JP4386863B2 - ヘッド・サスペンション - Google Patents

ヘッド・サスペンション Download PDF

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Publication number
JP4386863B2
JP4386863B2 JP2005189800A JP2005189800A JP4386863B2 JP 4386863 B2 JP4386863 B2 JP 4386863B2 JP 2005189800 A JP2005189800 A JP 2005189800A JP 2005189800 A JP2005189800 A JP 2005189800A JP 4386863 B2 JP4386863 B2 JP 4386863B2
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JP
Japan
Prior art keywords
insulating layer
base
wiring
head
flexure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2005189800A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006260733A (ja
Inventor
肇 荒井
育男 染谷
隆一 川竹
司 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NHK Spring Co Ltd
Original Assignee
NHK Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NHK Spring Co Ltd filed Critical NHK Spring Co Ltd
Priority to JP2005189800A priority Critical patent/JP4386863B2/ja
Priority to CN2006100083461A priority patent/CN1825434B/zh
Priority to US11/359,981 priority patent/US7692899B2/en
Publication of JP2006260733A publication Critical patent/JP2006260733A/ja
Application granted granted Critical
Publication of JP4386863B2 publication Critical patent/JP4386863B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B21/00Head arrangements not specific to the method of recording or reproducing
    • G11B21/16Supporting the heads; Supporting the sockets for plug-in heads
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/10Structure or manufacture of housings or shields for heads
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4853Constructional details of the electrical connection between head and arm
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0254High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257Overvoltage protection
    • H05K1/0259Electrostatic discharge [ESD] protection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
JP2005189800A 2005-02-21 2005-06-29 ヘッド・サスペンション Active JP4386863B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005189800A JP4386863B2 (ja) 2005-02-21 2005-06-29 ヘッド・サスペンション
CN2006100083461A CN1825434B (zh) 2005-02-21 2006-02-17 磁头悬挂装置
US11/359,981 US7692899B2 (en) 2005-02-21 2006-02-21 Head suspension having wiring disposed in contact with slightly conductive flexible resin

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005044753 2005-02-21
JP2005189800A JP4386863B2 (ja) 2005-02-21 2005-06-29 ヘッド・サスペンション

Publications (2)

Publication Number Publication Date
JP2006260733A JP2006260733A (ja) 2006-09-28
JP4386863B2 true JP4386863B2 (ja) 2009-12-16

Family

ID=36914192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005189800A Active JP4386863B2 (ja) 2005-02-21 2005-06-29 ヘッド・サスペンション

Country Status (3)

