JP4393817B2 - 熱伝導性充填剤、熱伝導性シリコーンエラストマー組成物および半導体装置 - Google Patents

熱伝導性充填剤、熱伝導性シリコーンエラストマー組成物および半導体装置 Download PDF

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Publication number
JP4393817B2
JP4393817B2 JP2003288626A JP2003288626A JP4393817B2 JP 4393817 B2 JP4393817 B2 JP 4393817B2 JP 2003288626 A JP2003288626 A JP 2003288626A JP 2003288626 A JP2003288626 A JP 2003288626A JP 4393817 B2 JP4393817 B2 JP 4393817B2
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JP
Japan
Prior art keywords
thermally conductive
silicone elastomer
elastomer composition
group
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003288626A
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English (en)
Japanese (ja)
Other versions
JP2004083905A (ja
JP2004083905A5 (enExample
Inventor
君男 山川
和己 中吉
裕規 石川
勝利 峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to JP2003288626A priority Critical patent/JP4393817B2/ja
Publication of JP2004083905A publication Critical patent/JP2004083905A/ja
Publication of JP2004083905A5 publication Critical patent/JP2004083905A5/ja
Application granted granted Critical
Publication of JP4393817B2 publication Critical patent/JP4393817B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003288626A 2002-08-07 2003-08-07 熱伝導性充填剤、熱伝導性シリコーンエラストマー組成物および半導体装置 Expired - Fee Related JP4393817B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003288626A JP4393817B2 (ja) 2002-08-07 2003-08-07 熱伝導性充填剤、熱伝導性シリコーンエラストマー組成物および半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002229820 2002-08-07
JP2003288626A JP4393817B2 (ja) 2002-08-07 2003-08-07 熱伝導性充填剤、熱伝導性シリコーンエラストマー組成物および半導体装置

Publications (3)

Publication Number Publication Date
JP2004083905A JP2004083905A (ja) 2004-03-18
JP2004083905A5 JP2004083905A5 (enExample) 2006-08-03
JP4393817B2 true JP4393817B2 (ja) 2010-01-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003288626A Expired - Fee Related JP4393817B2 (ja) 2002-08-07 2003-08-07 熱伝導性充填剤、熱伝導性シリコーンエラストマー組成物および半導体装置

Country Status (1)

Country Link
JP (1) JP4393817B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5293477B2 (ja) * 2005-04-19 2013-09-18 ルネサスエレクトロニクス株式会社 半導体装置
JP4534062B2 (ja) 2005-04-19 2010-09-01 ルネサスエレクトロニクス株式会社 半導体装置
JP2007302983A (ja) * 2006-05-15 2007-11-22 Ihi Corp 材料圧縮加工装置
JP5285846B2 (ja) * 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP2008248048A (ja) * 2007-03-30 2008-10-16 Shin Kobe Electric Mach Co Ltd 高熱伝導熱可塑性樹脂成型材
US8633478B2 (en) * 2009-06-19 2014-01-21 Dow Corning Corporation Use of ionomeric silicone thermoplastic elastomers in electronic devices
JP6240593B2 (ja) * 2014-10-09 2017-11-29 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
KR101898556B1 (ko) * 2017-10-31 2018-09-13 주식회사 엠엠에스 내열특성이 강화된 전도성 분말 제조방법
JP6656509B1 (ja) * 2018-11-07 2020-03-04 ニホンハンダ株式会社 導電性充填剤の製造方法、導電性付加反応硬化型シリコーン組成物および半導体装置
JP7514804B2 (ja) * 2021-08-16 2024-07-11 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーン硬化物
JPWO2024004625A1 (enExample) * 2022-06-28 2024-01-04
JPWO2024033980A1 (enExample) * 2022-08-08 2024-02-15

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05311045A (ja) * 1992-05-06 1993-11-22 Matsushita Electric Works Ltd 封止用エポキシ樹脂成形材料
JP3451732B2 (ja) * 1994-06-24 2003-09-29 信越化学工業株式会社 樹脂組成物
JP3718350B2 (ja) * 1998-08-10 2005-11-24 富士高分子工業株式会社 熱伝導性・電気絶縁性シリコーンゴム組成物およびシリコーンゲル組成物

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Publication number Publication date
JP2004083905A (ja) 2004-03-18

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