JP4375968B2 - 導電性シリコーンおよびその製造方法 - Google Patents
導電性シリコーンおよびその製造方法 Download PDFInfo
- Publication number
- JP4375968B2 JP4375968B2 JP2002580347A JP2002580347A JP4375968B2 JP 4375968 B2 JP4375968 B2 JP 4375968B2 JP 2002580347 A JP2002580347 A JP 2002580347A JP 2002580347 A JP2002580347 A JP 2002580347A JP 4375968 B2 JP4375968 B2 JP 4375968B2
- Authority
- JP
- Japan
- Prior art keywords
- organopolysiloxane
- represented
- less
- conductive
- cured silicone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28202701P | 2001-04-06 | 2001-04-06 | |
| PCT/US2002/012765 WO2002082468A1 (en) | 2001-04-06 | 2002-04-05 | Electrically conductive silicones and method of manufacture thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004533501A JP2004533501A (ja) | 2004-11-04 |
| JP2004533501A5 JP2004533501A5 (OSRAM) | 2008-01-10 |
| JP4375968B2 true JP4375968B2 (ja) | 2009-12-02 |
Family
ID=23079779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002580347A Expired - Lifetime JP4375968B2 (ja) | 2001-04-06 | 2002-04-05 | 導電性シリコーンおよびその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6902688B2 (OSRAM) |
| EP (1) | EP1399928B1 (OSRAM) |
| JP (1) | JP4375968B2 (OSRAM) |
| CN (1) | CN1273994C (OSRAM) |
| WO (1) | WO2002082468A1 (OSRAM) |
Families Citing this family (87)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040092655A1 (en) * | 2001-04-02 | 2004-05-13 | Takayoshi Otomo | Mouldable silicone gel compositions |
| US20030213939A1 (en) * | 2002-04-01 | 2003-11-20 | Sujatha Narayan | Electrically conductive polymeric foams and elastomers and methods of manufacture thereof |
| US6783692B2 (en) * | 2002-10-17 | 2004-08-31 | Dow Corning Corporation | Heat softening thermally conductive compositions and methods for their preparation |
| US7135767B2 (en) * | 2003-07-29 | 2006-11-14 | Agilent Technologies, Inc. | Integrated circuit substrate material and method |
| JP2005286195A (ja) * | 2004-03-30 | 2005-10-13 | Geltec Co Ltd | 押出し可能な架橋済グリース状電磁波吸収材、これを充填・封入した容器、その容器の製法、及びこれらを利用した電磁波吸収方法 |
| US8715533B2 (en) | 2004-12-17 | 2014-05-06 | Asahi R&D Co., Ltd. | Dielectric raw material, antenna device, portable phone and electromagnetic wave shielding body |
| EP1829933B1 (en) * | 2004-12-17 | 2015-07-22 | ASAHI FR R&D Co., Ltd. | Method of controlling specific inductive capacity, dielectric material, mobile phone and human phantom model |
| US8092910B2 (en) | 2005-02-16 | 2012-01-10 | Dow Corning Toray Co., Ltd. | Reinforced silicone resin film and method of preparing same |
| ATE551398T1 (de) | 2005-02-16 | 2012-04-15 | Dow Corning | Verstärkte silikonharzfolie und herstellungsverfahren dafür |
| EP1708317A3 (de) | 2005-03-29 | 2007-11-14 | Karl Ronald Schoeller | Rollband-Kontakt-Einheit zur permanenten oder bewegungsabhängig intermittierenden galvanischen Verbindung zweier Systeme |
| ES2412379T3 (es) | 2005-04-25 | 2013-07-11 | G&G Biotechnology Ltd. | Dispositivo protésico implantable ligero. |
| US20090162596A1 (en) * | 2005-08-02 | 2009-06-25 | World Properties, Inc. | Silicone compositions, methods of manufacture, and articles formed therefrom |