Country Link
US (1) US7692899B2 (zh)
JP (1) JP4386863B2 (zh)
CN (1) CN1825434B (zh)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4326484B2 (ja) * 2005-02-21 2009-09-09 日本発條株式会社 ヘッドサスペンション
JP4386863B2 (ja) 2005-02-21 2009-12-16 日本発條株式会社 ヘッド・サスペンション
JP4187757B2 (ja) * 2006-06-22 2008-11-26 日東電工株式会社 配線回路基板
JP4916235B2 (ja) * 2006-06-29 2012-04-11 日東電工株式会社 配線回路基板
JP4919727B2 (ja) * 2006-08-04 2012-04-18 日東電工株式会社 配線回路基板
JP4923295B2 (ja) * 2006-09-13 2012-04-25 株式会社東芝 サスペンション装置
JP4834593B2 (ja) * 2007-03-30 2011-12-14 日本発條株式会社 ディスク装置用サスペンション
CN102290054B (zh) * 2007-04-18 2014-12-24 大日本印刷株式会社 悬浮臂用基板、其制备方法、磁头悬浮臂和硬盘驱动器
US7986494B2 (en) * 2007-05-04 2011-07-26 Hutchinson Technology Incorporated Integrated lead head suspension with tapered trace spacing
JP4938551B2 (ja) * 2007-05-21 2012-05-23 日本発條株式会社 配線付きフレキシャ、配線付きフレキシャの製造方法、及びヘッドサスペンション
JP4887232B2 (ja) * 2007-07-24 2012-02-29 日東電工株式会社 配線回路基板の製造方法
KR20090084512A (ko) * 2008-02-01 2009-08-05 삼성전자주식회사 서스펜션 인터커넥트 및 이를 구비한 hga
US8169746B1 (en) 2008-04-08 2012-05-01 Hutchinson Technology Incorporated Integrated lead suspension with multiple trace configurations
US8885299B1 (en) 2010-05-24 2014-11-11 Hutchinson Technology Incorporated Low resistance ground joints for dual stage actuation disk drive suspensions
US8758910B2 (en) * 2010-06-29 2014-06-24 Dai Nippon Printing Co., Ltd. Substrate for suspension, and production process thereof
WO2012057428A1 (ko) * 2010-10-25 2012-05-03 한국단자공업 주식회사 인쇄회로기판 및 이를 사용한 차량용 기판블록
JP6092505B2 (ja) * 2011-09-06 2017-03-08 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、ハードディスクドライブ、およびサスペンション用基板の製造方法
WO2013138619A1 (en) 2012-03-16 2013-09-19 Hutchinson Technology Incorporated Mid-loadbeam dual stage actuated (dsa) disk drive head suspension
US8861141B2 (en) 2012-08-31 2014-10-14 Hutchinson Technology Incorporated Damped dual stage actuation disk drive suspensions
WO2014043498A2 (en) 2012-09-14 2014-03-20 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions
JP6356682B2 (ja) 2012-10-10 2018-07-11 ハッチンソン テクノロジー インコーポレイテッドHutchinson Technology Incorporated 二段作動構造を有するサスペンション
US8941951B2 (en) 2012-11-28 2015-01-27 Hutchinson Technology Incorporated Head suspension flexure with integrated strain sensor and sputtered traces
US8891206B2 (en) 2012-12-17 2014-11-18 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffener
US8896969B1 (en) 2013-05-23 2014-11-25 Hutchinson Technology Incorporated Two-motor co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffeners
US8717712B1 (en) 2013-07-15 2014-05-06 Hutchinson Technology Incorporated Disk drive suspension assembly having a partially flangeless load point dimple
US8792214B1 (en) 2013-07-23 2014-07-29 Hutchinson Technology Incorporated Electrical contacts to motors in dual stage actuated suspensions
US8675314B1 (en) 2013-08-21 2014-03-18 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions with offset motors
US8896970B1 (en) 2013-12-31 2014-11-25 Hutchinson Technology Incorporated Balanced co-located gimbal-based dual stage actuation disk drive suspensions
US8867173B1 (en) 2014-01-03 2014-10-21 Hutchinson Technology Incorporated Balanced multi-trace transmission in a hard disk drive flexure
CN105469810B (zh) 2014-08-19 2019-04-09 新科实业有限公司 悬臂件及具有该悬臂件的磁头折片组合、硬盘驱动器
US9070392B1 (en) 2014-12-16 2015-06-30 Hutchinson Technology Incorporated Piezoelectric disk drive suspension motors having plated stiffeners
US9318136B1 (en) 2014-12-22 2016-04-19 Hutchinson Technology Incorporated Multilayer disk drive motors having out-of-plane bending
US9296188B1 (en) 2015-02-17 2016-03-29 Hutchinson Technology Incorporated Partial curing of a microactuator mounting adhesive in a disk drive suspension
US9734852B2 (en) 2015-06-30 2017-08-15 Hutchinson Technology Incorporated Disk drive head suspension structures having improved gold-dielectric joint reliability
US9646638B1 (en) 2016-05-12 2017-05-09 Hutchinson Technology Incorporated Co-located gimbal-based DSA disk drive suspension with traces routed around slider pad
JP2023031699A (ja) * 2021-08-25 2023-03-09 株式会社東芝 ディスク装置

Family Cites Families (26)

