JP4429823B2 - 半導体装置用トレイ - Google Patents
半導体装置用トレイ Download PDFInfo
- Publication number
- JP4429823B2 JP4429823B2 JP2004189877A JP2004189877A JP4429823B2 JP 4429823 B2 JP4429823 B2 JP 4429823B2 JP 2004189877 A JP2004189877 A JP 2004189877A JP 2004189877 A JP2004189877 A JP 2004189877A JP 4429823 B2 JP4429823 B2 JP 4429823B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- tray
- protrusions
- protrusion
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S206/00—Special receptacle or package
- Y10S206/821—Stacking member
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Stackable Containers (AREA)
Description
12 本体
14 外枠
16 ポケット
18 支持部
20 第1の突起部
22 第2の突起部
24 載置面
26 凹部
28 開口部
30 ポスト
50 半導体装置
52 基板
54 半導体素子
56 封止樹脂
58 レジスト
60 外部端子
Claims (4)
- 半導体装置を載せるための支持部と、該支持部の両側に設けられた一対の第1の突起部と、該支持部が設けられた側とは反対側に該支持部の両側に設けられた一対の第2の突起部とを有し、該一対の第1の突起部の間の間隔は、該一対の第2の突起部の間の間隔よりも大きいことを特徴とする半導体装置用トレイ。
- 該支持部は平坦な表面をもつ環状の壁からなり、該支持部の内側には半導体装置の外部端子が収容される凹部が設けられていることを特徴とする請求項1に記載の半導体装置用トレイ。
- 該第1及び第2の突起部は傾斜面を有していることを特徴とする請求項1に記載の半導体装置用トレイ。
- 該本体はさらに外枠を備えることを特徴とする請求項1に記載の半導体装置用トレイ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004189877A JP4429823B2 (ja) | 2004-06-28 | 2004-06-28 | 半導体装置用トレイ |
US10/958,393 US7163104B2 (en) | 2004-06-28 | 2004-10-06 | Tray for semiconductor device and semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004189877A JP4429823B2 (ja) | 2004-06-28 | 2004-06-28 | 半導体装置用トレイ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006008209A JP2006008209A (ja) | 2006-01-12 |
JP4429823B2 true JP4429823B2 (ja) | 2010-03-10 |
Family
ID=35504788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004189877A Expired - Fee Related JP4429823B2 (ja) | 2004-06-28 | 2004-06-28 | 半導体装置用トレイ |
Country Status (2)
Country | Link |
---|---|
US (1) | US7163104B2 (ja) |
JP (1) | JP4429823B2 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4063805B2 (ja) * | 2004-09-10 | 2008-03-19 | 松下電器産業株式会社 | 収納トレイおよび収納装置 |
BE1017396A3 (nl) * | 2006-12-13 | 2008-08-05 | Vitalo Plastics Nv | Stapelbare houder voor transport van componenten en werkwijze voor de vervaardiging ervan. |
WO2008114366A1 (ja) * | 2007-03-16 | 2008-09-25 | Fujitsu Microelectronics Limited | 電子部品収納容器 |
US20080295121A1 (en) * | 2007-05-25 | 2008-11-27 | David Walter Muhonen | Compressible media disk storage trays |
JP4360431B2 (ja) * | 2007-08-20 | 2009-11-11 | セイコーエプソン株式会社 | 半導体チップ収容トレイ |
JP5113507B2 (ja) * | 2007-12-25 | 2013-01-09 | 新光電気工業株式会社 | 放熱板収納トレー |
JP5210142B2 (ja) * | 2008-12-17 | 2013-06-12 | 盛岡セイコー工業株式会社 | 歯車用収納トレー及び収納体 |
JP5051797B2 (ja) * | 2010-05-06 | 2012-10-17 | シノン電気産業株式会社 | 半導体集積回路用トレー |
US20120032054A1 (en) * | 2010-08-09 | 2012-02-09 | Tzung-Lin Huang | Stackable holder for an integrated circuit package |
KR20120018644A (ko) * | 2010-08-23 | 2012-03-05 | 삼성전자주식회사 | 반도체 패키지 이송 장치 |
JP2012153378A (ja) * | 2011-01-24 | 2012-08-16 | Sekisui Plastics Co Ltd | 梱包用トレイ、梱包材、およびこれらを用いた梱包体 |
JP5983988B2 (ja) * | 2012-02-15 | 2016-09-06 | Nltテクノロジー株式会社 | 輸送用トレイ、それを用いた輸送資材及び輸送方法 |
JP6123329B2 (ja) * | 2013-02-12 | 2017-05-10 | 大日本印刷株式会社 | 基板保持部材 |
CN104576465A (zh) * | 2013-10-17 | 2015-04-29 | 中国科学院苏州纳米技术与纳米仿生研究所 | 芯片盛放装置 |
KR102195724B1 (ko) * | 2013-11-07 | 2020-12-28 | 삼성에스디아이 주식회사 | 포장 트레이 |
KR101442084B1 (ko) | 2014-02-26 | 2014-09-23 | 주식회사 성곡 | 보강트레이 |
JP2016058525A (ja) * | 2014-09-09 | 2016-04-21 | シナプティクス・ディスプレイ・デバイス合同会社 | 半導体チップトレイ |
JP2018202271A (ja) * | 2017-05-30 | 2018-12-27 | 日本電産株式会社 | 洗浄用保持具 |
EP4092721A1 (en) * | 2021-05-21 | 2022-11-23 | STMicroelectronics S.r.l. | Containment and transportation tray for electronic components having small dimensions and low weight |
FR3124889A1 (fr) * | 2021-06-30 | 2023-01-06 | Aledia | Dispositif optoélectronique et procédé de fabrication |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6327589A (ja) | 1986-07-18 | 1988-02-05 | Chisato Kajiyama | 強誘電性液晶組成物 |
US5400904C1 (en) | 1993-10-15 | 2001-01-16 | Murphy R H Co Inc | Tray for ball terminal integrated circuits |
US5418692A (en) * | 1994-08-22 | 1995-05-23 | Shinon Denkisangyo Kabushiki-Kaisha | Tray for semiconductor devices |
US5481438A (en) * | 1994-09-06 | 1996-01-02 | Shinon Denkisangyo Kabushiki Kaisha | Tray for semiconductor devices |
US5957293A (en) * | 1998-05-04 | 1999-09-28 | Advanced Micro Devices, Inc. | Tray to ship ceramic substrates and ceramic BGA packages |
JP3771084B2 (ja) * | 1999-04-30 | 2006-04-26 | Necエレクトロニクス株式会社 | 半導体集積回路装置用トレイ |
JP2000318789A (ja) | 1999-05-07 | 2000-11-21 | Sumitomo Chem Co Ltd | 半導体集積回路装置用トレイ |
JP2001028391A (ja) | 1999-07-14 | 2001-01-30 | Denki Kagaku Kogyo Kk | 半導体集積回路装置格納用トレー |
-
2004
- 2004-06-28 JP JP2004189877A patent/JP4429823B2/ja not_active Expired - Fee Related
- 2004-10-06 US US10/958,393 patent/US7163104B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20050285282A1 (en) | 2005-12-29 |
US7163104B2 (en) | 2007-01-16 |
JP2006008209A (ja) | 2006-01-12 |
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