JP4458379B2 - 有機el表示装置 - Google Patents
有機el表示装置 Download PDFInfo
- Publication number
- JP4458379B2 JP4458379B2 JP2008266528A JP2008266528A JP4458379B2 JP 4458379 B2 JP4458379 B2 JP 4458379B2 JP 2008266528 A JP2008266528 A JP 2008266528A JP 2008266528 A JP2008266528 A JP 2008266528A JP 4458379 B2 JP4458379 B2 JP 4458379B2
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- Japan
- Prior art keywords
- film
- organic
- protective film
- region
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 239000011347 resin Substances 0.000 claims description 82
- 229920005989 resin Polymers 0.000 claims description 82
- 239000000463 material Substances 0.000 claims description 42
- 230000002093 peripheral effect Effects 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 30
- 238000002955 isolation Methods 0.000 claims description 18
- 150000007529 inorganic bases Chemical class 0.000 claims description 15
- 238000005192 partition Methods 0.000 claims description 5
- 229910010272 inorganic material Inorganic materials 0.000 claims description 4
- 239000011147 inorganic material Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 description 207
- 238000000034 method Methods 0.000 description 15
- 150000002894 organic compounds Chemical class 0.000 description 15
- 238000003860 storage Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000005401 electroluminescence Methods 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000004925 Acrylic resin Substances 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008266528A JP4458379B2 (ja) | 2007-12-14 | 2008-10-15 | 有機el表示装置 |
US12/326,695 US7936122B2 (en) | 2007-12-14 | 2008-12-02 | Organic EL display apparatus |
CN2008101855285A CN101459193B (zh) | 2007-12-14 | 2008-12-12 | 有机el显示装置 |
KR1020080126203A KR101014674B1 (ko) | 2007-12-14 | 2008-12-12 | 유기el표시장치 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007323676 | 2007-12-14 | ||
JP2008266528A JP4458379B2 (ja) | 2007-12-14 | 2008-10-15 | 有機el表示装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009164107A JP2009164107A (ja) | 2009-07-23 |
JP2009164107A5 JP2009164107A5 (zh) | 2009-10-15 |
JP4458379B2 true JP4458379B2 (ja) | 2010-04-28 |
Family
ID=40769923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008266528A Expired - Fee Related JP4458379B2 (ja) | 2007-12-14 | 2008-10-15 | 有機el表示装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4458379B2 (zh) |
KR (1) | KR101014674B1 (zh) |
CN (1) | CN101459193B (zh) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5424738B2 (ja) * | 2009-06-23 | 2014-02-26 | キヤノン株式会社 | 表示装置 |
JP5409315B2 (ja) * | 2009-12-11 | 2014-02-05 | キヤノン株式会社 | 表示装置 |
KR101155904B1 (ko) | 2010-01-04 | 2012-06-20 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 |
FR2958795B1 (fr) * | 2010-04-12 | 2012-06-15 | Commissariat Energie Atomique | Dispositif optoelectronique organique et son procede d'encapsulation. |
JP2012059692A (ja) * | 2010-08-09 | 2012-03-22 | Canon Inc | 有機エレクトロルミネッセンス表示装置 |
KR101255537B1 (ko) | 2010-11-26 | 2013-04-16 | 삼성디스플레이 주식회사 | 평판 표시 장치 및 그 제조방법 |
US20150034929A1 (en) * | 2012-03-12 | 2015-02-05 | Panasonic Corporation | Organic electroluminescence element |
JP6142151B2 (ja) * | 2012-07-31 | 2017-06-07 | 株式会社Joled | 表示装置および電子機器 |
KR101473310B1 (ko) | 2012-12-06 | 2014-12-16 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조방법 |
JP6231281B2 (ja) | 2013-01-23 | 2017-11-15 | 株式会社ジャパンディスプレイ | 表示装置 |
JP6054763B2 (ja) | 2013-02-12 | 2016-12-27 | 株式会社ジャパンディスプレイ | 有機el表示装置 |
KR102034253B1 (ko) | 2013-04-12 | 2019-10-21 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
