JP2006216698A - 固体撮像装置 - Google Patents
固体撮像装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 claims abstract description 27
- 238000007789 sealing Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
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- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000005380 borophosphosilicate glass Substances 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14632—Wafer-level processed structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
【解決手段】 受光領域を備える固体撮像素子が形成された半導体基板と、受光領域の外部の半導体基板上に形成された基台と、基台上の一部に接着された第1の部材と、受光領域と第1の部材との間の基台に形成された凹部と、第1の部材に支持され、受光領域上方に配置され、受光領域を封止する第2の部材とを有する固体撮像装置を提供する。
【選択図】 図2
Description
小型化の一例として、マイクロレンズを備えた受光エリアを有する固体撮像素子チップの受光エリアのみに対し、下面縁部に枠部を一体的に形成した透明材料からなる封止部材を配置し、マイクロレンズの表面と封止部材の下面の間に5μm以上の空間を形成して気密封止し、小型実装したマイクロレンズ付きの固体撮像装置の開示がなされている。(たとえば、特許文献1参照。)
また、小型化の要請を満たしながら、容易かつ高信頼性で固体撮像装置を製造する製造方法の発明が開示されている。(たとえば、特許文献2参照。)
小型化の要求に応じるため、パッケージ等の部材を固体撮像素子の形成された半導体基板上に、直接、または中間部材(たとえば土台)を介して貼り付ける方法も数々提案されている。
図4(A)を参照する。固体撮像素子20、及び、外部との配線を行うためのパッド21の形成された半導体基板81(ウエハ)を準備する。
なお、スペーサ23は、保護ガラス22上に接着剤24aを塗布し、そこにシリコン基板を載置、接着した後、必要に応じて研磨して所望の厚さとし、フォトリソグラフィとドライエッチングを行って所定形状に形成される。
図4(D)を参照する。半導体基板81のパッド21間を砥石で研削切断し、チップサイズレベルの固体撮像装置25を作製する。
図5(B)を参照する。図4(B)を参照して説明したように、半導体基板81上に形成された土台27に、接着剤24bの転写されたスペーサ23が接着される。このとき、接着剤24bが、スペーサ23の貼り付け位置から内側(受光領域側)にはみ出す場合がある。図においては、接着剤24bのはみ出しの様子を、点線の矢印で示した。
スペーサ23上には、透光性部材、たとえば厚さ250μmの保護ガラス22が載置され、受光領域を封止する。
図3(A)及び(B)の双方において、パッド21の幅はたとえば100μmである。また、パッド21と土台27との距離はたとえば90μmであり、土台27のパッド21側端部からスペーサ23の取り付け位置までの距離は、たとえば20μmである。
21 パッド
22 保護ガラス
23 スペーサ
24a、b 接着剤
25 固体撮像装置
26 受光領域
27 土台
27a 溝
51 固体撮像素子
52 駆動信号発生装置
53 アナログ前段処理装置
54 デジタル信号処理装置
55 タイミングジェネレータ
61 受光部
62 感光部
64 垂直CCD部
66 水平CCD部
67 アンプ
68 光電変換素子
69 MOSトランジスタ
71 電荷蓄積領域
72 読み出しゲート
73 垂直転送チャネル
74 ゲート絶縁膜
75 垂直転送電極
76 チャネルストップ領域
77 シリコン酸化膜
78 窒化シリコン膜
79 遮光膜
79a 開口部
81 半導体基板
82 ウエル層
83a,b 平坦化層
84 カラーフィルタ層
85 マイクロレンズ
Claims (4)
- 受光領域を備える固体撮像素子が形成された半導体基板と、
前記受光領域の外部の前記半導体基板上に形成された基台と、
前記基台上の一部に接着された第1の部材と、
前記受光領域と、前記第1の部材との間の前記基台に形成された凹部と、
前記第1の部材に支持され、前記受光領域上方に配置され、前記受光領域を封止する第2の部材と
を有する固体撮像装置。 - 更に、前記受光領域上方に、前記基台と同じ材料で形成されたマイクロレンズを含む請求項1に記載の固体撮像装置。
- 前記固体撮像素子がCCD型の固体撮像素子である請求項1または2に記載の固体撮像装置。
- 前記固体撮像素子がMOS型の固体撮像素子である請求項1または2に記載の固体撮像装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005026776A JP2006216698A (ja) | 2005-02-02 | 2005-02-02 | 固体撮像装置 |
US11/320,759 US20060170800A1 (en) | 2005-02-02 | 2005-12-30 | Solid state image pickup device |
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Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005026776A JP2006216698A (ja) | 2005-02-02 | 2005-02-02 | 固体撮像装置 |
Publications (1)
Publication Number | Publication Date |
