JP2008231238A5 - - Google Patents

Download PDF

Info

Publication number
JP2008231238A5
JP2008231238A5 JP2007072436A JP2007072436A JP2008231238A5 JP 2008231238 A5 JP2008231238 A5 JP 2008231238A5 JP 2007072436 A JP2007072436 A JP 2007072436A JP 2007072436 A JP2007072436 A JP 2007072436A JP 2008231238 A5 JP2008231238 A5 JP 2008231238A5
Authority
JP
Japan
Prior art keywords
epoxy resin
group
aromatic hydrocarbon
hydrocarbon group
glycidyloxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007072436A
Other languages
English (en)
Japanese (ja)
Other versions
JP5024604B2 (ja
JP2008231238A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007072436A priority Critical patent/JP5024604B2/ja
Priority claimed from JP2007072436A external-priority patent/JP5024604B2/ja
Publication of JP2008231238A publication Critical patent/JP2008231238A/ja
Publication of JP2008231238A5 publication Critical patent/JP2008231238A5/ja
Application granted granted Critical
Publication of JP5024604B2 publication Critical patent/JP5024604B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007072436A 2007-03-20 2007-03-20 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂及びその製造方法 Active JP5024604B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007072436A JP5024604B2 (ja) 2007-03-20 2007-03-20 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007072436A JP5024604B2 (ja) 2007-03-20 2007-03-20 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂及びその製造方法

Publications (3)

Publication Number Publication Date
JP2008231238A JP2008231238A (ja) 2008-10-02
JP2008231238A5 true JP2008231238A5 (https=) 2010-04-22
JP5024604B2 JP5024604B2 (ja) 2012-09-12

Family

ID=39904438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007072436A Active JP5024604B2 (ja) 2007-03-20 2007-03-20 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂及びその製造方法

Country Status (1)

Country Link
JP (1) JP5024604B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5339146B2 (ja) * 2009-07-13 2013-11-13 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、回路基板、ビルドアップ材料、及び半導体封止材料

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4941804B2 (ja) * 2005-03-02 2012-05-30 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、半導体封止材料、新規フェノール樹脂、および新規エポキシ樹脂

Similar Documents

Publication Publication Date Title
CN104789178B (zh) 一种完全水下环境下的改性双酚a环氧树脂植筋胶及制备方法
RU2009146439A (ru) Термоотверждающаяся композиция эпоксидной смолы и полупроводниковое устройство
JP2009280823A5 (https=)
JP2008527077A5 (https=)
CN102898075B (zh) 一种高强快固环氧树脂灌浆料及其制备方法
JP2017222881A5 (https=)
JP2005536590A5 (https=)
ATE404636T1 (de) Wärmeleitfähige silikonkautschukzusammensetzung
JP2013504652A5 (https=)
JP2016507613A5 (https=)
WO2009057530A1 (ja) 半導体用接着剤組成物およびそれを用いて製造した半導体装置
MY148272A (en) Curable silicone composition
TW200801110A (en) Resin composition for semiconductor encapsulation and semiconductor device
TWI320421B (en) Epoxy resin composition and semiconductor device
JP2009138166A5 (https=)
JP2012531508A5 (https=)
JP2010285602A5 (https=)
JP2006306954A5 (https=)
JP2009040989A5 (https=)
JP2014509668A5 (https=)
DE602006003085D1 (de) Härtbare silikonzusammensetzung und elektronische komponenten
TW200500412A (en) Resin composition for encapsulating semiconductor chip and semiconductor device therewith
EP2805977A3 (en) Thermosetting resin composition
JP2008231238A5 (https=)
JP2008056857A5 (https=)