TWI341161B - Multilayer printed circuit board and method for manufacturing the same - Google Patents

Multilayer printed circuit board and method for manufacturing the same

Info

Publication number
TWI341161B
TWI341161B TW096151095A TW96151095A TWI341161B TW I341161 B TWI341161 B TW I341161B TW 096151095 A TW096151095 A TW 096151095A TW 96151095 A TW96151095 A TW 96151095A TW I341161 B TWI341161 B TW I341161B
Authority
TW
Taiwan
Prior art keywords
manufacturing
circuit board
same
printed circuit
multilayer printed
Prior art date
Application number
TW096151095A
Other languages
Chinese (zh)
Other versions
TW200930205A (en
Inventor
Cheng-Wen Wang
Lin Ren
Cheng Hsien Lin
Original Assignee
Foxconn Advanced Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Advanced Tech Inc filed Critical Foxconn Advanced Tech Inc
Priority to TW096151095A priority Critical patent/TWI341161B/en
Publication of TW200930205A publication Critical patent/TW200930205A/en
Application granted granted Critical
Publication of TWI341161B publication Critical patent/TWI341161B/en

Links

TW096151095A 2007-12-31 2007-12-31 Multilayer printed circuit board and method for manufacturing the same TWI341161B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW096151095A TWI341161B (en) 2007-12-31 2007-12-31 Multilayer printed circuit board and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096151095A TWI341161B (en) 2007-12-31 2007-12-31 Multilayer printed circuit board and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TW200930205A TW200930205A (en) 2009-07-01
TWI341161B true TWI341161B (en) 2011-04-21

Family

ID=44864828

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096151095A TWI341161B (en) 2007-12-31 2007-12-31 Multilayer printed circuit board and method for manufacturing the same

Country Status (1)

Country Link
TW (1) TWI341161B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9095083B2 (en) 2013-11-07 2015-07-28 Unimicron Technology Corp. Manufacturing method for multi-layer circuit board
US9198303B2 (en) 2013-11-07 2015-11-24 Unimicron Technology Corp. Manufacturing method for multi-layer circuit board
US9288917B2 (en) 2013-11-07 2016-03-15 Unimicron Technology Corp. Manufacturing method for multi-layer circuit board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106376186B (en) * 2016-09-12 2019-01-25 深圳市景旺电子股份有限公司 A kind of production method for interconnecting PCB and its improving blind hole and line layer Aligning degree

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9095083B2 (en) 2013-11-07 2015-07-28 Unimicron Technology Corp. Manufacturing method for multi-layer circuit board
US9198303B2 (en) 2013-11-07 2015-11-24 Unimicron Technology Corp. Manufacturing method for multi-layer circuit board
US9288917B2 (en) 2013-11-07 2016-03-15 Unimicron Technology Corp. Manufacturing method for multi-layer circuit board

Also Published As

Publication number Publication date
TW200930205A (en) 2009-07-01

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