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JP2006216698A true JP2006216698A (ja) | 2006-08-17 |
Family
ID=36756092
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JP2005026776A Pending JP2006216698A (ja) | 2005-02-02 | 2005-02-02 | 固体撮像装置 |
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US (1) | US20060170800A1 (ja) |
JP (1) | JP2006216698A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010098066A (ja) * | 2008-10-15 | 2010-04-30 | Olympus Corp | 固体撮像装置、固体撮像装置の製造方法 |
WO2021106490A1 (ja) * | 2019-11-29 | 2021-06-03 | 株式会社ジャパンディスプレイ | 検出装置及び検出装置の製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009081497A1 (ja) * | 2007-12-26 | 2009-07-02 | Unisantis Electronics (Japan) Ltd. | 固体撮像素子、固体撮像装置及びその製造方法 |
JP2011054794A (ja) * | 2009-09-02 | 2011-03-17 | Panasonic Corp | 光学デバイス及びその製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05110960A (ja) * | 1991-10-17 | 1993-04-30 | Olympus Optical Co Ltd | 固体撮像装置 |
JPH09102896A (ja) * | 1995-10-04 | 1997-04-15 | Fuji Photo Optical Co Ltd | 電子内視鏡の撮像素子組付け体 |
JPH09232551A (ja) * | 1996-02-26 | 1997-09-05 | Toshiba Corp | 光電変換装置 |
JP2002231920A (ja) * | 2001-02-06 | 2002-08-16 | Olympus Optical Co Ltd | 固体撮像装置及びその製造方法 |
JP2003204053A (ja) * | 2001-03-05 | 2003-07-18 | Canon Inc | 撮像モジュール及び該撮像モジュールの製造方法、デジタルカメラ |
JP2004031939A (ja) * | 2002-06-26 | 2004-01-29 | Agilent Technol Inc | 撮像装置およびその製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7583862B2 (en) * | 2003-11-26 | 2009-09-01 | Aptina Imaging Corporation | Packaged microelectronic imagers and methods of packaging microelectronic imagers |
-
2005
- 2005-02-02 JP JP2005026776A patent/JP2006216698A/ja active Pending
- 2005-12-30 US US11/320,759 patent/US20060170800A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05110960A (ja) * | 1991-10-17 | 1993-04-30 | Olympus Optical Co Ltd | 固体撮像装置 |
JPH09102896A (ja) * | 1995-10-04 | 1997-04-15 | Fuji Photo Optical Co Ltd | 電子内視鏡の撮像素子組付け体 |
JPH09232551A (ja) * | 1996-02-26 | 1997-09-05 | Toshiba Corp | 光電変換装置 |
JP2002231920A (ja) * | 2001-02-06 | 2002-08-16 | Olympus Optical Co Ltd | 固体撮像装置及びその製造方法 |
JP2003204053A (ja) * | 2001-03-05 | 2003-07-18 | Canon Inc | 撮像モジュール及び該撮像モジュールの製造方法、デジタルカメラ |
JP2004031939A (ja) * | 2002-06-26 | 2004-01-29 | Agilent Technol Inc | 撮像装置およびその製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010098066A (ja) * | 2008-10-15 | 2010-04-30 | Olympus Corp | 固体撮像装置、固体撮像装置の製造方法 |
WO2021106490A1 (ja) * | 2019-11-29 | 2021-06-03 | 株式会社ジャパンディスプレイ | 検出装置及び検出装置の製造方法 |
JP7377082B2 (ja) | 2019-11-29 | 2023-11-09 | 株式会社ジャパンディスプレイ | 検出装置及び検出装置の製造方法 |
US11875594B2 (en) | 2019-11-29 | 2024-01-16 | Japan Display Inc. | Detection device and method for manufacturing same |
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