JP4501130B2 - 撮像装置およびその製造方法 - Google Patents
撮像装置およびその製造方法 Download PDFInfo
- Publication number
- JP4501130B2 JP4501130B2 JP2003146149A JP2003146149A JP4501130B2 JP 4501130 B2 JP4501130 B2 JP 4501130B2 JP 2003146149 A JP2003146149 A JP 2003146149A JP 2003146149 A JP2003146149 A JP 2003146149A JP 4501130 B2 JP4501130 B2 JP 4501130B2
- Authority
- JP
- Japan
- Prior art keywords
- cover
- array
- lenses
- substrate
- spacing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/184,154 US6744109B2 (en) | 2002-06-26 | 2002-06-26 | Glass attachment over micro-lens arrays |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004031939A JP2004031939A (ja) | 2004-01-29 |
| JP2004031939A5 JP2004031939A5 (enExample) | 2006-06-29 |
| JP4501130B2 true JP4501130B2 (ja) | 2010-07-14 |
Family
ID=22675782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003146149A Expired - Lifetime JP4501130B2 (ja) | 2002-06-26 | 2003-05-23 | 撮像装置およびその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US6744109B2 (enExample) |
| JP (1) | JP4501130B2 (enExample) |
| GB (3) | GB2416245B (enExample) |
Families Citing this family (85)
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| US7137182B2 (en) * | 2002-11-22 | 2006-11-21 | The Boeing Company | Parallel configuration composite material fabricator |
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| JP2004296453A (ja) * | 2003-02-06 | 2004-10-21 | Sharp Corp | 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法 |
| US6972480B2 (en) | 2003-06-16 | 2005-12-06 | Shellcase Ltd. | Methods and apparatus for packaging integrated circuit devices |
| CN100587962C (zh) | 2003-07-03 | 2010-02-03 | 泰塞拉技术匈牙利公司 | 用于封装集成电路器件的方法和设备 |
| KR20060059873A (ko) * | 2003-08-22 | 2006-06-02 | 코니카 미놀타 옵토 인코포레이티드 | 고체 촬상 장치 및 상기 고체 촬상 장치를 구비한 촬상장치 및 고체 촬상 장치의 마이크로렌즈 어레이 제조 방법 |
| US7129576B2 (en) | 2003-09-26 | 2006-10-31 | Tessera, Inc. | Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps |
| US7064452B2 (en) * | 2003-11-04 | 2006-06-20 | Tai-Saw Technology Co., Ltd. | Package structure with a retarding structure and method of making same |
| US7476955B2 (en) * | 2004-01-06 | 2009-01-13 | Micron Technology, Inc. | Die package having an adhesive flow restriction area |
| US20050247990A1 (en) * | 2004-05-05 | 2005-11-10 | Ming-Te Cheng | Image sensor packages and method of assembling the same |
| JP3830495B2 (ja) * | 2004-05-10 | 2006-10-04 | シャープ株式会社 | 半導体装置、半導体装置の製造方法及び光学装置用モジュール |
| US7608811B2 (en) * | 2004-05-21 | 2009-10-27 | Aptina Imaging Corporation | Minimal depth light filtering image sensor |
| JP2005347416A (ja) * | 2004-06-01 | 2005-12-15 | Sharp Corp | 固体撮像装置、半導体ウエハ及びカメラモジュール |
| JP4838501B2 (ja) * | 2004-06-15 | 2011-12-14 | 富士通セミコンダクター株式会社 | 撮像装置及びその製造方法 |
| US7397066B2 (en) * | 2004-08-19 | 2008-07-08 | Micron Technology, Inc. | Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers |
| US7329856B2 (en) * | 2004-08-24 | 2008-02-12 | Micron Technology, Inc. | Image sensor having integrated infrared-filtering optical device and related method |
| US20070148807A1 (en) | 2005-08-22 | 2007-06-28 | Salman Akram | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers |
| TWM271321U (en) * | 2004-09-10 | 2005-07-21 | Aiptek Int Inc | Flip-chip packaging device |
| WO2006040986A1 (ja) * | 2004-10-13 | 2006-04-20 | Sumitomo Bakelite Co., Ltd. | 受光装置 |
| US7342268B2 (en) * | 2004-12-23 | 2008-03-11 | International Business Machines Corporation | CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom |
| JP2006216698A (ja) * | 2005-02-02 | 2006-08-17 | Fuji Film Microdevices Co Ltd | 固体撮像装置 |