| US20100183814A1 (en) * | 2005-08-02 | 2010-07-22 | Victor Rios | Silicone compositions, methods of manufacture, and articles formed therefrom |
| US20090162651A1 (en) * | 2005-08-02 | 2009-06-25 | World Properties, Inc. | Silicone compositions, methods of manufacture, and articles formed therefrom |
| WO2007018756A1 (en) | 2005-08-04 | 2007-02-15 | Dow Corning Corporation | Reinforced silicone resin film and method of preparing same |
| US7589284B2 (en) * | 2005-09-12 | 2009-09-15 | Parker Hannifin Corporation | Composite polymeric material for EMI shielding |
| EP1924631A4 (en) * | 2005-09-16 | 2012-03-07 | Hyperion Catalysis Int | CONDUCTIVE SILICONES AND PROCESS FOR PREPARING THE SAME |
| ATE517947T1 (de) * | 2005-12-21 | 2011-08-15 | Dow Corning | Silikonharzfilm, herstellungsverfahren dafür und nanomaterialgefüllte silikonzusammensetzung |
| KR101426316B1 (ko) | 2006-01-19 | 2014-08-06 | 다우 코닝 코포레이션 | 실리콘 수지 필름, 이의 제조방법, 및 나노물질로 충전된실리콘 조성물 |
| CN101379153B (zh) * | 2006-02-02 | 2011-12-28 | 陶氏康宁公司 | 有机硅树脂膜,其制备方法和纳米材料填充的有机硅组合物 |
| US8084097B2 (en) | 2006-02-20 | 2011-12-27 | Dow Corning Corporation | Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition |
| EP2066757A1 (en) * | 2006-10-05 | 2009-06-10 | Dow Corning Corporation | Silicone resin film and method of preparing same |
| CN101595166A (zh) * | 2007-02-06 | 2009-12-02 | 陶氏康宁公司 | 有机硅树脂、有机硅组合物、涂覆基材和增强有机硅树脂膜 |
| ATE474876T1 (de) * | 2007-02-22 | 2010-08-15 | Dow Corning | Verfahren zur herstellung leitfähiger folien sowie in diesem verfahren hergestellte artikel |
| CN101627096B (zh) * | 2007-02-22 | 2012-11-07 | 道康宁公司 | 增强硅树脂膜及其制备方法 |
| US20100087581A1 (en) * | 2007-02-22 | 2010-04-08 | Mark Fisher | Reinforced Silicone Resin Film and Method of Preparing Same |
| CN101636270B (zh) * | 2007-02-22 | 2012-07-04 | 道康宁公司 | 增强硅树脂膜 |
| WO2008103228A1 (en) * | 2007-02-22 | 2008-08-28 | Dow Corning Corporation | Reinforced silicone resin films |
| US20100143686A1 (en) * | 2007-05-01 | 2010-06-10 | Bizhong Zhu | Nanomaterial-Filled Silicone Composition and Reinforced Silicone Resin Film |
| KR20100017503A (ko) * | 2007-05-01 | 2010-02-16 | 다우 코닝 코포레이션 | 강화 실리콘 수지 필름 |
| EP2201063B1 (en) * | 2007-10-12 | 2011-07-06 | Dow Corning Corporation | Reinforced silicone resin film and nanofiber-filled silicone composition |
| CN101412851B (zh) * | 2008-11-25 | 2011-10-05 | 上海市合成树脂研究所 | 一种有机硅导电胶 |
| US20120012382A1 (en) * | 2009-05-13 | 2012-01-19 | Laird Technologies, Inc. | Conductive Films for EMI Shielding Applications |
| EP2464706B1 (en) * | 2009-08-12 | 2015-09-02 | Parker Hannifin Corp. | Fully-cured thermally or electrically-conductive form-in-place gap filler |
| LT2525839T (lt) * | 2010-01-18 | 2018-11-12 | G&G Biotechnology Ltd | Mažo svorio krūtų implantų medžiaga |
| US8355770B2 (en) * | 2010-03-22 | 2013-01-15 | Idt Technology Limited | Conductive silicone material for human skin electrode |
| US8766108B2 (en) | 2010-08-30 | 2014-07-01 | Parker Hannifin Corporation | Encapsulated expanded crimped metal mesh for sealing and EMI shielding applications |
