JP4463453B2 - エポキシ樹脂組成物及びその硬化物 - Google Patents

エポキシ樹脂組成物及びその硬化物 Download PDF

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Publication number
JP4463453B2
JP4463453B2 JP2001305904A JP2001305904A JP4463453B2 JP 4463453 B2 JP4463453 B2 JP 4463453B2 JP 2001305904 A JP2001305904 A JP 2001305904A JP 2001305904 A JP2001305904 A JP 2001305904A JP 4463453 B2 JP4463453 B2 JP 4463453B2
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Japan
Prior art keywords
epoxy resin
resin composition
formula
present
curing
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Expired - Fee Related
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JP2001305904A
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Japanese (ja)
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JP2002284841A5 (https=
JP2002284841A (ja
Inventor
泰昌 赤塚
幸治 中山
克彦 押見
匠一 富田
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Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
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Priority to JP2001305904A priority Critical patent/JP4463453B2/ja
Publication of JP2002284841A publication Critical patent/JP2002284841A/ja
Publication of JP2002284841A5 publication Critical patent/JP2002284841A5/ja
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Publication of JP4463453B2 publication Critical patent/JP4463453B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2001305904A 2000-10-12 2001-10-02 エポキシ樹脂組成物及びその硬化物 Expired - Fee Related JP4463453B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001305904A JP4463453B2 (ja) 2000-10-12 2001-10-02 エポキシ樹脂組成物及びその硬化物

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000311558 2000-10-12
JP2000-311558 2000-10-12
JP2001-13164 2001-01-22
JP2001013164 2001-01-22
JP2001305904A JP4463453B2 (ja) 2000-10-12 2001-10-02 エポキシ樹脂組成物及びその硬化物

Publications (3)

Publication Number Publication Date
JP2002284841A JP2002284841A (ja) 2002-10-03
JP2002284841A5 JP2002284841A5 (https=) 2005-06-16
JP4463453B2 true JP4463453B2 (ja) 2010-05-19

Family

ID=27344913

Family Applications (1)

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JP2001305904A Expired - Fee Related JP4463453B2 (ja) 2000-10-12 2001-10-02 エポキシ樹脂組成物及びその硬化物

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JP (1) JP4463453B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4530125B2 (ja) * 2003-10-17 2010-08-25 信越化学工業株式会社 接着剤組成物及び接着フイルム並びにダイシング・ダイボンド用接着テープ
KR100833568B1 (ko) 2006-12-28 2008-05-30 제일모직주식회사 플립칩 패키지용 비도전성 페이스트 조성물

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JP2002284841A (ja) 2002-10-03

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