GB0512732D0 - Semiconductor package with transparent lid - Google Patents

Semiconductor package with transparent lid

Info

Publication number
GB0512732D0
GB0512732D0 GB0512732A GB0512732A GB0512732D0 GB 0512732 D0 GB0512732 D0 GB 0512732D0 GB 0512732 A GB0512732 A GB 0512732A GB 0512732 A GB0512732 A GB 0512732A GB 0512732 D0 GB0512732 D0 GB 0512732D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor package
transparent lid
ridges
adhesive
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GB0512732A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Melexis NV
Original Assignee
Melexis NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Melexis NV filed Critical Melexis NV
Priority to GB0512732A priority Critical patent/GB0512732D0/en
Publication of GB0512732D0 publication Critical patent/GB0512732D0/en
Priority to PCT/IB2006/001707 priority patent/WO2006136935A2/en
Priority to EP06779754A priority patent/EP1894248A2/en
Ceased legal-status Critical Current

Links

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Light Receiving Elements (AREA)

Abstract

In an optical integrated circuit device a transparent element (106) is mounted over at least the optically active elements (102) in order to provide protection for the integrated circuit during use. The transparent element 106 is retained in position by adhesive (105). The adhesive (105) is deposited between and maintained in position by a pair of ridges (104) provided around the optically active element or elements. The ridges (104) are formed from an organic photolithographic gel.
GB0512732A 2005-06-22 2005-06-22 Semiconductor package with transparent lid Ceased GB0512732D0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB0512732A GB0512732D0 (en) 2005-06-22 2005-06-22 Semiconductor package with transparent lid
PCT/IB2006/001707 WO2006136935A2 (en) 2005-06-22 2006-06-22 Semiconductor package with transparent lid
EP06779754A EP1894248A2 (en) 2005-06-22 2006-06-22 Semiconductor package with transparent lid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0512732A GB0512732D0 (en) 2005-06-22 2005-06-22 Semiconductor package with transparent lid

Publications (1)

Publication Number Publication Date
GB0512732D0 true GB0512732D0 (en) 2005-07-27

Family

ID=34855975

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0512732A Ceased GB0512732D0 (en) 2005-06-22 2005-06-22 Semiconductor package with transparent lid

Country Status (3)

Country Link
EP (1) EP1894248A2 (en)
GB (1) GB0512732D0 (en)
WO (1) WO2006136935A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10197806B2 (en) 2016-06-07 2019-02-05 Google Llc Fabrication of air gap regions in multicomponent lens systems

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534725A (en) * 1992-06-16 1996-07-09 Goldstar Electron Co., Ltd. Resin molded charge coupled device package and method for preparation thereof
JPH11121653A (en) * 1997-07-31 1999-04-30 Fuji Film Microdevices Co Ltd Semiconductor device and method for manufacturing it
EP1041628A3 (en) * 1999-03-29 2008-05-28 Interuniversitair Microelektronica Centrum Vzw An image sensor ball grid array package and the fabrication thereof
US6744109B2 (en) * 2002-06-26 2004-06-01 Agilent Technologies, Inc. Glass attachment over micro-lens arrays

Also Published As

Publication number Publication date
WO2006136935A2 (en) 2006-12-28
EP1894248A2 (en) 2008-03-05
WO2006136935A3 (en) 2007-04-05

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)