WO2008114366A1 - 電子部品収納容器 - Google Patents

電子部品収納容器 Download PDF

Info

Publication number
WO2008114366A1
WO2008114366A1 PCT/JP2007/055435 JP2007055435W WO2008114366A1 WO 2008114366 A1 WO2008114366 A1 WO 2008114366A1 JP 2007055435 W JP2007055435 W JP 2007055435W WO 2008114366 A1 WO2008114366 A1 WO 2008114366A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
component container
stacked
container
wall portion
Prior art date
Application number
PCT/JP2007/055435
Other languages
English (en)
French (fr)
Inventor
Yuuji Hasegawa
Yukio Ando
Keiichi Sasamura
Hideyasu Hashiba
Original Assignee
Fujitsu Microelectronics Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Microelectronics Limited filed Critical Fujitsu Microelectronics Limited
Priority to KR1020097013287A priority Critical patent/KR20090092302A/ko
Priority to PCT/JP2007/055435 priority patent/WO2008114366A1/ja
Priority to JP2009504966A priority patent/JP4832568B2/ja
Priority to CNA2007800490723A priority patent/CN101573277A/zh
Publication of WO2008114366A1 publication Critical patent/WO2008114366A1/ja
Priority to US12/477,984 priority patent/US20090236261A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D1/00—Containers having bodies formed in one piece, e.g. by casting metallic material, by moulding plastics, by blowing vitreous material, by throwing ceramic material, by moulding pulped fibrous material, by deep-drawing operations performed on sheet material
    • B65D1/34—Trays or like shallow containers
    • B65D1/36—Trays or like shallow containers with moulded compartments or partitions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D21/00—Nestable, stackable or joinable containers; Containers of variable capacity
    • B65D21/02—Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Stackable Containers (AREA)
  • Containers Having Bodies Formed In One Piece (AREA)
  • Ceramic Capacitors (AREA)

Abstract

　複数積み重ねることができる電子部品収納容器５０－２であって、当該電子部品収納容器５０－２上に他の電子部品収納容器５０－１が積み重ねられたときに、前記他の電子部品収納容器５０－１の下面から延在形成されたフランジ４２－１に近接して位置する上面側壁部４３－２が、当該電子部品収納容器５０－２の上面に延在形成されており、前記上面側壁部４３－２の、当該電子部品収納容器５０－２の側端部側の側面はテーパ状に形成されており、水平面に対して６０度以下の傾斜角度を有する。
PCT/JP2007/055435 2007-03-16 2007-03-16 電子部品収納容器 WO2008114366A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020097013287A KR20090092302A (ko) 2007-03-16 2007-03-16 전자 부품 수납 용기
PCT/JP2007/055435 WO2008114366A1 (ja) 2007-03-16 2007-03-16 電子部品収納容器
JP2009504966A JP4832568B2 (ja) 2007-03-16 2007-03-16 電子部品収納容器
CNA2007800490723A CN101573277A (zh) 2007-03-16 2007-03-16 电子部件存放容器
US12/477,984 US20090236261A1 (en) 2007-03-16 2009-06-04 Electronic component accommodating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/055435 WO2008114366A1 (ja) 2007-03-16 2007-03-16 電子部品収納容器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/477,984 Continuation US20090236261A1 (en) 2007-03-16 2009-06-04 Electronic component accommodating device

Publications (1)

Publication Number Publication Date
WO2008114366A1 true WO2008114366A1 (ja) 2008-09-25

Family

ID=39765488

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/055435 WO2008114366A1 (ja) 2007-03-16 2007-03-16 電子部品収納容器

Country Status (5)

