TWI341161B - Multilayer printed circuit board and method for manufacturing the same - Google Patents
Multilayer printed circuit board and method for manufacturing the sameInfo
- Publication number
- TWI341161B TWI341161B TW096151095A TW96151095A TWI341161B TW I341161 B TWI341161 B TW I341161B TW 096151095 A TW096151095 A TW 096151095A TW 96151095 A TW96151095 A TW 96151095A TW I341161 B TWI341161 B TW I341161B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- circuit board
- same
- printed circuit
- multilayer printed
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096151095A TWI341161B (en) | 2007-12-31 | 2007-12-31 | Multilayer printed circuit board and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096151095A TWI341161B (en) | 2007-12-31 | 2007-12-31 | Multilayer printed circuit board and method for manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200930205A TW200930205A (en) | 2009-07-01 |
TWI341161B true TWI341161B (en) | 2011-04-21 |
Family
ID=44864828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096151095A TWI341161B (en) | 2007-12-31 | 2007-12-31 | Multilayer printed circuit board and method for manufacturing the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI341161B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9095083B2 (en) | 2013-11-07 | 2015-07-28 | Unimicron Technology Corp. | Manufacturing method for multi-layer circuit board |
US9198303B2 (en) | 2013-11-07 | 2015-11-24 | Unimicron Technology Corp. | Manufacturing method for multi-layer circuit board |
US9288917B2 (en) | 2013-11-07 | 2016-03-15 | Unimicron Technology Corp. | Manufacturing method for multi-layer circuit board |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106376186B (en) * | 2016-09-12 | 2019-01-25 | 深圳市景旺电子股份有限公司 | A kind of production method for interconnecting PCB and its improving blind hole and line layer Aligning degree |
-
2007
- 2007-12-31 TW TW096151095A patent/TWI341161B/en active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9095083B2 (en) | 2013-11-07 | 2015-07-28 | Unimicron Technology Corp. | Manufacturing method for multi-layer circuit board |
US9198303B2 (en) | 2013-11-07 | 2015-11-24 | Unimicron Technology Corp. | Manufacturing method for multi-layer circuit board |
US9288917B2 (en) | 2013-11-07 | 2016-03-15 | Unimicron Technology Corp. | Manufacturing method for multi-layer circuit board |
Also Published As
Publication number | Publication date |
---|---|
TW200930205A (en) | 2009-07-01 |
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