JP6201411B2 (ja) * | 2013-05-14 | 2017-09-27 | セイコーエプソン株式会社 | 電気光学装置、電気光学装置の製造方法、及び電子機器 |
JP2015046539A (ja) * | 2013-08-29 | 2015-03-12 | ソニー株式会社 | 撮像素子、撮像装置、並びに、製造装置および方法 |
JP6220208B2 (ja) * | 2013-09-30 | 2017-10-25 | 株式会社ジャパンディスプレイ | 有機エレクトロルミネッセンス表示装置及びその製造方法 |
KR102109661B1 (ko) * | 2013-12-02 | 2020-05-12 | 엘지디스플레이 주식회사 | 유기발광다이오드 표시장치의 제조방법 |
KR102317393B1 (ko) * | 2014-10-17 | 2021-10-25 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
KR102225848B1 (ko) * | 2014-11-07 | 2021-03-09 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
US9991326B2 (en) | 2015-01-14 | 2018-06-05 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting device comprising flexible substrate and light-emitting element |
KR102396296B1 (ko) * | 2015-03-06 | 2022-05-11 | 삼성디스플레이 주식회사 | 유기발광 디스플레이 장치 및 그 제조방법 |
KR102314470B1 (ko) | 2015-03-09 | 2021-10-20 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR102477299B1 (ko) | 2015-06-12 | 2022-12-14 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR101818423B1 (ko) * | 2015-09-23 | 2018-01-16 | 엘지디스플레이 주식회사 | 유기발광 표시장치 |
KR102450961B1 (ko) * | 2015-09-30 | 2022-10-04 | 엘지디스플레이 주식회사 | 유기 발광 디스플레이 장치 |
KR102509079B1 (ko) * | 2015-11-30 | 2023-03-09 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 |
JP6636807B2 (ja) * | 2016-01-15 | 2020-01-29 | 株式会社ジャパンディスプレイ | 有機el表示装置 |
KR102541448B1 (ko) * | 2016-03-08 | 2023-06-09 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR102524535B1 (ko) * | 2016-03-29 | 2023-04-24 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR102571085B1 (ko) | 2016-04-04 | 2023-08-28 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR102632616B1 (ko) * | 2016-06-27 | 2024-02-02 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR102328679B1 (ko) | 2016-11-23 | 2021-11-19 | 삼성디스플레이 주식회사 | 표시 장치 |
JP6343649B2 (ja) * | 2016-12-01 | 2018-06-13 | 株式会社ジャパンディスプレイ | 有機el表示装置 |
CN206179906U (zh) * | 2016-12-01 | 2017-05-17 | 京东方科技集团股份有限公司 | 一种显示装置 |
JP6874775B2 (ja) * | 2016-12-28 | 2021-05-19 | コニカミノルタ株式会社 | 電子デバイス |
JP6947536B2 (ja) * | 2017-05-26 | 2021-10-13 | 株式会社ジャパンディスプレイ | 表示装置 |
JP2019003819A (ja) * | 2017-06-14 | 2019-01-10 | 株式会社Joled | 有機el表示パネル |
WO2019054387A1 (ja) * | 2017-09-12 | 2019-03-21 | パイオニア株式会社 | 発光装置 |
CN207705199U (zh) * | 2017-11-24 | 2018-08-07 | 昆山国显光电有限公司 | 显示器件 |
CN108448010B (zh) * | 2018-05-11 | 2021-04-23 | 云谷(固安)科技有限公司 | 显示面板及显示终端 |
JP2019200849A (ja) | 2018-05-14 | 2019-11-21 | 株式会社ジャパンディスプレイ | 表示装置 |
WO2020053923A1 (ja) * | 2018-09-10 | 2020-03-19 | シャープ株式会社 | 表示装置 |
CN109727920B (zh) * | 2018-12-18 | 2020-10-30 | 武汉华星光电半导体显示技术有限公司 | Tft基板的制作方法及tft基板 |
JP2020184426A (ja) * | 2019-04-26 | 2020-11-12 | 株式会社Joled | 有機el表示パネルおよびその製造方法 |
TW202224224A (zh) * | 2020-11-17 | 2022-06-16 | 日商半導體能源研究所股份有限公司 | 顯示面板、資訊處理裝置、顯示面板的製造方法 |
CN113394152B (zh) * | 2021-06-15 | 2022-09-20 | 深圳市创一智能装备有限公司 | 一种载板的定位装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003271075A (ja) | 2002-03-13 | 2003-09-25 | Toshiba Corp | 表示装置 |
JP4518747B2 (ja) * | 2003-05-08 | 2010-08-04 | 三洋電機株式会社 | 有機el表示装置 |
JP4479381B2 (ja) * | 2003-09-24 | 2010-06-09 | セイコーエプソン株式会社 | 電気光学装置、電気光学装置の製造方法、及び電子機器 |
-
2008
- 2008-10-15 JP JP2008266528A patent/JP4458379B2/ja not_active Expired - Fee Related
- 2008-12-12 KR KR1020080126203A patent/KR101014674B1/ko not_active IP Right Cessation
- 2008-12-12 CN CN2008101855285A patent/CN101459193B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20090064320A (ko) | 2009-06-18 |
CN101459193A (zh) | 2009-06-17 |
JP2009164107A (ja) | 2009-07-23 |
KR101014674B1 (ko) | 2011-02-16 |
CN101459193B (zh) | 2011-10-05 |
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