JP4372065B2 - 無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜 - Google Patents

無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜 Download PDF

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Publication number
JP4372065B2
JP4372065B2 JP2005234548A JP2005234548A JP4372065B2 JP 4372065 B2 JP4372065 B2 JP 4372065B2 JP 2005234548 A JP2005234548 A JP 2005234548A JP 2005234548 A JP2005234548 A JP 2005234548A JP 4372065 B2 JP4372065 B2 JP 4372065B2
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JP
Japan
Prior art keywords
silicone resin
polyimide silicone
resin composition
group
solvent
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Expired - Fee Related
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JP2005234548A
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English (en)
Japanese (ja)
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JP2006104447A (ja
Inventor
善紀 米田
道博 菅生
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP2005234548A priority Critical patent/JP4372065B2/ja
Priority to EP05077027A priority patent/EP1634907B1/en
Priority to DE602005005588T priority patent/DE602005005588T2/de
Priority to TW094130944A priority patent/TW200615281A/zh
Priority to KR1020050083622A priority patent/KR101135772B1/ko
Priority to US11/221,897 priority patent/US7432313B2/en
Publication of JP2006104447A publication Critical patent/JP2006104447A/ja
Application granted granted Critical
Publication of JP4372065B2 publication Critical patent/JP4372065B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2005234548A 2004-09-09 2005-08-12 無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜 Expired - Fee Related JP4372065B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2005234548A JP4372065B2 (ja) 2004-09-09 2005-08-12 無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜
EP05077027A EP1634907B1 (en) 2004-09-09 2005-09-06 Solvent-free polymide silicone resin composition and a cured resin film thereof
DE602005005588T DE602005005588T2 (de) 2004-09-09 2005-09-06 Lösemittelfreie Polyimid-Silikonharz-Zusammensetzung und mittels Vernetzung dergleichen hergestellter Film
TW094130944A TW200615281A (en) 2004-09-09 2005-09-08 Solvent-free polyimide silicone resin composition and cured resin film thereof
KR1020050083622A KR101135772B1 (ko) 2004-09-09 2005-09-08 무용제형 폴리이미드 실리콘 수지 조성물 및 그의 경화수지 피막
US11/221,897 US7432313B2 (en) 2004-09-09 2005-09-09 Solvent-free polymide silicone resin composition and a cured resin film thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004262005 2004-09-09
JP2005234548A JP4372065B2 (ja) 2004-09-09 2005-08-12 無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜

Publications (2)

Publication Number Publication Date
JP2006104447A JP2006104447A (ja) 2006-04-20
JP4372065B2 true JP4372065B2 (ja) 2009-11-25

Family

ID=35427957

Family Applications (1)

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JP2005234548A Expired - Fee Related JP4372065B2 (ja) 2004-09-09 2005-08-12 無溶剤型ポリイミドシリコーン樹脂組成物及びその硬化樹脂皮膜

Country Status (6)

Country Link
US (1) US7432313B2 (OSRAM)
EP (1) EP1634907B1 (OSRAM)
JP (1) JP4372065B2 (OSRAM)
KR (1) KR101135772B1 (OSRAM)
DE (1) DE602005005588T2 (OSRAM)
TW (1) TW200615281A (OSRAM)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4602151B2 (ja) * 2004-04-22 2010-12-22 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物及びこれを用いた樹脂皮膜
WO2007052540A1 (ja) * 2005-11-01 2007-05-10 Jsr Corporation 感光性樹脂組成物
JP4771100B2 (ja) 2008-08-27 2011-09-14 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物及びその硬化物
JP5457051B2 (ja) * 2009-03-05 2014-04-02 新日鉄住金化学株式会社 位相差フィルム及びその製造方法
KR101588492B1 (ko) * 2009-12-22 2016-01-25 신닛테츠 수미킨 가가쿠 가부시키가이샤 폴리이미드 수지, 그 제조 방법, 접착제 수지 조성물, 커버레이 필름 및 회로 기판
TWI362398B (en) * 2009-12-31 2012-04-21 Ind Tech Res Inst Polyimide polymers for flexible electrical device substrate material and flexible electrical devices comprising the same
RU2414762C1 (ru) * 2010-03-26 2011-03-20 Федеральное государственное унитарное предприятие "Особое конструкторское бюро кабельной промышленности" Радиационно-сшиваемая композиция на основе фторуглеродного полимера
WO2014163100A1 (ja) * 2013-04-03 2014-10-09 日産化学工業株式会社 無溶剤型光硬化性樹脂組成物
US11997768B2 (en) 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
EP3266808B1 (en) 2015-03-05 2020-12-09 LG Chem, Ltd. Composition for polyimide film for flexible substrate of optoelectronic device
JP6763139B2 (ja) 2015-12-25 2020-09-30 信越化学工業株式会社 無溶剤型シリコーン変性ポリイミド樹脂組成物
JP2017222745A (ja) 2016-06-14 2017-12-21 信越化学工業株式会社 無溶剤型シリコーン変性ポリイミド樹脂組成物
US10982048B2 (en) * 2018-04-17 2021-04-20 Jiaxing Super Lighting Electric Appliance Co., Ltd Organosilicon-modified polyimide resin composition and use thereof
KR20230008696A (ko) * 2020-05-08 2023-01-16 세키스이가가쿠 고교가부시키가이샤 점착제 조성물, 점착 테이프, 및 전자 부품의 처리 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4499149A (en) * 1980-12-15 1985-02-12 M&T Chemicals Inc. Siloxane-containing polymers
JP3211108B2 (ja) * 1992-06-25 2001-09-25 チッソ株式会社 感光性樹脂組成物
JP3451128B2 (ja) 1994-03-31 2003-09-29 新日鐵化学株式会社 ポリイミド樹脂及び耐熱接着剤
JP2002012667A (ja) 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜
JP3865046B2 (ja) * 2001-05-08 2007-01-10 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物
WO2003038526A1 (fr) * 2001-10-30 2003-05-08 Kaneka Corporation Composition de resine photosensible et films et stratifies photosensibles ainsi obtenus
JP4204435B2 (ja) 2002-10-10 2009-01-07 信越化学工業株式会社 熱硬化性基を含有する透明ポリイミドシリコーン樹脂
DE60302853T2 (de) * 2002-10-10 2006-08-24 Shin-Etsu Chemical Co., Ltd. Farbloses und transparentes Polyimidsilikonharz mit wärmehärtenden funktionellen Gruppen

Also Published As

Publication number Publication date
EP1634907B1 (en) 2008-03-26
US20060052476A1 (en) 2006-03-09
TW200615281A (en) 2006-05-16
EP1634907A1 (en) 2006-03-15
TWI370138B (OSRAM) 2012-08-11
KR101135772B1 (ko) 2012-04-16
DE602005005588D1 (de) 2008-05-08
DE602005005588T2 (de) 2009-05-07
KR20060051106A (ko) 2006-05-19
JP2006104447A (ja) 2006-04-20
US7432313B2 (en) 2008-10-07

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