JP4512092B2 - 感光性樹脂除去用シンナー組成物 - Google Patents

感光性樹脂除去用シンナー組成物 Download PDF

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Publication number
JP4512092B2
JP4512092B2 JP2006508529A JP2006508529A JP4512092B2 JP 4512092 B2 JP4512092 B2 JP 4512092B2 JP 2006508529 A JP2006508529 A JP 2006508529A JP 2006508529 A JP2006508529 A JP 2006508529A JP 4512092 B2 JP4512092 B2 JP 4512092B2
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JP
Japan
Prior art keywords
weight
parts
propylene glycol
thinner composition
acetate
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Expired - Fee Related
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JP2006508529A
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English (en)
Japanese (ja)
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JP2007531898A (ja
Inventor
ユーン、スク−イル
ジュン、ウー−シク
パク、ヒー−ジン
Original Assignee
ドウジン セミケム カンパニー リミテッド
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Publication of JP2007531898A publication Critical patent/JP2007531898A/ja
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Materials For Photolithography (AREA)
JP2006508529A 2003-06-03 2004-05-17 感光性樹脂除去用シンナー組成物 Expired - Fee Related JP4512092B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020030035683A KR100951364B1 (ko) 2003-06-03 2003-06-03 포토레지스트 제거용 씬너 조성물
PCT/KR2004/001168 WO2004107057A1 (en) 2003-06-03 2004-05-17 Thinner composition for removing photosensitive resin

Publications (2)

Publication Number Publication Date
JP2007531898A JP2007531898A (ja) 2007-11-08
JP4512092B2 true JP4512092B2 (ja) 2010-07-28

Family

ID=36819234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006508529A Expired - Fee Related JP4512092B2 (ja) 2003-06-03 2004-05-17 感光性樹脂除去用シンナー組成物

Country Status (5)

Country Link
JP (1) JP4512092B2 (ko)
KR (1) KR100951364B1 (ko)
CN (1) CN100578367C (ko)
TW (1) TWI309757B (ko)
WO (1) WO2004107057A1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4236198B2 (ja) * 2004-12-28 2009-03-11 東京応化工業株式会社 リソグラフィー用洗浄液及びそれを用いた半導体基材形成方法
CN1800988B (zh) * 2005-01-06 2010-04-07 新应材股份有限公司 光阻清洗剂
EP1904899A4 (en) * 2005-07-19 2012-04-25 Showa Denko Kk ELIMINATION SOLUTION FOR PHOTOSENSITIVE COMPOSITION
JP4698515B2 (ja) * 2005-07-19 2011-06-08 昭和電工株式会社 感光性組成物除去液
JP4762867B2 (ja) * 2005-12-02 2011-08-31 東京応化工業株式会社 ホトリソグラフィ用洗浄液およびこれを用いた基板の洗浄方法
JP4643467B2 (ja) * 2006-02-23 2011-03-02 東京応化工業株式会社 リソグラフィー用洗浄液、およびこれを用いた基材の洗浄方法、並びに薬液供給装置の洗浄方法
US8021490B2 (en) 2007-01-04 2011-09-20 Eastman Chemical Company Substrate cleaning processes through the use of solvents and systems
US20120108067A1 (en) * 2010-10-29 2012-05-03 Neisser Mark O Edge Bead Remover For Coatings
KR101886750B1 (ko) * 2011-09-22 2018-08-13 삼성전자 주식회사 Ｒｒｃ 공정용 씨너 조성물과 그의 공급 장치 및 ｅｂｒ 공정용 씨너 조성물
WO2014104192A1 (ja) * 2012-12-27 2014-07-03 富士フイルム株式会社 レジスト除去液およびレジスト剥離方法
KR102492889B1 (ko) * 2014-12-18 2023-01-30 주식회사 동진쎄미켐 신너 조성물

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3246403A1 (de) * 1982-12-15 1984-06-20 Merck Patent Gmbh, 6100 Darmstadt Verfahren zur entwicklung von reliefstrukturen auf der basis von strahlungsvernetzten polymervorstufen hochwaermebestaendiger polymere
JPS6369563A (ja) * 1986-09-12 1988-03-29 Hitachi Ltd 塗布方法および装置
JP3464299B2 (ja) * 1994-11-07 2003-11-05 ナガセケムテックス株式会社 フォトレジスト剥離剤組成物
KR100363272B1 (ko) * 2000-07-13 2002-12-05 주식회사 동진쎄미켐 박막 트랜지스터 액정표시소자용 포토레지스트를 제거하기위한 씬너 조성물
KR20020037665A (ko) * 2000-11-14 2002-05-22 주식회사 동진쎄미켐 감광성 수지 조성물 제거용 씬너 조성물
KR100742120B1 (ko) * 2001-05-23 2007-07-24 주식회사 동진쎄미켐 감광성 수지 조성물 제거용 씬너 조성물
KR100843984B1 (ko) * 2002-02-22 2008-07-07 주식회사 동진쎄미켐 감광성 수지 조성물을 제거하기 위한 씬너 조성물
KR100503967B1 (ko) * 2002-03-29 2005-07-26 주식회사 동진쎄미켐 감광성 수지 제거용 씬너 조성물

Also Published As

Publication number Publication date
JP2007531898A (ja) 2007-11-08
CN1799007A (zh) 2006-07-05
KR100951364B1 (ko) 2010-04-08
KR20040104161A (ko) 2004-12-10
TWI309757B (en) 2009-05-11
WO2004107057A1 (en) 2004-12-09
CN100578367C (zh) 2010-01-06
TW200504205A (en) 2005-02-01

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