JP4463453B2 - エポキシ樹脂組成物及びその硬化物 - Google Patents
エポキシ樹脂組成物及びその硬化物 Download PDFInfo
- Publication number
- JP4463453B2 JP4463453B2 JP2001305904A JP2001305904A JP4463453B2 JP 4463453 B2 JP4463453 B2 JP 4463453B2 JP 2001305904 A JP2001305904 A JP 2001305904A JP 2001305904 A JP2001305904 A JP 2001305904A JP 4463453 B2 JP4463453 B2 JP 4463453B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- formula
- present
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 0 *c1ccccc1 Chemical compound *c1ccccc1 0.000 description 2
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001305904A JP4463453B2 (ja) | 2000-10-12 | 2001-10-02 | エポキシ樹脂組成物及びその硬化物 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000311558 | 2000-10-12 | ||
| JP2000-311558 | 2000-10-12 | ||
| JP2001-13164 | 2001-01-22 | ||
| JP2001013164 | 2001-01-22 | ||
| JP2001305904A JP4463453B2 (ja) | 2000-10-12 | 2001-10-02 | エポキシ樹脂組成物及びその硬化物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002284841A JP2002284841A (ja) | 2002-10-03 |
| JP2002284841A5 JP2002284841A5 (https=) | 2005-06-16 |
| JP4463453B2 true JP4463453B2 (ja) | 2010-05-19 |
Family
ID=27344913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001305904A Expired - Fee Related JP4463453B2 (ja) | 2000-10-12 | 2001-10-02 | エポキシ樹脂組成物及びその硬化物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4463453B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4530125B2 (ja) * | 2003-10-17 | 2010-08-25 | 信越化学工業株式会社 | 接着剤組成物及び接着フイルム並びにダイシング・ダイボンド用接着テープ |
| KR100833568B1 (ko) | 2006-12-28 | 2008-05-30 | 제일모직주식회사 | 플립칩 패키지용 비도전성 페이스트 조성물 |
-
2001
- 2001-10-02 JP JP2001305904A patent/JP4463453B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002284841A (ja) | 2002-10-03 |
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