| US7449779B2 (en) * | 2005-03-22 | 2008-11-11 | Tessera, Inc. | Wire bonded wafer level cavity package |
| US8143095B2 (en) | 2005-03-22 | 2012-03-27 | Tessera, Inc. | Sequential fabrication of vertical conductive interconnects in capped chips |
| TW200644261A (en) * | 2005-06-06 | 2006-12-16 | Megica Corp | Chip-package structure and manufacturing process thereof |
| GB0512732D0 (en) * | 2005-06-22 | 2005-07-27 | Melexis Nv | Semiconductor package with transparent lid |
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| JP2007150260A (ja) * | 2005-10-28 | 2007-06-14 | Matsushita Electric Ind Co Ltd | 固体撮像装置とその製造方法 |
| US8093672B2 (en) * | 2005-10-28 | 2012-01-10 | Panasonic Corporation | Solid-state imaging device |
| US7936062B2 (en) | 2006-01-23 | 2011-05-03 | Tessera Technologies Ireland Limited | Wafer level chip packaging |
| JP2007235276A (ja) * | 2006-02-27 | 2007-09-13 | Kyocera Corp | 撮像デバイス |
| US8120168B2 (en) | 2006-03-21 | 2012-02-21 | Promerus Llc | Methods and materials useful for chip stacking, chip and wafer bonding |
| EP1997138B1 (en) * | 2006-03-21 | 2011-09-14 | Promerus LLC | Methods and materials useful for chip stacking, chip and wafer bonding |
| US10298834B2 (en) | 2006-12-01 | 2019-05-21 | Google Llc | Video refocusing |
| US8604605B2 (en) | 2007-01-05 | 2013-12-10 | Invensas Corp. | Microelectronic assembly with multi-layer support structure |
| JP4384202B2 (ja) * | 2007-05-31 | 2009-12-16 | シャープ株式会社 | 半導体装置およびそれを備えた光学装置用モジュール |
| JP4378394B2 (ja) * | 2007-05-31 | 2009-12-02 | シャープ株式会社 | 半導体装置およびそれを備えた光学装置用モジュール |
| JP4909848B2 (ja) * | 2007-09-14 | 2012-04-04 | 株式会社フジクラ | 半導体パッケージの製造方法 |
| KR20090033070A (ko) * | 2007-09-27 | 2009-04-01 | 엘지이노텍 주식회사 | 카메라 모듈 |
| JP2009088407A (ja) * | 2007-10-02 | 2009-04-23 | Panasonic Corp | 固体撮像装置およびその製造方法 |
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| US8519500B2 (en) * | 2007-11-26 | 2013-08-27 | United Microelectronics Corp. | Image sensor with correcting lens and fabrication thereof |
| US7701636B2 (en) | 2008-03-06 | 2010-04-20 | Aptina Imaging Corporation | Gradient index microlenses and method of formation |
| JP2009260269A (ja) * | 2008-03-18 | 2009-11-05 | Panasonic Corp | 光学デバイス及びその製造方法 |
| JP5329903B2 (ja) * | 2008-10-15 | 2013-10-30 | オリンパス株式会社 | 固体撮像装置、固体撮像装置の製造方法 |
| WO2010098771A1 (en) * | 2009-02-27 | 2010-09-02 | Hewlett-Packard Development Company, L.P. | Micro device packaging |
| TW201103128A (en) * | 2009-07-03 | 2011-01-16 | Creative Sensor Inc | Image sensor and the method for package of the same |
| EP2529333A4 (en) | 2010-01-28 | 2013-10-23 | Pathway Innovations And Technologies Inc | DOCUMENT IMAGING SYSTEM WITH A CAMERA SCANNER DEVICE AND A PC-BASED PROCESSING SOFTWARE |
| US9341792B2 (en) | 2010-06-29 | 2016-05-17 | Cisco Technology, Inc. | Vent structures for encapsulated components on an SOI-based photonics platform |
| CN102738013B (zh) * | 2011-04-13 | 2016-04-20 | 精材科技股份有限公司 | 晶片封装体及其制作方法 |
| US9858649B2 (en) | 2015-09-30 | 2018-01-02 | Lytro, Inc. | Depth-based image blurring |
| US10334151B2 (en) | 2013-04-22 | 2019-06-25 | Google Llc | Phase detection autofocus using subaperture images |
| CN103338324A (zh) * | 2013-06-13 | 2013-10-02 | 业成光电(深圳)有限公司 | 具有摄像功能的电子装置 |
| KR102055840B1 (ko) | 2014-02-20 | 2019-12-17 | 삼성전자 주식회사 | 이미지 센서 패키지 |
| US10540818B2 (en) | 2015-04-15 | 2020-01-21 | Google Llc | Stereo image generation and interactive playback |
| US10546424B2 (en) | 2015-04-15 | 2020-01-28 | Google Llc | Layered content delivery for virtual and augmented reality experiences |