| US8759692B2 (en) | 2010-08-30 | 2014-06-24 | Parker-Hannifin Corporation | Encapsulated expanded crimped metal mesh for sealing, EMI shielding and lightning strike applications |
| US9049777B2 (en) * | 2010-11-01 | 2015-06-02 | Plastics Research Corporation | EMI shielded thermoset article |
| CN102276988B (zh) * | 2011-06-08 | 2012-10-31 | 北京工业大学 | 一种单组份Ni-C填充型FIP热硫化高导电硅橡胶及其制备方法 |
| JP5872440B2 (ja) * | 2012-02-13 | 2016-03-01 | Dowaエレクトロニクス株式会社 | 球状銀粉およびその製造方法 |
| RU2522614C2 (ru) * | 2012-07-11 | 2014-07-20 | Федеральное государственное унитарное предприятие "Государственный ордена Трудового Красного Знамени научно-исследовательский институт химии и технологии элементоорганических соединений" (ФГУП "ГНИИХТЭОС") | Способ улучшения адгезии к металлам силиконовых композиционных материалов, получаемых по реакции полиприсоединения |
| DE102012220700A1 (de) * | 2012-11-13 | 2014-05-15 | Wacker Chemie Ag | Füllstoffhaltige Siliconzusammensetzungen |
| JPWO2014080789A1 (ja) * | 2012-11-20 | 2017-01-05 | 横浜ゴム株式会社 | 低温焼成用導電性組成物および太陽電池セル |
| CN104854176B (zh) * | 2012-12-20 | 2017-06-06 | 道康宁公司 | 可固化有机硅组合物、导电有机硅粘合剂、制备及使用它们的方法以及包含它们的电气装置 |
| JP6416188B2 (ja) * | 2013-03-14 | 2018-10-31 | ダウ シリコーンズ コーポレーション | 硬化性シリコーン組成物、導電性シリコーン粘着剤、これらの製造及び使用方法、並びにこれらを含有する電気デバイス |
| WO2014150302A1 (en) * | 2013-03-14 | 2014-09-25 | Dow Corning Corporation | Conductive silicone materials and uses |
| CN103289410A (zh) * | 2013-05-22 | 2013-09-11 | 吴江市德佐日用化学品有限公司 | 一种具有低压缩永久变形特性的导电硅橡胶 |
| CN103351839A (zh) * | 2013-07-23 | 2013-10-16 | 上海魁固塑胶制品有限公司 | 单组分脱胺型高导电硅橡胶及其制备方法 |
| EP3059286B1 (en) * | 2013-10-17 | 2020-08-26 | Shin-Etsu Chemical Co., Ltd. | Silicone gel composition, and silicone gel cured product |
| AR099038A1 (es) | 2014-01-08 | 2016-06-22 | General Cable Tech Corp | Conductor aéreo recubierto |
| KR101640218B1 (ko) * | 2014-06-26 | 2016-07-18 | 파낙스 이텍(주) | 전도성 실리콘 수지 조성물 및 이로부터 제조된 전자파 차폐용 가스켓 |
| BR112017002151A2 (pt) * | 2014-08-05 | 2018-07-03 | Gen Cable Technologies Corp | revestimentos de fluoro copolímeros para condutores aéreos |
| WO2016142949A1 (en) | 2015-03-12 | 2016-09-15 | G & G Biotechnology Ltd. | Composite implant material |
| WO2017083689A1 (en) | 2015-11-13 | 2017-05-18 | General Cable Technologies Corporation | Cables coated with fluorocopolymer coatings |
| TWI790785B (zh) | 2016-05-31 | 2023-01-21 | 美商安芬諾股份有限公司 | 電終端、纜線總成以及纜線端接方法 |
| CN106085341B (zh) * | 2016-06-12 | 2019-01-11 | 江苏明昊新材料科技股份有限公司 | 单组分硅酮导电银胶及其制备方法 |
| CN106085340B (zh) * | 2016-06-12 | 2019-01-11 | 江苏明昊新材料科技股份有限公司 | 具有触变特性的高导热导电银胶及其制备方法 |
| US10191519B2 (en) * | 2016-09-19 | 2019-01-29 | Google Llc | Electronic device with gasket sealing receptacle for tongue |
| EP3528967B1 (en) * | 2016-10-24 | 2023-06-21 | Luxembourg Institute of Science and Technology (LIST) | Method for forming an electrically conductive multilayer coating with anti-corrosion properties onto a metallic substrate |
| CN108117757B (zh) * | 2016-11-28 | 2021-06-04 | 天迈科技股份有限公司 | 具有导电与防水特性的多功能胶体 |
| US10640232B2 (en) * | 2016-12-20 | 2020-05-05 | The Boeing Company | Conductive fastening system for composite structures |
