KR101074266B1 - 가스 공급 집적 유닛 및 가스 유닛의 증설 방법 - Google Patents

가스 공급 집적 유닛 및 가스 유닛의 증설 방법 Download PDF

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Publication number
KR101074266B1
KR101074266B1 KR1020067026668A KR20067026668A KR101074266B1 KR 101074266 B1 KR101074266 B1 KR 101074266B1 KR 1020067026668 A KR1020067026668 A KR 1020067026668A KR 20067026668 A KR20067026668 A KR 20067026668A KR 101074266 B1 KR101074266 B1 KR 101074266B1
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KR
South Korea
Prior art keywords
gas
unit
manual valve
common flow
flow passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020067026668A
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English (en)
Korean (ko)
Other versions
KR20070028428A (ko
Inventor
아키히로 타케치
타츠히토 아오야마
토시카즈 미와
아키노리 나가야
Original Assignee
씨케이디 가부시키 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 씨케이디 가부시키 가이샤 filed Critical 씨케이디 가부시키 가이샤
Publication of KR20070028428A publication Critical patent/KR20070028428A/ko
Application granted granted Critical
Publication of KR101074266B1 publication Critical patent/KR101074266B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/003—Housing formed from a plurality of the same valve elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K5/00—Plug valves; Taps or cocks comprising only cut-off apparatus having at least one of the sealing faces shaped as a more or less complete surface of a solid of revolution, the opening and closing movement being predominantly rotary
    • F16K5/08—Details
    • F16K5/10—Means for additional adjustment of the rate of flow
    • F16K5/103—Means for additional adjustment of the rate of flow specially adapted for gas valves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Valve Housings (AREA)
  • Pipeline Systems (AREA)
KR1020067026668A 2004-05-20 2006-12-18 가스 공급 집적 유닛 및 가스 유닛의 증설 방법 Expired - Lifetime KR101074266B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004150192 2004-05-20
JPJP-P-2004-00150192 2004-05-20
PCT/JP2005/008694 WO2005114016A1 (ja) 2004-05-20 2005-05-12 ガス供給集積ユニット及びガスユニットの増設方法

Publications (2)

Publication Number Publication Date
KR20070028428A KR20070028428A (ko) 2007-03-12
KR101074266B1 true KR101074266B1 (ko) 2011-10-19

Family

ID=35428453

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067026668A Expired - Lifetime KR101074266B1 (ko) 2004-05-20 2006-12-18 가스 공급 집적 유닛 및 가스 유닛의 증설 방법

Country Status (5)

Country Link
JP (1) JP4504368B2 (enExample)
KR (1) KR101074266B1 (enExample)
CN (1) CN100408900C (enExample)
TW (1) TW200540353A (enExample)
WO (1) WO2005114016A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5081665B2 (ja) * 2008-02-28 2012-11-28 株式会社フジキン 流体制御装置
JP5324347B2 (ja) * 2009-07-15 2013-10-23 大陽日酸イー・エム・シー株式会社 気相成長装置
JP5669583B2 (ja) * 2009-09-30 2015-02-12 株式会社堀場エステック 流量算出システム、集積型ガスパネル装置及びベースプレート
JP5797010B2 (ja) * 2011-05-20 2015-10-21 株式会社フジキン 流体制御装置
US20140137961A1 (en) * 2012-11-19 2014-05-22 Applied Materials, Inc. Modular chemical delivery system
WO2017221891A1 (ja) * 2016-06-21 2017-12-28 株式会社フジキン 流体制御装置
TWI650500B (zh) * 2018-04-02 2019-02-11 奇鼎科技股份有限公司 多流道閥塊
JP7583186B2 (ja) 2021-03-03 2024-11-13 アイコール・システムズ・インク マニホールドアセンブリを備える流体流れ制御システム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000035148A (ja) 1998-07-22 2000-02-02 Hitachi Metals Ltd 集積形流体制御装置
JP2002206700A (ja) 2000-06-30 2002-07-26 Tokyo Electron Ltd 流体制御装置
JP2002267100A (ja) 2001-03-05 2002-09-18 Tokyo Electron Ltd 流体制御装置
JP2003091322A (ja) 2001-09-17 2003-03-28 Ckd Corp ガス供給集積弁

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6068016A (en) * 1997-09-25 2000-05-30 Applied Materials, Inc Modular fluid flow system with integrated pump-purge
JPH10214117A (ja) * 1998-03-05 1998-08-11 Ckd Corp ガス供給集積ユニット及びそのシステム
JPH11294698A (ja) * 1998-04-10 1999-10-29 Nippon Sanso Kk ガス供給設備
JP3409060B2 (ja) * 1999-03-31 2003-05-19 エスエムシー株式会社 シリアル信号駆動のマニホールド形電磁弁
JP4238453B2 (ja) * 2000-03-10 2009-03-18 株式会社東芝 流体制御装置
JP2001355800A (ja) * 2000-06-14 2001-12-26 Nippon Applied Flow Kk ガス供給装置
US6325248B1 (en) * 2000-07-05 2001-12-04 Robert E. Corba Container assembly
JP4501027B2 (ja) * 2003-08-22 2010-07-14 株式会社フジキン 流体制御装置
JP3809162B2 (ja) * 2003-11-12 2006-08-16 シーケーディ株式会社 ガス供給集積ユニット
JP3767897B2 (ja) * 2004-03-01 2006-04-19 シーケーディ株式会社 ガス供給集積ユニット

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000035148A (ja) 1998-07-22 2000-02-02 Hitachi Metals Ltd 集積形流体制御装置
JP2002206700A (ja) 2000-06-30 2002-07-26 Tokyo Electron Ltd 流体制御装置
JP2002267100A (ja) 2001-03-05 2002-09-18 Tokyo Electron Ltd 流体制御装置
JP2003091322A (ja) 2001-09-17 2003-03-28 Ckd Corp ガス供給集積弁

Also Published As

Publication number Publication date
TW200540353A (en) 2005-12-16
JP4504368B2 (ja) 2010-07-14
CN100408900C (zh) 2008-08-06
CN1957197A (zh) 2007-05-02
WO2005114016A1 (ja) 2005-12-01
KR20070028428A (ko) 2007-03-12
TWI338755B (enExample) 2011-03-11
JPWO2005114016A1 (ja) 2008-03-27

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