| US10419737B2 (en) | 2015-04-15 | 2019-09-17 | Google Llc | Data structures and delivery methods for expediting virtual reality playback |
| WO2016168415A1 (en) * | 2015-04-15 | 2016-10-20 | Lytro, Inc. | Light guided image plane tiled arrays with dense fiber optic bundles for light-field and high resolution image acquisition |
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| US11328446B2 (en) | 2015-04-15 | 2022-05-10 | Google Llc | Combining light-field data with active depth data for depth map generation |
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| US10197806B2 (en) | 2016-06-07 | 2019-02-05 | Google Llc | Fabrication of air gap regions in multicomponent lens systems |
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| WO2019241398A1 (en) | 2018-06-12 | 2019-12-19 | Wendong Xing | Edge sealant application for optical devices |
| EP3827303B1 (en) * | 2018-07-23 | 2023-07-05 | Magic Leap, Inc. | Optical device venting gaps for edge sealant and lamination dam |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55135484A (en) * | 1979-04-09 | 1980-10-22 | Dainippon Printing Co Ltd | Manufacture of color solid state pickup element plate |
| JPS61267363A (ja) * | 1985-05-21 | 1986-11-26 | Toshiba Corp | イメ−ジセンサ |
| JPH01293659A (ja) * | 1988-05-23 | 1989-11-27 | Seiko Epson Corp | カラー固体撮像素子板の製造方法 |
| JP2987455B2 (ja) * | 1991-10-17 | 1999-12-06 | オリンパス光学工業株式会社 | 固体撮像装置 |
| JPH06334159A (ja) * | 1993-05-18 | 1994-12-02 | Matsushita Electron Corp | 固体撮像装置およびその製造方法 |
| JPH08116042A (ja) * | 1994-10-18 | 1996-05-07 | Olympus Optical Co Ltd | 固体撮像装置及びその製造方法 |
| KR0148733B1 (ko) * | 1995-04-27 | 1998-08-01 | 문정환 | 고체 촬상 소자용 패키지 및 그 제조방법 |
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| JPH11121653A (ja) * | 1997-07-31 | 1999-04-30 | Fuji Film Microdevices Co Ltd | 半導体装置とその製造方法 |
| JP2001157664A (ja) * | 1999-12-03 | 2001-06-12 | Asahi Optical Co Ltd | 電子内視鏡用の撮像素子および電子内視鏡 |
| JP3880278B2 (ja) * | 2000-03-10 | 2007-02-14 | オリンパス株式会社 | 固体撮像装置及びその製造方法 |
| JP3527166B2 (ja) * | 2000-03-15 | 2004-05-17 | シャープ株式会社 | 固体撮像装置及びその製造方法 |
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| JP2001351997A (ja) * | 2000-06-09 | 2001-12-21 | Canon Inc | 受光センサーの実装構造体およびその使用方法 |
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| US6470594B1 (en) * | 2001-09-21 | 2002-10-29 | Eastman Kodak Company | Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps |
| JP4241160B2 (ja) * | 2002-04-22 | 2009-03-18 | 富士フイルム株式会社 | 固体撮像装置の製造方法 |
-
2002
- 2002-06-26 US US10/184,154 patent/US6744109B2/en not_active Expired - Lifetime
-
2003
- 2003-05-23 JP JP2003146149A patent/JP4501130B2/ja not_active Expired - Lifetime
- 2003-06-05 GB GB0516171A patent/GB2416245B/en not_active Expired - Lifetime
- 2003-06-05 GB GB0312936A patent/GB2391707B/en not_active Expired - Fee Related
- 2003-06-05 GB GB0613857A patent/GB2427073B/en not_active Expired - Lifetime
- 2003-08-04 US US10/634,594 patent/US6794218B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| GB0516171D0 (en) | 2005-09-14 |
| GB2427073A (en) | 2006-12-13 |
| JP2004031939A (ja) | 2004-01-29 |
| US6744109B2 (en) | 2004-06-01 |
| GB0613857D0 (en) | 2006-08-23 |
| GB2416245B (en) | 2007-01-10 |
| US20040036069A1 (en) | 2004-02-26 |
| GB2391707A (en) | 2004-02-11 |
| US20040002179A1 (en) | 2004-01-01 |
| GB2391707B (en) | 2006-03-15 |
| GB2427073B (en) | 2007-02-21 |
| US6794218B2 (en) | 2004-09-21 |
| GB2416245A (en) | 2006-01-18 |
| GB0312936D0 (en) | 2003-07-09 |
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