CN100408900C - 气体供给集成单元和气体单元的增设方法 - Google Patents

气体供给集成单元和气体单元的增设方法 Download PDF

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Publication number
CN100408900C
CN100408900C CNB2005800160442A CN200580016044A CN100408900C CN 100408900 C CN100408900 C CN 100408900C CN B2005800160442 A CNB2005800160442 A CN B2005800160442A CN 200580016044 A CN200580016044 A CN 200580016044A CN 100408900 C CN100408900 C CN 100408900C
Authority
CN
China
Prior art keywords
gas
flow path
unit
manual valve
common flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2005800160442A
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English (en)
Chinese (zh)
Other versions
CN1957197A (zh
Inventor
武市昭宏
青山达人
三轮敏一
长屋小典
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CKD Corp
Original Assignee
CKD Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CKD Corp filed Critical CKD Corp
Publication of CN1957197A publication Critical patent/CN1957197A/zh
Application granted granted Critical
Publication of CN100408900C publication Critical patent/CN100408900C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/003—Housing formed from a plurality of the same valve elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K5/00—Plug valves; Taps or cocks comprising only cut-off apparatus having at least one of the sealing faces shaped as a more or less complete surface of a solid of revolution, the opening and closing movement being predominantly rotary
    • F16K5/08—Details
    • F16K5/10—Means for additional adjustment of the rate of flow
    • F16K5/103—Means for additional adjustment of the rate of flow specially adapted for gas valves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Valve Housings (AREA)
  • Pipeline Systems (AREA)
CNB2005800160442A 2004-05-20 2005-05-12 气体供给集成单元和气体单元的增设方法 Expired - Lifetime CN100408900C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004150192 2004-05-20
JP150192/2004 2004-05-20

Publications (2)

Publication Number Publication Date
CN1957197A CN1957197A (zh) 2007-05-02
CN100408900C true CN100408900C (zh) 2008-08-06

Family

ID=35428453

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800160442A Expired - Lifetime CN100408900C (zh) 2004-05-20 2005-05-12 气体供给集成单元和气体单元的增设方法

Country Status (5)

Country Link
JP (1) JP4504368B2 (enExample)
KR (1) KR101074266B1 (enExample)
CN (1) CN100408900C (enExample)
TW (1) TW200540353A (enExample)
WO (1) WO2005114016A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5081665B2 (ja) * 2008-02-28 2012-11-28 株式会社フジキン 流体制御装置
JP5324347B2 (ja) * 2009-07-15 2013-10-23 大陽日酸イー・エム・シー株式会社 気相成長装置
JP5669583B2 (ja) * 2009-09-30 2015-02-12 株式会社堀場エステック 流量算出システム、集積型ガスパネル装置及びベースプレート
JP5797010B2 (ja) * 2011-05-20 2015-10-21 株式会社フジキン 流体制御装置
US20140137961A1 (en) * 2012-11-19 2014-05-22 Applied Materials, Inc. Modular chemical delivery system
WO2017221891A1 (ja) * 2016-06-21 2017-12-28 株式会社フジキン 流体制御装置
TWI650500B (zh) * 2018-04-02 2019-02-11 奇鼎科技股份有限公司 多流道閥塊
JP7583186B2 (ja) 2021-03-03 2024-11-13 アイコール・システムズ・インク マニホールドアセンブリを備える流体流れ制御システム

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10214117A (ja) * 1998-03-05 1998-08-11 Ckd Corp ガス供給集積ユニット及びそのシステム
JP2000035148A (ja) * 1998-07-22 2000-02-02 Hitachi Metals Ltd 集積形流体制御装置
US6068016A (en) * 1997-09-25 2000-05-30 Applied Materials, Inc Modular fluid flow system with integrated pump-purge
CN1268639A (zh) * 1999-03-31 2000-10-04 速睦喜股份有限公司 串行信号驱动的集成式电磁阀
US20020003147A1 (en) * 2000-07-05 2002-01-10 Corba Robert E. Container assembly for dispensing non-atomized composition mixed internally upon dispensing
JP2002267100A (ja) * 2001-03-05 2002-09-18 Tokyo Electron Ltd 流体制御装置
JP2003091322A (ja) * 2001-09-17 2003-03-28 Ckd Corp ガス供給集積弁

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11294698A (ja) * 1998-04-10 1999-10-29 Nippon Sanso Kk ガス供給設備
JP4238453B2 (ja) * 2000-03-10 2009-03-18 株式会社東芝 流体制御装置
JP2001355800A (ja) * 2000-06-14 2001-12-26 Nippon Applied Flow Kk ガス供給装置
JP3482601B2 (ja) * 2000-06-30 2003-12-22 東京エレクトロン株式会社 流体制御装置
JP4501027B2 (ja) * 2003-08-22 2010-07-14 株式会社フジキン 流体制御装置
JP3809162B2 (ja) * 2003-11-12 2006-08-16 シーケーディ株式会社 ガス供給集積ユニット
JP3767897B2 (ja) * 2004-03-01 2006-04-19 シーケーディ株式会社 ガス供給集積ユニット

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6068016A (en) * 1997-09-25 2000-05-30 Applied Materials, Inc Modular fluid flow system with integrated pump-purge
JPH10214117A (ja) * 1998-03-05 1998-08-11 Ckd Corp ガス供給集積ユニット及びそのシステム
JP2000035148A (ja) * 1998-07-22 2000-02-02 Hitachi Metals Ltd 集積形流体制御装置
CN1268639A (zh) * 1999-03-31 2000-10-04 速睦喜股份有限公司 串行信号驱动的集成式电磁阀
US20020003147A1 (en) * 2000-07-05 2002-01-10 Corba Robert E. Container assembly for dispensing non-atomized composition mixed internally upon dispensing
JP2002267100A (ja) * 2001-03-05 2002-09-18 Tokyo Electron Ltd 流体制御装置
JP2003091322A (ja) * 2001-09-17 2003-03-28 Ckd Corp ガス供給集積弁

Also Published As

Publication number Publication date
TW200540353A (en) 2005-12-16
KR101074266B1 (ko) 2011-10-19
JP4504368B2 (ja) 2010-07-14
CN1957197A (zh) 2007-05-02
WO2005114016A1 (ja) 2005-12-01
KR20070028428A (ko) 2007-03-12
TWI338755B (enExample) 2011-03-11
JPWO2005114016A1 (ja) 2008-03-27

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Granted publication date: 20080806

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