Country Link
US (1) US20090236261A1 (ja)
JP (1) JP4832568B2 (ja)
KR (1) KR20090092302A (ja)
CN (1) CN101573277A (ja)
WO (1) WO2008114366A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI681914B (zh) * 2019-03-28 2020-01-11 日商東京威爾斯股份有限公司 電子零件收納裝置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5051797B2 (ja) * 2010-05-06 2012-10-17 シノン電気産業株式会社 半導体集積回路用トレー
CN110239811B (zh) * 2018-03-07 2021-09-03 奥特斯科技(重庆)有限公司 用于处理载板件的托盘装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07242244A (ja) * 1994-03-07 1995-09-19 Sanko Co Ltd 運搬用容器
JP2004155443A (ja) * 2002-11-05 2004-06-03 Shinon Denki Sangyo Kk 半導体集積回路用トレー
JP2004315089A (ja) * 2003-04-16 2004-11-11 Illinois Tool Works Inc <Itw> 積重ね可能な集積回路用トレイ
JP2005001739A (ja) * 2003-06-13 2005-01-06 Renesas Technology Corp 半導体装置収納トレイ及びそれを用いた半導体装置の搬送方法
US20050269242A1 (en) * 2004-06-02 2005-12-08 Illinois Tool Works Inc. Stackable tray for integrated circuit chips
JP2006008209A (ja) * 2004-06-28 2006-01-12 Fujitsu Ltd 半導体装置用トレイ及び半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5492223A (en) * 1994-02-04 1996-02-20 Motorola, Inc. Interlocking and invertible semiconductor device tray and test contactor mating thereto
JPH07277388A (ja) * 1994-04-06 1995-10-24 Sony Corp 半導体装置用収納トレー
US5418692A (en) * 1994-08-22 1995-05-23 Shinon Denkisangyo Kabushiki-Kaisha Tray for semiconductor devices
US5481438A (en) * 1994-09-06 1996-01-02 Shinon Denkisangyo Kabushiki Kaisha Tray for semiconductor devices
JP3771084B2 (ja) * 1999-04-30 2006-04-26 Ｎｅｃエレクトロニクス株式会社 半導体集積回路装置用トレイ
JP2001028391A (ja) * 1999-07-14 2001-01-30 Denki Kagaku Kogyo Kk 半導体集積回路装置格納用トレー
JP2002002871A (ja) * 2000-04-20 2002-01-09 Hitachi Ltd 半導体装置の製造方法およびそれに用いられるトレイ
JP2002019832A (ja) * 2000-07-11 2002-01-23 Oki Electric Ind Co Ltd エンボスキャリアテープ
JP2003261193A (ja) * 2002-03-01 2003-09-16 Mitsubishi Electric Corp Ｉｃ包装材保護用専用フタおよびｉｃ包装材の梱包装置
US6914771B2 (en) * 2002-05-29 2005-07-05 Hirokazu Ono Tray for electronic components

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07242244A (ja) * 1994-03-07 1995-09-19 Sanko Co Ltd 運搬用容器
JP2004155443A (ja) * 2002-11-05 2004-06-03 Shinon Denki Sangyo Kk 半導体集積回路用トレー
JP2004315089A (ja) * 2003-04-16 2004-11-11 Illinois Tool Works Inc <Itw> 積重ね可能な集積回路用トレイ
JP2005001739A (ja) * 2003-06-13 2005-01-06 Renesas Technology Corp 半導体装置収納トレイ及びそれを用いた半導体装置の搬送方法
US20050269242A1 (en) * 2004-06-02 2005-12-08 Illinois Tool Works Inc. Stackable tray for integrated circuit chips
JP2006008209A (ja) * 2004-06-28 2006-01-12 Fujitsu Ltd 半導体装置用トレイ及び半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI681914B (zh) * 2019-03-28 2020-01-11 日商東京威爾斯股份有限公司 電子零件收納裝置

Also Published As

Publication number Publication date
JPWO2008114366A1 (ja) 2010-06-24
KR20090092302A (ko) 2009-08-31
JP4832568B2 (ja) 2011-12-07
US20090236261A1 (en) 2009-09-24
CN101573277A (zh) 2009-11-04

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