| US10944214B2 (en) | 2017-08-03 | 2021-03-09 | Amphenol Corporation | Cable connector for high speed interconnects |
| CN107364065B (zh) * | 2017-08-14 | 2023-11-28 | 深圳市康利邦科技有限公司 | 曲面玻璃屏保护膜的一体成型加工工艺及其保护膜 |
| WO2019112228A1 (ko) * | 2017-12-08 | 2019-06-13 | 주식회사 엘지화학 | 전도성 실리콘 조성물 및 이에 의해 제조된 실리콘 복합재 |
| WO2019135969A1 (en) * | 2018-01-03 | 2019-07-11 | Texting Tip LLC | Fingernail tip stylus |
| WO2019159182A1 (en) | 2018-02-18 | 2019-08-22 | G & G Biotechnology Ltd. | Implants with enhanced shell adhesion |
| LU100768B1 (en) * | 2018-04-18 | 2019-10-22 | Luxembourg Inst Science & Tech List | Method for forming an electrically conductive multilayer coating with anti-corrosion properties onto a metallic substrate |
| KR102540533B1 (ko) * | 2018-06-01 | 2023-06-07 | 현대자동차주식회사 | 열전도성이 우수한 경량 고분자 조성물과 그 제조방법 및 이 조성물을 이용하여 제조한 물품 |
| CN109054729A (zh) * | 2018-07-17 | 2018-12-21 | 泰州隆基乐叶光伏科技有限公司 | 一种湿/热双固化的导电胶及其制备方法 |
| US12022642B2 (en) | 2018-08-21 | 2024-06-25 | Laird Technologies, Inc. | Patterned electromagnetic interference (EMI) mitigation materials including carbon nanotubes |
| WO2020061988A1 (en) | 2018-09-28 | 2020-04-02 | Dow Silicones Corporation | Liquid silicone rubber composition |
| KR20210107778A (ko) | 2018-12-26 | 2021-09-01 | 모멘티브 퍼포먼스 머티리얼즈 인크. | 경화성 실리콘 기반 조성물 및 그 용도 |
| CN113366044A (zh) | 2018-12-26 | 2021-09-07 | 迈图高新材料公司 | 基于有机硅的固化性组合物和其应用 |
| JP2022536228A (ja) * | 2018-12-26 | 2022-08-15 | モメンティブ パフォーマンス マテリアルズ インコーポレイテッド | 硬化性シリコーンベースの組成物およびその用途 |
| US11137014B2 (en) | 2019-01-08 | 2021-10-05 | The Boeing Company | Conductive fastening system and method for improved EME performance |
| WO2020172395A1 (en) | 2019-02-22 | 2020-08-27 | Amphenol Corporation | High performance cable connector assembly |
| CN110294940A (zh) * | 2019-06-28 | 2019-10-01 | 深圳市飞荣达科技股份有限公司 | 屏蔽衬垫及其制备方法 |
| CN113511146A (zh) * | 2020-04-09 | 2021-10-19 | 莱尔德技术股份有限公司 | 电磁干扰emi吸收体、雷达支架、汽车和汽车部件 |
| US11454661B2 (en) | 2020-11-05 | 2022-09-27 | Amplifier Research Corp. | Field probe |
| DE112021006322T5 (de) | 2020-12-04 | 2023-09-14 | Rogers Corporation | Mehrschichtfolie zur verhinderung des thermischen durchgehens |
| CN112940510A (zh) * | 2021-03-11 | 2021-06-11 | 广东思泉新材料股份有限公司 | 一种基于泡沫金属的三维骨架结构的致密导热硅胶复合材料及其制备方法 |
| US12453500B2 (en) * | 2021-05-11 | 2025-10-28 | Purdue Research Foundation | Poroelastic materials, biosensors comprising poroelastic materials, and methods of making and using poroelastic materials and biosensors |
| CN113338050A (zh) * | 2021-06-07 | 2021-09-03 | 深圳先进电子材料国际创新研究院 | 一种耐高温金属化纤维布和导电硅胶复合材料及其制备方法和smt方面的用途 |
| EP4426774A1 (en) | 2021-11-01 | 2024-09-11 | Rogers Corporation | Filled silicone foam layer, compositions and methods for their manufacture, and articles including the filled silicone foam layer |
| CN115260985A (zh) * | 2022-08-26 | 2022-11-01 | 韦尔通(厦门)科技股份有限公司 | 一种双组份低粘度高导热灌封胶及其制备方法和应用 |
| US12300888B2 (en) | 2023-02-02 | 2025-05-13 | Microsonic, Inc. | System and method for attenuating radiation emissions from earpiece devices |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3583930A (en) | 1968-04-16 | 1971-06-08 | Chomerics Inc | Plastics made conductive with coarse metal fillers |
