JP4504368B2 - ガス供給集積ユニット及びガスユニットの増設方法 - Google Patents

ガス供給集積ユニット及びガスユニットの増設方法 Download PDF

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Publication number
JP4504368B2
JP4504368B2 JP2006513686A JP2006513686A JP4504368B2 JP 4504368 B2 JP4504368 B2 JP 4504368B2 JP 2006513686 A JP2006513686 A JP 2006513686A JP 2006513686 A JP2006513686 A JP 2006513686A JP 4504368 B2 JP4504368 B2 JP 4504368B2
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JP
Japan
Prior art keywords
gas
unit
flow path
manual valve
common flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2006513686A
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English (en)
Japanese (ja)
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JPWO2005114016A1 (ja
Inventor
昭宏 武市
達人 青山
敏一 三輪
暁典 長屋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CKD Corp
Original Assignee
CKD Corp
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Publication date
Application filed by CKD Corp filed Critical CKD Corp
Publication of JPWO2005114016A1 publication Critical patent/JPWO2005114016A1/ja
Application granted granted Critical
Publication of JP4504368B2 publication Critical patent/JP4504368B2/ja
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Expired - Lifetime legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/003—Housing formed from a plurality of the same valve elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K5/00—Plug valves; Taps or cocks comprising only cut-off apparatus having at least one of the sealing faces shaped as a more or less complete surface of a solid of revolution, the opening and closing movement being predominantly rotary
    • F16K5/08—Details
    • F16K5/10—Means for additional adjustment of the rate of flow
    • F16K5/103—Means for additional adjustment of the rate of flow specially adapted for gas valves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Valve Housings (AREA)
  • Pipeline Systems (AREA)
JP2006513686A 2004-05-20 2005-05-12 ガス供給集積ユニット及びガスユニットの増設方法 Expired - Lifetime JP4504368B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004150192 2004-05-20
JP2004150192 2004-05-20
PCT/JP2005/008694 WO2005114016A1 (ja) 2004-05-20 2005-05-12 ガス供給集積ユニット及びガスユニットの増設方法

Publications (2)

Publication Number Publication Date
JPWO2005114016A1 JPWO2005114016A1 (ja) 2008-03-27
JP4504368B2 true JP4504368B2 (ja) 2010-07-14

Family

ID=35428453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006513686A Expired - Lifetime JP4504368B2 (ja) 2004-05-20 2005-05-12 ガス供給集積ユニット及びガスユニットの増設方法

Country Status (5)

Country Link
JP (1) JP4504368B2 (enExample)
KR (1) KR101074266B1 (enExample)
CN (1) CN100408900C (enExample)
TW (1) TW200540353A (enExample)
WO (1) WO2005114016A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5081665B2 (ja) * 2008-02-28 2012-11-28 株式会社フジキン 流体制御装置
JP5324347B2 (ja) * 2009-07-15 2013-10-23 大陽日酸イー・エム・シー株式会社 気相成長装置
JP5669583B2 (ja) * 2009-09-30 2015-02-12 株式会社堀場エステック 流量算出システム、集積型ガスパネル装置及びベースプレート
JP5797010B2 (ja) * 2011-05-20 2015-10-21 株式会社フジキン 流体制御装置
US20140137961A1 (en) * 2012-11-19 2014-05-22 Applied Materials, Inc. Modular chemical delivery system
WO2017221891A1 (ja) * 2016-06-21 2017-12-28 株式会社フジキン 流体制御装置
TWI650500B (zh) * 2018-04-02 2019-02-11 奇鼎科技股份有限公司 多流道閥塊
JP7583186B2 (ja) 2021-03-03 2024-11-13 アイコール・システムズ・インク マニホールドアセンブリを備える流体流れ制御システム

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10214117A (ja) * 1998-03-05 1998-08-11 Ckd Corp ガス供給集積ユニット及びそのシステム
JPH11294698A (ja) * 1998-04-10 1999-10-29 Nippon Sanso Kk ガス供給設備
JP2000035148A (ja) * 1998-07-22 2000-02-02 Hitachi Metals Ltd 集積形流体制御装置
JP2001254900A (ja) * 2000-03-10 2001-09-21 Toshiba Corp 流体制御装置
JP2001355800A (ja) * 2000-06-14 2001-12-26 Nippon Applied Flow Kk ガス供給装置
JP2003091322A (ja) * 2001-09-17 2003-03-28 Ckd Corp ガス供給集積弁
JP3482601B2 (ja) * 2000-06-30 2003-12-22 東京エレクトロン株式会社 流体制御装置
JP2005069305A (ja) * 2003-08-22 2005-03-17 Fujikin Inc 流体制御装置
JP2005150191A (ja) * 2003-11-12 2005-06-09 Ckd Corp ガス供給集積ユニット
JP2005251790A (ja) * 2004-03-01 2005-09-15 Ckd Corp ガス供給集積ユニット

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6068016A (en) * 1997-09-25 2000-05-30 Applied Materials, Inc Modular fluid flow system with integrated pump-purge
JP3409060B2 (ja) * 1999-03-31 2003-05-19 エスエムシー株式会社 シリアル信号駆動のマニホールド形電磁弁
US6325248B1 (en) * 2000-07-05 2001-12-04 Robert E. Corba Container assembly
JP4487135B2 (ja) * 2001-03-05 2010-06-23 東京エレクトロン株式会社 流体制御装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10214117A (ja) * 1998-03-05 1998-08-11 Ckd Corp ガス供給集積ユニット及びそのシステム
JPH11294698A (ja) * 1998-04-10 1999-10-29 Nippon Sanso Kk ガス供給設備
JP2000035148A (ja) * 1998-07-22 2000-02-02 Hitachi Metals Ltd 集積形流体制御装置
JP2001254900A (ja) * 2000-03-10 2001-09-21 Toshiba Corp 流体制御装置
JP2001355800A (ja) * 2000-06-14 2001-12-26 Nippon Applied Flow Kk ガス供給装置
JP3482601B2 (ja) * 2000-06-30 2003-12-22 東京エレクトロン株式会社 流体制御装置
JP2003091322A (ja) * 2001-09-17 2003-03-28 Ckd Corp ガス供給集積弁
JP2005069305A (ja) * 2003-08-22 2005-03-17 Fujikin Inc 流体制御装置
JP2005150191A (ja) * 2003-11-12 2005-06-09 Ckd Corp ガス供給集積ユニット
JP2005251790A (ja) * 2004-03-01 2005-09-15 Ckd Corp ガス供給集積ユニット

Also Published As

Publication number Publication date
TW200540353A (en) 2005-12-16
KR101074266B1 (ko) 2011-10-19
CN100408900C (zh) 2008-08-06
CN1957197A (zh) 2007-05-02
WO2005114016A1 (ja) 2005-12-01
KR20070028428A (ko) 2007-03-12
TWI338755B (enExample) 2011-03-11
JPWO2005114016A1 (ja) 2008-03-27

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