) 2007-01-18 2007-01-18 プリント配線板のめっき前処理方法

Publications (1)

Publication Number Publication Date
HK1125978A1 true HK1125978A1 (en) 2009-08-21

Family

ID=39702019

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09103699.9A HK1125978A1 (en) 2007-01-18 2009-04-22 Processing method for printed circuit board before plating

Country Status (4)

Country Link
JP (1) JP4531777B2 (xx)
CN (1) CN101294294B (xx)
HK (1) HK1125978A1 (xx)
TW (1) TWI399142B (xx)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5757745B2 (ja) * 2011-02-09 2015-07-29 日新製鋼株式会社 ステンレス鋼帯の脱スケール用電解酸洗法
CN103409787A (zh) * 2012-07-20 2013-11-27 张家港市胜达钢绳有限公司 对钢丝进行脱脂处理的方法和装置
JP5817755B2 (ja) * 2013-02-27 2015-11-18 Ｊｆｅスチール株式会社 電解酸洗設備における電極寿命の評価方法及び電解酸洗設備

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2975275B2 (ja) * 1994-10-20 1999-11-10 株式会社日鉱マテリアルズ 液中集電法によるプリント回路用銅箔表面処理方法
JP3483702B2 (ja) * 1996-05-28 2004-01-06 イビデン株式会社 長尺基材のめっき方法及びめっき装置
AT406385B (de) * 1996-10-25 2000-04-25 Andritz Patentverwaltung Verfahren und vorrichtung zum elektrolytischen beizen von metallischen bändern
JP2000204499A (ja) * 1999-01-08 2000-07-25 Nisshin Steel Co Ltd ステンレス鋼帯の電解脱スケ―ル方法
JP2002134858A (ja) * 2000-10-25 2002-05-10 Hitachi Cable Ltd プリント基板用銅箔
EP1455001B1 (en) * 2001-12-04 2013-09-25 Nippon Steel & Sumitomo Metal Corporation Metal material coated with metal oxide and/or metal hydroxide and method for production thereof
US7063780B2 (en) * 2002-03-04 2006-06-20 Nippon Steel Corporation Method for indirect-electrification-type continuous electrolytic etching of metal strip and apparatus for indirect-electrification-type continuous electrolytic etching
JP2004111893A (ja) * 2002-07-24 2004-04-08 Kyocera Corp 多数個取り配線基板の製造方法
DE10354860B4 (de) * 2003-11-19 2008-06-26 Atotech Deutschland Gmbh Halogenierte oder pseudohalogenierte monomere Phenaziniumverbindungen, Verfahren zu deren Herstellung sowie diese Verbindungen enthaltendes saures Bad und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages

Also Published As

Publication number Publication date
JP4531777B2 (ja) 2010-08-25
JP2008174794A (ja) 2008-07-31
TW200835412A (en) 2008-08-16
CN101294294A (zh) 2008-10-29
TWI399142B (zh) 2013-06-11
CN101294294B (zh) 2011-03-02

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20200118