| US4011360A (en) | 1974-04-10 | 1977-03-08 | Chomerics, Inc. | Electrically conductive silicone rubber stock |
| US4279783A (en) | 1979-04-04 | 1981-07-21 | Dow Corning Corporation | Electrically conductive silicone elastomers |
| JPS59199756A (ja) | 1983-04-27 | 1984-11-12 | Toshiba Silicone Co Ltd | 導電性シリコ−ンゴム組成物 |
| JPS63117065A (ja) | 1986-11-05 | 1988-05-21 | Toshiba Silicone Co Ltd | 室温硬化型導電性シリコ−ンゴム組成物 |
| JPS63251464A (ja) | 1987-04-08 | 1988-10-18 | Toray Silicone Co Ltd | 導電性シリコ−ンゴム粒状物 |
| JP2618663B2 (ja) | 1987-11-30 | 1997-06-11 | 東レ・ダウコーニング・シリコーン株式会社 | 磁性シリコーンゴム粉状物の製造方法 |
| US5075038A (en) | 1988-11-04 | 1991-12-24 | Dow Corning Corporation | Electrically conductive silicone compositions |
| CA2000787A1 (en) | 1988-11-04 | 1990-05-04 | Richard L. Cole | Electrically conductive silicone compositions |
| JPH05325647A (ja) | 1991-03-29 | 1993-12-10 | Siegel:Kk | シリコーンゲル多孔質導電体並びにその製造方法 |
| JP3084380B2 (ja) | 1991-06-06 | 2000-09-04 | 株式会社ジェルテック | 導電性シリコーンゲル材の使用方法と改質方法 |
| US5182050A (en) | 1991-10-24 | 1993-01-26 | Amp Incorporated | Extrinsically/intrinsically conductive gel |
| JP3318338B2 (ja) | 1992-02-28 | 2002-08-26 | 東レ・ダウコーニング・シリコーン株式会社 | 導電性ポリオルガノシロキサン組成物の製造方法 |
| JPH05271548A (ja) * | 1992-03-27 | 1993-10-19 | Shin Etsu Chem Co Ltd | オルガノポリシロキサン組成物及びその硬化物の形成方法 |
| US5366664A (en) | 1992-05-04 | 1994-11-22 | The Penn State Research Foundation | Electromagnetic shielding materials |
| DE4320527A1 (de) | 1992-06-22 | 1993-12-23 | Whitaker Corp | Elektrisch leitfähiges Gel |
| JPH06144951A (ja) | 1992-11-11 | 1994-05-24 | Hiroyuki Kobayashi | セラミックス発泡体とその製造方法 |
| CA2129073C (en) | 1993-09-10 | 2007-06-05 | John P. Kalinoski | Form-in-place emi gaskets |
| US5498644A (en) | 1993-09-10 | 1996-03-12 | Specialty Silicone Products, Inc. | Silcone elastomer incorporating electrically conductive microballoons and method for producing same |
| JP2868986B2 (ja) | 1993-10-06 | 1999-03-10 | 東レ・ダウコーニング・シリコーン株式会社 | 導電性シリコーンゴム組成物 |
| JP2819444B2 (ja) * | 1993-11-08 | 1998-10-30 | 東レ・ダウコーニング・シリコーン株式会社 | 導電性シリコーンゴム組成物 |
| US5910524A (en) | 1995-01-20 | 1999-06-08 | Parker-Hannifin Corporation | Corrosion-resistant, form-in-place EMI shielding gasket |
| JP3950493B2 (ja) * | 1996-04-26 | 2007-08-01 | 東レ・ダウコーニング株式会社 | 導電性シリコーンゴム組成物、半導体装置の製造方法およびその半導体装置 |
| JP3436464B2 (ja) | 1996-10-31 | 2003-08-11 | 東レ・ダウコーニング・シリコーン株式会社 | 付加反応硬化型導電性シリコーン組成物および導電性シリコーン硬化物の製造方法 |
| US5928569A (en) | 1997-02-26 | 1999-07-27 | Specialty Silicone Products, Inc. | Substantially uniform moldable blends of silver particulate and organopolysiloxane |
| US6017587A (en) | 1998-07-09 | 2000-01-25 | Dow Corning Corporation | Electrically conductive silicone compositions |
| JP3922332B2 (ja) | 2000-01-17 | 2007-05-30 | 信越化学工業株式会社 | 導電性液状シリコーンゴム組成物 |
| JP3810976B2 (ja) * | 2000-02-15 | 2006-08-16 | 株式会社小糸製作所 | 自動車用赤外光照射ランプ |
-
2002
- 2002-04-05 JP JP2002580347A patent/JP4375968B2/ja not_active Expired - Lifetime
- 2002-04-05 US US10/117,439 patent/US6902688B2/en not_active Expired - Lifetime
