JP2002284841A5 - - Google Patents
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- Publication number
- JP2002284841A5 JP2002284841A5 JP2001305904A JP2001305904A JP2002284841A5 JP 2002284841 A5 JP2002284841 A5 JP 2002284841A5 JP 2001305904 A JP2001305904 A JP 2001305904A JP 2001305904 A JP2001305904 A JP 2001305904A JP 2002284841 A5 JP2002284841 A5 JP 2002284841A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- formula
- resin composition
- curing
- weight part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims 11
- 229920000647 polyepoxide Polymers 0.000 claims 11
- 239000000203 mixture Substances 0.000 claims 7
- 239000003795 chemical substances by application Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001305904A JP4463453B2 (ja) | 2000-10-12 | 2001-10-02 | エポキシ樹脂組成物及びその硬化物 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000311558 | 2000-10-12 | ||
| JP2000-311558 | 2000-10-12 | ||
| JP2001-13164 | 2001-01-22 | ||
| JP2001013164 | 2001-01-22 | ||
| JP2001305904A JP4463453B2 (ja) | 2000-10-12 | 2001-10-02 | エポキシ樹脂組成物及びその硬化物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002284841A JP2002284841A (ja) | 2002-10-03 |
| JP2002284841A5 true JP2002284841A5 (https=) | 2005-06-16 |
| JP4463453B2 JP4463453B2 (ja) | 2010-05-19 |
Family
ID=27344913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001305904A Expired - Fee Related JP4463453B2 (ja) | 2000-10-12 | 2001-10-02 | エポキシ樹脂組成物及びその硬化物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4463453B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4530125B2 (ja) * | 2003-10-17 | 2010-08-25 | 信越化学工業株式会社 | 接着剤組成物及び接着フイルム並びにダイシング・ダイボンド用接着テープ |
| KR100833568B1 (ko) | 2006-12-28 | 2008-05-30 | 제일모직주식회사 | 플립칩 패키지용 비도전성 페이스트 조성물 |
-
2001
- 2001-10-02 JP JP2001305904A patent/JP4463453B2/ja not_active Expired - Fee Related
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