JP2008231238A5 - - Google Patents
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- Publication number
- JP2008231238A5 JP2008231238A5 JP2007072436A JP2007072436A JP2008231238A5 JP 2008231238 A5 JP2008231238 A5 JP 2008231238A5 JP 2007072436 A JP2007072436 A JP 2007072436A JP 2007072436 A JP2007072436 A JP 2007072436A JP 2008231238 A5 JP2008231238 A5 JP 2008231238A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- group
- aromatic hydrocarbon
- hydrocarbon group
- glycidyloxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims 3
- -1 glycidyloxy group Chemical group 0.000 claims 3
- 125000003545 alkoxy group Chemical group 0.000 claims 2
- 125000005575 polycyclic aromatic hydrocarbon group Chemical group 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007072436A JP5024604B2 (ja) | 2007-03-20 | 2007-03-20 | エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007072436A JP5024604B2 (ja) | 2007-03-20 | 2007-03-20 | エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008231238A JP2008231238A (ja) | 2008-10-02 |
| JP2008231238A5 true JP2008231238A5 (https=) | 2010-04-22 |
| JP5024604B2 JP5024604B2 (ja) | 2012-09-12 |
Family
ID=39904438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007072436A Active JP5024604B2 (ja) | 2007-03-20 | 2007-03-20 | エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5024604B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5339146B2 (ja) * | 2009-07-13 | 2013-11-13 | Ｄｉｃ株式会社 | エポキシ樹脂組成物、その硬化物、回路基板、ビルドアップ材料、及び半導体封止材料 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4941804B2 (ja) * | 2005-03-02 | 2012-05-30 | Ｄｉｃ株式会社 | エポキシ樹脂組成物、その硬化物、半導体封止材料、新規フェノール樹脂、および新規エポキシ樹脂 |
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2007
- 2007-03-20 JP JP2007072436A patent/JP5024604B2/ja active Active