- 2002-04-05 EP EP02764008A patent/EP1399928B1/en not_active Expired - Lifetime
- 2002-04-05 CN CNB028097580A patent/CN1273994C/zh not_active Expired - Lifetime
- 2002-04-05 WO PCT/US2002/012765 patent/WO2002082468A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002082468A1 (en) | 2002-10-17 |
| US6902688B2 (en) | 2005-06-07 |
| EP1399928A1 (en) | 2004-03-24 |
| EP1399928B1 (en) | 2012-06-13 |
| CN1528000A (zh) | 2004-09-08 |
| JP2004533501A (ja) | 2004-11-04 |
| US20030047718A1 (en) | 2003-03-13 |
| CN1273994C (zh) | 2006-09-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4375968B2 (ja) | 導電性シリコーンおよびその製造方法 | |
| US5075038A (en) | Electrically conductive silicone compositions | |
| JP3436464B2 (ja) | 付加反応硬化型導電性シリコーン組成物および導電性シリコーン硬化物の製造方法 | |
| JP4917164B2 (ja) | 電力ケーブル部材 | |
| JP6662458B2 (ja) | 熱伝導性シリコーンゴム複合シート | |
| CN114729193B (zh) | 热传导性硅酮组合物和热传导性硅酮片材 | |
| EP3951862A1 (en) | Multicomponent type thermally conductive silicone gel composition, thermally conductive member and heat dissipation structure | |
| TWI596167B (zh) | 導電性電路描繪用油墨組成物,導電性電路形成方法及藉此方法所形成之導電性電路 | |
| WO2020100439A1 (ja) | 導電性シリコーン組成物、硬化物、積層体、及び、電子回路 | |
| CA2457937A1 (en) | Preparation of a conductive liquid silicone rubber composition | |
| JP2020115475A (ja) | 導電性ペースト | |
| TW202134396A (zh) | 導熱性矽酮樹脂組成物、硬化物及導熱性矽酮散熱片材 | |
| EP0367562B1 (en) | Electrically conductive silicone compositions | |
| JP2017082125A (ja) | 導電性樹脂組成物、配線、配線基板および電子装置 | |
| JP6217303B2 (ja) | 導電性シリコーンゴム製電極パターンの作製方法並びにオールシリコーンゴム製静電チャック及びその製造方法 | |
| KR102416096B1 (ko) | 열전도성 시트 | |
| JP2020079413A (ja) | 絶縁性ペースト | |
| JP2006182823A (ja) | 高電圧電気絶縁性シリコーンゴム用組成物、高電圧電気絶縁性シリコーンゴム組成物および高電圧電気絶縁体 | |
| TWI834860B (zh) | 熱傳導性矽氧組成物、半導體裝置及其製造方法 | |
| JP3664811B2 (ja) | 導電性シリコーンゴム組成物および導電性シリコーンゴム | |
| JPH08120176A (ja) | 半導電性シリコーンゴム組成物 | |
| KR20150072426A (ko) | 충전제 함유 실리콘 조성물 | |
| JP4840560B2 (ja) | 導電性ローラ及びそのシリコーンゴム弾性層と表層との接着性を向上する方法 | |
| JP2016219732A (ja) | 熱伝導性複合シリコーンゴムシート | |
| JP2640480B2 (ja) | シリコーンゴム組成物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050331 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070821 |
|
| A524 | Written submission of copy of amendment under article 19 pct |
Free format text: JAPANESE INTERMEDIATE CODE: A524 Effective date: 20071116 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080318 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080715 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20080728 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081104 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20081112 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090428 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090708 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090901 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090908 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4375968 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120918 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130918 Year of fee payment: 4 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |