JP4458379B2 - 有機el表示装置 - Google Patents

有機el表示装置 Download PDF

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Publication number
JP4458379B2
JP4458379B2 JP2008266528A JP2008266528A JP4458379B2 JP 4458379 B2 JP4458379 B2 JP 4458379B2 JP 2008266528 A JP2008266528 A JP 2008266528A JP 2008266528 A JP2008266528 A JP 2008266528A JP 4458379 B2 JP4458379 B2 JP 4458379B2
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JP
Japan
Prior art keywords
film
organic
protective film
region
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008266528A
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English (en)
Japanese (ja)
Other versions
JP2009164107A (ja
JP2009164107A5 (zh
Inventor
望 和泉
大介 由徳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2008266528A priority Critical patent/JP4458379B2/ja
Priority to US12/326,695 priority patent/US7936122B2/en
Priority to CN2008101855285A priority patent/CN101459193B/zh
Priority to KR1020080126203A priority patent/KR101014674B1/ko
Publication of JP2009164107A publication Critical patent/JP2009164107A/ja
Publication of JP2009164107A5 publication Critical patent/JP2009164107A5/ja
Application granted granted Critical
Publication of JP4458379B2 publication Critical patent/JP4458379B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321After treatment
    • H01L21/32115Planarisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2008266528A 2007-12-14 2008-10-15 有機el表示装置 Expired - Fee Related JP4458379B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008266528A JP4458379B2 (ja) 2007-12-14 2008-10-15 有機el表示装置
US12/326,695 US7936122B2 (en) 2007-12-14 2008-12-02 Organic EL display apparatus
CN2008101855285A CN101459193B (zh) 2007-12-14 2008-12-12 有机el显示装置
KR1020080126203A KR101014674B1 (ko) 2007-12-14 2008-12-12 유기el표시장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007323676 2007-12-14
JP2008266528A JP4458379B2 (ja) 2007-12-14 2008-10-15 有機el表示装置

Publications (3)

Publication Number Publication Date
JP2009164107A JP2009164107A (ja) 2009-07-23
JP2009164107A5 JP2009164107A5 (zh) 2009-10-15
JP4458379B2 true JP4458379B2 (ja) 2010-04-28

Family

ID=40769923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008266528A Expired - Fee Related JP4458379B2 (ja) 2007-12-14 2008-10-15 有機el表示装置

Country Status (3)

Country Link
JP (1) JP4458379B2 (zh)
KR (1) KR101014674B1 (zh)
CN (1) CN101459193B (zh)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5424738B2 (ja) * 2009-06-23 2014-02-26 キヤノン株式会社 表示装置
JP5409315B2 (ja) * 2009-12-11 2014-02-05 キヤノン株式会社 表示装置
KR101155904B1 (ko) 2010-01-04 2012-06-20 삼성모바일디스플레이주식회사 유기 발광 표시 장치
FR2958795B1 (fr) * 2010-04-12 2012-06-15 Commissariat Energie Atomique Dispositif optoelectronique organique et son procede d'encapsulation.
JP2012059692A (ja) * 2010-08-09 2012-03-22 Canon Inc 有機エレクトロルミネッセンス表示装置
KR101255537B1 (ko) 2010-11-26 2013-04-16 삼성디스플레이 주식회사 평판 표시 장치 및 그 제조방법
US20150034929A1 (en) * 2012-03-12 2015-02-05 Panasonic Corporation Organic electroluminescence element
JP6142151B2 (ja) * 2012-07-31 2017-06-07 株式会社Joled 表示装置および電子機器
KR101473310B1 (ko) 2012-12-06 2014-12-16 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조방법
JP6231281B2 (ja) 2013-01-23 2017-11-15 株式会社ジャパンディスプレイ 表示装置
JP6054763B2 (ja) 2013-02-12 2016-12-27 株式会社ジャパンディスプレイ 有機el表示装置
KR102034253B1 (ko) 2013-04-12 2019-10-21 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
JP6201411B2 (ja) * 2013-05-14 2017-09-27 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、及び電子機器
JP2015046539A (ja) * 2013-08-29 2015-03-12 ソニー株式会社 撮像素子、撮像装置、並びに、製造装置および方法
JP6220208B2 (ja) * 2013-09-30 2017-10-25 株式会社ジャパンディスプレイ 有機エレクトロルミネッセンス表示装置及びその製造方法
KR102109661B1 (ko) * 2013-12-02 2020-05-12 엘지디스플레이 주식회사 유기발광다이오드 표시장치의 제조방법
KR102317393B1 (ko) * 2014-10-17 2021-10-25 엘지디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
KR102225848B1 (ko) * 2014-11-07 2021-03-09 엘지디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
US9991326B2 (en) 2015-01-14 2018-06-05 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device comprising flexible substrate and light-emitting element
KR102396296B1 (ko) * 2015-03-06 2022-05-11 삼성디스플레이 주식회사 유기발광 디스플레이 장치 및 그 제조방법
KR102314470B1 (ko) 2015-03-09 2021-10-20 삼성디스플레이 주식회사 유기 발광 표시 장치
KR102477299B1 (ko) 2015-06-12 2022-12-14 삼성디스플레이 주식회사 디스플레이 장치
KR101818423B1 (ko) * 2015-09-23 2018-01-16 엘지디스플레이 주식회사 유기발광 표시장치
KR102450961B1 (ko) * 2015-09-30 2022-10-04 엘지디스플레이 주식회사 유기 발광 디스플레이 장치
KR102509079B1 (ko) * 2015-11-30 2023-03-09 엘지디스플레이 주식회사 유기 발광 표시 장치
JP6636807B2 (ja) * 2016-01-15 2020-01-29 株式会社ジャパンディスプレイ 有機el表示装置
KR102541448B1 (ko) * 2016-03-08 2023-06-09 삼성디스플레이 주식회사 디스플레이 장치
KR102524535B1 (ko) * 2016-03-29 2023-04-24 삼성디스플레이 주식회사 디스플레이 장치
KR102571085B1 (ko) 2016-04-04 2023-08-28 삼성디스플레이 주식회사 디스플레이 장치
KR102632616B1 (ko) * 2016-06-27 2024-02-02 삼성디스플레이 주식회사 디스플레이 장치
KR102328679B1 (ko) 2016-11-23 2021-11-19 삼성디스플레이 주식회사 표시 장치
JP6343649B2 (ja) * 2016-12-01 2018-06-13 株式会社ジャパンディスプレイ 有機el表示装置
CN206179906U (zh) * 2016-12-01 2017-05-17 京东方科技集团股份有限公司 一种显示装置
JP6874775B2 (ja) * 2016-12-28 2021-05-19 コニカミノルタ株式会社 電子デバイス
JP6947536B2 (ja) * 2017-05-26 2021-10-13 株式会社ジャパンディスプレイ 表示装置
JP2019003819A (ja) * 2017-06-14 2019-01-10 株式会社Joled 有機el表示パネル
WO2019054387A1 (ja) * 2017-09-12 2019-03-21 パイオニア株式会社 発光装置
CN207705199U (zh) * 2017-11-24 2018-08-07 昆山国显光电有限公司 显示器件
CN108448010B (zh) * 2018-05-11 2021-04-23 云谷(固安)科技有限公司 显示面板及显示终端
JP2019200849A (ja) 2018-05-14 2019-11-21 株式会社ジャパンディスプレイ 表示装置
WO2020053923A1 (ja) * 2018-09-10 2020-03-19 シャープ株式会社 表示装置
CN109727920B (zh) * 2018-12-18 2020-10-30 武汉华星光电半导体显示技术有限公司 Tft基板的制作方法及tft基板
JP2020184426A (ja) * 2019-04-26 2020-11-12 株式会社Joled 有機el表示パネルおよびその製造方法
TW202224224A (zh) * 2020-11-17 2022-06-16 日商半導體能源研究所股份有限公司 顯示面板、資訊處理裝置、顯示面板的製造方法
CN113394152B (zh) * 2021-06-15 2022-09-20 深圳市创一智能装备有限公司 一种载板的定位装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003271075A (ja) 2002-03-13 2003-09-25 Toshiba Corp 表示装置
JP4518747B2 (ja) * 2003-05-08 2010-08-04 三洋電機株式会社 有機el表示装置
JP4479381B2 (ja) * 2003-09-24 2010-06-09 セイコーエプソン株式会社 電気光学装置、電気光学装置の製造方法、及び電子機器

Also Published As

Publication number Publication date
KR20090064320A (ko) 2009-06-18
CN101459193A (zh) 2009-06-17
JP2009164107A (ja) 2009-07-23
KR101014674B1 (ko) 2011-02-16
CN101459193B (zh) 2011-10-05

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