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Publication number Priority date Publication date Assignee Title
JP2934126B2 (ja) * 1993-08-10 1999-08-16 富士通株式会社 磁気ディスク装置用の磁気ヘッドユニット
JPH08111015A (ja) * 1994-09-01 1996-04-30 Tdk Corp 磁気ヘッドスライダの支持装置及び磁気ヘッド装置
US5644454A (en) * 1996-03-11 1997-07-01 International Business Machines Corporation Electrostatic discharge protection system for MR heads
JP3206428B2 (ja) 1996-04-09 2001-09-10 ティーディーケイ株式会社 ヘッドジンバルアセンブリを具備するハードディスク装置
US5805382A (en) * 1996-06-21 1998-09-08 International Business Machines Corporation Integrated conductor magnetic recording head and suspension having cross-over integrated circuits for noise reduction
JP2001291215A (ja) 2000-04-07 2001-10-19 Alps Electric Co Ltd 磁気ヘッド装置及びその実装方法
US6700748B1 (en) * 2000-04-28 2004-03-02 International Business Machines Corporation Methods for creating ground paths for ILS
US6487048B1 (en) * 2000-07-18 2002-11-26 International Business Machines Corporation Conductive coating of flexible circuits for ils transmission lines
US6927951B2 (en) * 2001-03-09 2005-08-09 Seagate Technology Llc Flex on suspension with dissipative polymer substrate acting as bleed resistor for minimizing ESD damage
JP3790696B2 (ja) * 2001-03-16 2006-06-28 アルプス電気株式会社 磁気ヘッド
US6459043B1 (en) * 2001-03-29 2002-10-01 3M Innovative Properties Company Flexible circuit with electrostatic damage limiting feature and method of manufacture
US6815620B2 (en) * 2001-03-29 2004-11-09 3M Innovative Properties Company Flexible circuit with electrostatic damage limiting feature
JP4610841B2 (ja) 2001-04-18 2011-01-12 大日本印刷株式会社 磁気ヘッドサスペンションおよびその製造方法
JP4269132B2 (ja) 2001-06-27 2009-05-27 日本発條株式会社 ディスクドライブ用サスペンション
JP4074978B2 (ja) * 2001-10-15 2008-04-16 アキレス株式会社 中継フレキシブルプリント回路基板
US6943302B2 (en) * 2002-01-07 2005-09-13 Achilles Corporation Flexible printed circuit board
JP3837702B2 (ja) 2002-01-07 2006-10-25 アキレス株式会社 フレキシブルプリント回路基板
US6942824B1 (en) * 2002-05-22 2005-09-13 Western Digital (Fremont), Inc. UV curable and electrically conductive adhesive for bonding magnetic disk drive components
CN100375152C (zh) * 2002-10-15 2008-03-12 新科实业有限公司 用于磁头组件的导电粘合剂
JP2004139687A (ja) 2002-10-18 2004-05-13 Alps Electric Co Ltd ヘッドジンバルアッセンブリ及びその製造方法
US6801402B1 (en) * 2002-10-31 2004-10-05 Western Digital Technologies, Inc. ESD-protected head gimbal assembly for use in a disk drive
JP2004192672A (ja) 2002-12-09 2004-07-08 Matsushita Electric Ind Co Ltd 磁気ヘッドアッセンブリ
JP3908706B2 (ja) * 2003-09-05 2007-04-25 アルプス電気株式会社 磁気ヘッド装置の製造方法
US7489493B2 (en) * 2003-12-01 2009-02-10 Magnecomp Corporation Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material
JP4326484B2 (ja) * 2005-02-21 2009-09-09 日本発條株式会社 ヘッドサスペンション
JP4386863B2 (ja) 2005-02-21 2009-12-16 日本発條株式会社 ヘッド・サスペンション

Also Published As

Publication number Publication date
US7692899B2 (en) 2010-04-06
CN1825434B (zh) 2011-01-12
JP2006260733A (ja) 2006-09-28
US20060190673A1 (en) 2006-08-24
CN1825434A (zh) 2006-08-30

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