JP5024604B2 - エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂及びその製造方法 - Google Patents

エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂及びその製造方法 Download PDF

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JP5024604B2
JP5024604B2 JP2007072436A JP2007072436A JP5024604B2 JP 5024604 B2 JP5024604 B2 JP 5024604B2 JP 2007072436 A JP2007072436 A JP 2007072436A JP 2007072436 A JP2007072436 A JP 2007072436A JP 5024604 B2 JP5024604 B2 JP 5024604B2
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epoxy resin
compound
group
aromatic hydrocarbon
hydrocarbon group
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JP2008231238A5 (https=
JP2008231238A (ja
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泰 佐藤
一郎 小椋
芳行 高橋
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DIC Corp
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JP2007072436A 2007-03-20 2007-03-20 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂及びその製造方法 Active JP5024604B2 (ja)

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JP2007072436A JP5024604B2 (ja) 2007-03-20 2007-03-20 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂及びその製造方法

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JP2007072436A JP5024604B2 (ja) 2007-03-20 2007-03-20 エポキシ樹脂組成物、その硬化物、新規エポキシ樹脂及びその製造方法

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JP2008231238A JP2008231238A (ja) 2008-10-02
JP2008231238A5 JP2008231238A5 (https=) 2010-04-22
JP5024604B2 true JP5024604B2 (ja) 2012-09-12

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JP5339146B2 (ja) * 2009-07-13 2013-11-13 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、回路基板、ビルドアップ材料、及び半導体封止材料

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JP4941804B2 (ja) * 2005-03-02 2012-05-30 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、半導体封止材料、新規フェノール樹脂、および新規エポキシ樹脂

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