JP4421305B2 - プラズマ処理装置及びプラズマ処理方法 - Google Patents

プラズマ処理装置及びプラズマ処理方法 Download PDF

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Publication number
JP4421305B2
JP4421305B2 JP2004001536A JP2004001536A JP4421305B2 JP 4421305 B2 JP4421305 B2 JP 4421305B2 JP 2004001536 A JP2004001536 A JP 2004001536A JP 2004001536 A JP2004001536 A JP 2004001536A JP 4421305 B2 JP4421305 B2 JP 4421305B2
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Japan
Prior art keywords
substrate
processed
plasma processing
ring member
ring
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Expired - Fee Related
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JP2004001536A
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English (en)
Japanese (ja)
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JP2004235623A5 (https=
JP2004235623A (ja
Inventor
昇佐 遠藤
慎司 檜森
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of JP2004235623A5 publication Critical patent/JP2004235623A5/ja
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    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J37/00—Baking; Roasting; Grilling; Frying
    • A47J37/06—Roasters; Grills; Sandwich grills
    • A47J37/0623—Small-size cooking ovens, i.e. defining an at least partially closed cooking cavity
    • A47J37/0664—Accessories
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J36/00—Parts, details or accessories of cooking-vessels
    • A47J36/24—Warming devices
    • A47J36/2483—Warming devices with electrical heating means
    • A47J36/2488—Warming devices with electrical heating means having infrared radiating elements
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J37/00—Baking; Roasting; Grilling; Frying
    • A47J37/06—Roasters; Grills; Sandwich grills
    • A47J37/0694—Broiling racks
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J37/00—Baking; Roasting; Grilling; Frying
    • A47J37/06—Roasters; Grills; Sandwich grills
    • A47J37/07—Roasting devices for outdoor use; Barbecues
    • A47J37/0786—Accessories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Food Science & Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
JP2004001536A 2003-01-07 2004-01-07 プラズマ処理装置及びプラズマ処理方法 Expired - Fee Related JP4421305B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004001536A JP4421305B2 (ja) 2003-01-07 2004-01-07 プラズマ処理装置及びプラズマ処理方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003001547 2003-01-07
JP2004001536A JP4421305B2 (ja) 2003-01-07 2004-01-07 プラズマ処理装置及びプラズマ処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009083608A Division JP5079729B2 (ja) 2003-01-07 2009-03-30 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2004235623A JP2004235623A (ja) 2004-08-19
JP2004235623A5 JP2004235623A5 (https=) 2007-02-22
JP4421305B2 true JP4421305B2 (ja) 2010-02-24

Family

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Family Applications (2)

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JP2004001536A Expired - Fee Related JP4421305B2 (ja) 2003-01-07 2004-01-07 プラズマ処理装置及びプラズマ処理方法
JP2009083608A Expired - Fee Related JP5079729B2 (ja) 2003-01-07 2009-03-30 プラズマ処理装置

Family Applications After (1)

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JP2009083608A Expired - Fee Related JP5079729B2 (ja) 2003-01-07 2009-03-30 プラズマ処理装置

Country Status (5)

Country Link
US (2) US7850174B2 (https=)
JP (2) JP4421305B2 (https=)
KR (1) KR100657054B1 (https=)
CN (2) CN101996843B (https=)
TW (1) TW200416801A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
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WO2024173148A1 (en) * 2023-02-14 2024-08-22 Kla Corporation Substrate position monitoring devices

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WO2004095529A2 (en) * 2003-03-21 2004-11-04 Tokyo Electron Limited Method and apparatus for reducing substrate backside deposition during processing
JP5080810B2 (ja) * 2004-11-02 2012-11-21 パナソニック株式会社 プラズマ処理方法およびプラズマ処理装置
US7767055B2 (en) 2004-12-03 2010-08-03 Tokyo Electron Limited Capacitive coupling plasma processing apparatus
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JP5395633B2 (ja) * 2009-11-17 2014-01-22 東京エレクトロン株式会社 基板処理装置の基板載置台
JP5563347B2 (ja) * 2010-03-30 2014-07-30 東京エレクトロン株式会社 プラズマ処理装置及び半導体装置の製造方法
JP5503503B2 (ja) 2010-11-09 2014-05-28 東京エレクトロン株式会社 プラズマ処理装置
JP5741124B2 (ja) * 2011-03-29 2015-07-01 東京エレクトロン株式会社 プラズマ処理装置
CN103165494B (zh) * 2011-12-08 2015-12-09 中微半导体设备(上海)有限公司 一种清洁晶片背面聚合物的装置和方法
CN102522305B (zh) * 2011-12-27 2015-01-07 中微半导体设备(上海)有限公司 等离子体处理装置及聚焦环组件
CN103187232B (zh) * 2011-12-28 2015-09-16 中微半导体设备(上海)有限公司 一种减少晶片背面生成聚合物的聚焦环
KR20140101996A (ko) * 2013-02-13 2014-08-21 삼성전자주식회사 기판 지지유닛 및 이를 구비한 플라즈마 식각장치
CN103646841B (zh) * 2013-11-22 2016-01-27 上海华力微电子有限公司 一种等离子体刻蚀设备
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CN105575863B (zh) * 2014-11-10 2019-02-22 中微半导体设备(上海)有限公司 等离子体处理装置、基片卸载装置及方法
JP6383647B2 (ja) * 2014-11-19 2018-08-29 東京エレクトロン株式会社 測定システムおよび測定方法
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US11069553B2 (en) 2016-07-07 2021-07-20 Lam Research Corporation Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity
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KR102205922B1 (ko) * 2017-03-31 2021-01-22 베이징 이타운 세미컨덕터 테크놀로지 컴퍼니 리미티드 공정에서의 워크피스 상의 재료 증착 방지
CN110402481B (zh) * 2017-10-17 2023-07-21 株式会社爱发科 被处理体的处理装置
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Publication number Priority date Publication date Assignee Title
WO2024173148A1 (en) * 2023-02-14 2024-08-22 Kla Corporation Substrate position monitoring devices

Also Published As

Publication number Publication date
US8114247B2 (en) 2012-02-14
KR20040063825A (ko) 2004-07-14
US20110048643A1 (en) 2011-03-03
KR100657054B1 (ko) 2006-12-13
US7850174B2 (en) 2010-12-14
CN101996843A (zh) 2011-03-30
CN101996843B (zh) 2013-05-01
JP2004235623A (ja) 2004-08-19
TW200416801A (en) 2004-09-01
JP2009177199A (ja) 2009-08-06
US20040134618A1 (en) 2004-07-15
JP5079729B2 (ja) 2012-11-21
TWI357091B (https=) 2012-01-21
CN1518073A (zh) 2004-08-04

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