JP2004083905A5 - - Google Patents
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- Publication number
- JP2004083905A5 JP2004083905A5 JP2003288626A JP2003288626A JP2004083905A5 JP 2004083905 A5 JP2004083905 A5 JP 2004083905A5 JP 2003288626 A JP2003288626 A JP 2003288626A JP 2003288626 A JP2003288626 A JP 2003288626A JP 2004083905 A5 JP2004083905 A5 JP 2004083905A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- silicone rubber
- semiconductor
- semiconductor device
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 description 9
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003288626A JP4393817B2 (ja) | 2002-08-07 | 2003-08-07 | 熱伝導性充填剤、熱伝導性シリコーンエラストマー組成物および半導体装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002229820 | 2002-08-07 | ||
| JP2003288626A JP4393817B2 (ja) | 2002-08-07 | 2003-08-07 | 熱伝導性充填剤、熱伝導性シリコーンエラストマー組成物および半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004083905A JP2004083905A (ja) | 2004-03-18 |
| JP2004083905A5 true JP2004083905A5 (enExample) | 2006-08-03 |
| JP4393817B2 JP4393817B2 (ja) | 2010-01-06 |
Family
ID=32072313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003288626A Expired - Fee Related JP4393817B2 (ja) | 2002-08-07 | 2003-08-07 | 熱伝導性充填剤、熱伝導性シリコーンエラストマー組成物および半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4393817B2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4534062B2 (ja) | 2005-04-19 | 2010-09-01 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP5293477B2 (ja) * | 2005-04-19 | 2013-09-18 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP2007302983A (ja) * | 2006-05-15 | 2007-11-22 | Ihi Corp | 材料圧縮加工装置 |
| JP5285846B2 (ja) * | 2006-09-11 | 2013-09-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| JP2008248048A (ja) * | 2007-03-30 | 2008-10-16 | Shin Kobe Electric Mach Co Ltd | 高熱伝導熱可塑性樹脂成型材 |
| US8633478B2 (en) * | 2009-06-19 | 2014-01-21 | Dow Corning Corporation | Use of ionomeric silicone thermoplastic elastomers in electronic devices |
| JP6240593B2 (ja) * | 2014-10-09 | 2017-11-29 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物 |
| KR101898556B1 (ko) * | 2017-10-31 | 2018-09-13 | 주식회사 엠엠에스 | 내열특성이 강화된 전도성 분말 제조방법 |
| JP6656509B1 (ja) * | 2018-11-07 | 2020-03-04 | ニホンハンダ株式会社 | 導電性充填剤の製造方法、導電性付加反応硬化型シリコーン組成物および半導体装置 |
| JP7514804B2 (ja) * | 2021-08-16 | 2024-07-11 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び熱伝導性シリコーン硬化物 |
| WO2024004625A1 (ja) * | 2022-06-28 | 2024-01-04 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、半導体装置及びその製造方法 |
| WO2024033980A1 (ja) * | 2022-08-08 | 2024-02-15 | 日本電信電話株式会社 | 光変調装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05311045A (ja) * | 1992-05-06 | 1993-11-22 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂成形材料 |
| JP3451732B2 (ja) * | 1994-06-24 | 2003-09-29 | 信越化学工業株式会社 | 樹脂組成物 |
| JP3718350B2 (ja) * | 1998-08-10 | 2005-11-24 | 富士高分子工業株式会社 | 熱伝導性・電気絶縁性シリコーンゴム組成物およびシリコーンゲル組成物 |
-
2003
- 2003-08-07 JP JP2003288626A patent/JP4393817B2/ja not_active Expired - Fee Related
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